Microcapteurs de pression

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Microcapteurs de pression
par
E
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Ali BOUKABACHE
Maître de conférences à l’Institut d’électronique de l’Université de Constantine
Philippe MENINI
Maître de conférences à l’Université Toulouse 3
et
Patrick PONS
Laboratoire d’Analyse et d’Architecture des Systèmes du Centre National
de la Recherche Scientifique (LAAS-CNRS)
Références bibliographiques
[1]
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miniature capacitive pressure sensors with
square or rectangular diaphragm. Revue de
Physique Appliquée, 22, p. 505-510 (1987).
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[2]
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[3]
HOPPE (K.) et al. – Integrated Mach-Zehnder
interferometer pressure transducers. Transducers'95, Stockholm, 25-29 juin 1995.
[4]
WELHAM (C.J.) et al. – A lateral resonant pressure sensor fabricated via fusion bonding,
wafer thinning and reactive ion etching. Eurosensors XII, Southampton, 13-16 sept. 1998.
[5]
SVENSSON (L.) et al. – Surface micromachined technology applied to the fabrication of a
FET pressure sensor. MME'95, Copenhagen,
3-5 sept. 1995.
[11]
[12]
[13]
[6]
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[14]
[7]
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[15]
[8]
DIEM (B.) et al. – SOI SIMOX ; from bulk to
surface micromachining, a new age for silicon sensors and actuators. Sensors & actuators A46-47, p. 8-16 (1995).
[16]
KIIHAMAKI (J.) et al. – Deep silicon etching in
inductively coupled plasma reactor for
mems. Physica scripta. T, vol. 79, p. 250-254
(1999).
GUCKEL (R.). – Surface micromachined pressure transducers. Sensors & Actuators A28,
p. 133-146 (1991).
PEDERSEN (M.) et al. – An IC compatible
polyimide pressure sensor with capacitive
readout. Sensors & Actuators A63, p. 163-168
(1997).
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BOUKABACHE (A.) et al. – Study of the thermal drift of the offset voltage of silicon pressure sensor. ICECS’99, Phaphos (Grèce), 5-8
sept. 1999.
PUERS (R.). – Capacitive sensors : when and
how to use them. Sensors and Actuators
A37-38, p. 93-105 (1993).
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[17]
PUERS (R.) et al. – A capacitive pressure sensor with low impedance output and active
suppression of parasitic effects. Sensors and
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[18]
REY (P.) et al. – A high capacitive pressure
sensor array for fingerprint sensor application. Transducers 97, Chicago 16-19 juin
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[19]
GILLEO (K.) et al. – Towards a better understanding of underfill encapsulation for flip
chip technology : proposed developments
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[20]
MÉNINI (Ph.) et al. – Optimization of a BICMOS integrated transducer for self-compensated capacitive pressure sensor. ICECS'99,
Paphos (Grèce), 5-8 sept. 1999.
[21]
FLANDRE (D.) et al. – High-temperature characteristics of CMOS devices and circuits on
Silicon-on-Insulator (SOI) substrates. Proceedings of IX SBMICRO 94, Rio de Janeiro,
p. 777-786 (1994).
[22]
ELOY (J.C.) et al. – Micro Technologies –
Micro Systèmes : Marché mondial et position
de la France. Rapport de synthèse pour le
ministère de l'Industrie, CEA/LETI Bureau
d'étude Marketing, nov. 1995.
Adresses sur le WEB
Fabricants de microcapteurs de pression automobiles
Sensym :
http://www.sensym.com
Motorola :
http://www.motorola.com
Novasensor :
http://www.novasensor.com
Sensonor :
http://www.sensonor.com
Bosch :
http://www.bosch.de
Kistler :
http://www.kistler.fr
Druck :
http://www.druck.com
Kulite :
http://www.kulite.com
Texas Instrument :
http://www.ti.com
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est strictement interdite. − © Techniques de l’Ingénieur, traité Mesures et Contrôle
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