Etat de l`art des BGA plastique - CCT

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Etat de l`art des BGA plastique - CCT
Etat de l’art des BGA plastique
I T &S
A e r o s p a c e
D e f e n c e
Charles Le Coz
TRT Orsay
THALES Research & Technology
Séminaire CNES - 11/09/2003
Types de BGA plastique
Marché
Applications
Dimensions
Avantages et limitations
Evolutions
2
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This document and any data included are the property of THALES.
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Plan
Types de BGA plastique
Circuit intégré
Résine de surmoulage
Vias thermiques
Billes de brasure SnPb
PBGA “ full populated ”
PBGA “ depopulated ”
Capot collé
Séminaire CNES - 11/09/2003
Encapsulation Glob Top
Solder bumps
Dissipateur cuivre
Billes de brasure PbSn
SBGA = PBGA haute dissipation
3
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Flip-Chip BGA
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Substrat
d ’interconnexion
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Séminaire CNES - 11/09/2003
Flip-Chip BGA
Principale technologie utilisée pour les PBGA de plus de 600 E/S
4
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Types de BGA plastique (2) : les CSP
Flex tape
Die
Encapsulant
Solder balls
Wire bonding
Elastomer pad
Solder bumps
Tape
Ex: µBGA TESSERA
Séminaire CNES - 11/09/2003
Flex-circuit interposer
Leadframe type
5
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Substrate
Flip Chip
Rigid substrate
Wafer-level assembly
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Wires
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Séminaire CNES - 11/09/2003
Marché des boîtiers
DCA
6
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DIP
Séminaire CNES - 11/09/2003
Fonctions
PLD
7
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Nb d ’entrées/sorties
200 - 1700
1.0 mm
Microprocesseurs
300 - 400
1.27 & 1.0 mm
Mémoires, Logique
30 - 120
0.8 mm
Discrets, Ampli Op
4-8
0.5 mm
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Applications des boîtiers BGA
Pas typique
Séminaire CNES - 11/09/2003
Pin count
BGA
300
8
100
30
TQFP
TSSOP
Cost driven
THALES Research & Technology
BGA/CSP
CSP
Cost/performance driven Performance driven
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Domaine d ’application des BGA
3000
1000
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Séminaire CNES - 11/09/2003
Dimensions
9
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Avantages
Limitations
Grand nombre d ’E/S
Fragilité du boîtier au report (MSL)
Intégration
Performances électriques
et thermiques
Séminaire CNES - 11/09/2003
Coplanarité
10
Risque de déformation
grand boîtier (warpage)
Difficulté d ’inspection
Auto-alignement
Difficulté de réparation (rework)
Rendement fabrication (yield)
Complexité de la carte
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BGA : Avantages et limitations
11
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Séminaire CNES - 11/09/2003
Evolutions
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Evolutions (2)
Composition des billes de brasure
Température de fusion
SnPb
SnAgCu
183°C
217°C
« Green » = absence de Br, Sb, Cd,...
Séminaire CNES - 11/09/2003
Nouvelle résine de surmoulage
12
Tenue au report
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Coefficient de dilatation bas
Fragilisation due à la température,
bien que maintien des classifications
(typiquement MSL Niveau 3)
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