Document Template

Title: Required Information For Submitting
Databases to TELEDYNE DALSA Design &
Product Support.
Document Number: DES-0002.12
Creation date : December 22th, 2004
Bromont, Québec, Canada
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Database Submission Form
Please refer to DES-0001 “Terms and Conditions For Submitting Databases to
Product Foundry Support”, for more information.
TELEDYNE DALSA Design and
Company Name:
Contact Name:
Contact Phone Number:
Contact Email Address:
Alternate Contact Name:
Alternate Contact Phone Number:
Alternate Contact Email Address:
DALSA Process Family Used:
Technology Code:
Device
Code
GDSII File Name
Top Structure Name
Special Data Generation Required ?
If Yes, Please explain:
Yes/No
Magnification or Shrink Required?
If Yes, Please explain:
Yes/No
Layout orientation change required?
If Yes, Please explain:
Yes/No
Comments / Special Instructions
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
© Tous droits réservés 2013 / All rights reserved 2013 TELEDYNE DALSA
X (um)
Y (um)
Dimension
Dimension
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Note 6:
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Please provide the GDSII number(s), for each mask level or design aid layers in the tables below.
Please indicate if the mask(s) need to be made or revised, indicated the Yes or No in column “Revised”.
All GDSII numbers within the submitted database should be accounted for.
Use the table provided in Varia Layer Table to list any mask levels not present in the tables below or to list any
design aid layers which should be used by TELEDYNE DALSA to generate mask data.
If a TELEDYNE DALSA Design Kit needs to be used, consult the GDSII chapter in the User Guide document
for specific technology.
CMOS / HV CMOS Layer Table
Mask
Level
01
02
04
10
11
12
15
16
18
20
21
22
24
25
26
27
28
29
30
32
33
35
40
41
44
46
50
51
52
53
54
57
58
59
60
63
70
75
76
77
80
82
86
87
96
97
Description
GDSII
Number
Revised
(Yes / No)
Markeur
Zero
Clearout
Pwell
Nwell
Hv_Def
Isolate
Hvwell
Nbase
Active
Pfield
Nfield
Vtnaj
Vtpaj
Vtaj2
Cap_imp
Pbase
Capres
Gateply
Repair1
Pburied
Gateres
Nplus
Nextend
Nddd
Gateox
Pplus
Pextend
Ptop
Capply
Ntop
Silicide_block
Poly3
Pddd
Contact
Plug
Metal1
Sicr
Vias1
Metal2
Pads1
Pads2
Vias2
Metal3
Vias3
Metal4
© Tous droits réservés 2013 / All rights reserved 2013 TELEDYNE DALSA
Comments
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CCD Layer Table
Mask
Level
01
02
04
10
11
12
20
23
27
28
29
30
31
32
35
40
41
43
46
50
51
52
53
54
55
56
57
58
59
60
61
63
65
70
75
76
77
80
83
84
85
86
87
90
95
96
97
99
Description
GDSII
Number
Revised
(Yes / No)
Markeur
Zero
Clearout
Well1
Well2
Well3
Active
Poly0
Burch1
Burch2
Chan_st
Poly1
Ab_impl
Repair1
Poly1res
Sd_impl
Ppd1
Ppd2
Gateox
Ts_impl
Ppd3
Barrier1
Poly2
Nitrd3
Repair2
Barrier2
Bur_cont
Poly3
Nit_poly
Contact
Contact2
Plug
Repair3
Metal1
Metalres
Vias1
Metal2
Pads1
Green
Blue
Red
Vias2
Metal3
Flood
Microlen
Vias3
Antrefl
Pads2
© Tous droits réservés 2013 / All rights reserved 2013 TELEDYNE DALSA
Comments
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MEMS Layer Table
Mask
Level
1
2
3
4
5
6
10
11
12
15
16
17
18
19
20
21
24
25
26
27
28
29
30
31
32
33
34
35
36
37
39
40
41
42
43
45
47
48
50
52
53
54
58
60
61
70
75
76
77
80
82
85
86
Description
GDSII
Number
Revised
(Yes / No)
Marker1
Marker2
Marker3
Clearout
Marker4
Marker5
Pwell
Nwell
Hv_def
Isolate
Hvwell
Trench
Nitride0
Nitride1
Active
Pfield
Vtnaj
Vtpaj
Vtaj2
Trench2
Pbase
Capres
Gateply
Anchor0
Poly0
Pburied
Dimple
Gateres
Anchor1
Poly1
Polyvia1
Nplus
Nextend
Anchor2
Poly2
Polyvia2
Anchor3
Poly3
Pplus
Ptop
Capply
Bond_aj
Poly_res
Contact
Contact2
Metal1
Getter
Vias1
Metal2
Pads1
Pads2
Seal_ring
Vias2
© Tous droits réservés 2013 / All rights reserved 2013 TELEDYNE DALSA
Comments
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Mask
Level
87
94
95
96
97
99
Description
GDSII
Number
Revised
(Yes / No)
Comments
Metal3
Cap_cavity
Cavity
Vias3
Metal4
HF_shield
Varia Layer Table
Mask
Level
----
Description
GDSII
Number
Revised
(Yes / No)
Text
Junk
Cell boundary / Cell Outline
© Tous droits réservés 2013 / All rights reserved 2013 TELEDYNE DALSA
Comments