THE 9TH TECHNICAL AND SCIENTIFIC MEETING OF ARCSIS

THE 9 TH TECHNICAL AND SCIENTIFIC MEETING OF ARCSIS
“Sensitivity of Advanced Devices to Contamination”
STUniversity, Fuveau, France - November 16-17, 2006
9EMES RENCONTRES SCIENTIFIQUES ET TECHNIQUES
D’ARCSIS
Les Rencontres Scientifiques et Techniques d’ARCSIS
rassemblent depuis neuf ans des entreprises et laboratoires français et
étrangers sur des sujets pointus répondant aux besoins du marché de
la microélectronique. Ces 9èmes Rencontres seront dédiées au thème
de la « Sensibilité des Dispositifs Avancés aux Contaminations »
et se dérouleront les 16 et 17 novembre 2006 à STUniversity à
Fuveau (France).
9TH TECHNICAL AND SCIENTIFIC MEETING OF
ARCSIS
For nine years now, the Technical and Scientific Meeting of
ARCSIS has brought together French and foreign companies and
research centers on leading-edge topics related to
microelectronics in response to the market’s requirements. This
9th Meeting will be dedicated to “Sensitivity of Advanced
Devices to Contamination” and will take place on 16 & 17
November 2006 at STUniversity in Fuveau (France).
ARCSIS, Association pour la Recherche sur les Composants et les
Systèmes Intégrés Sécurisés, créée en 1993 sous le nom de CREMSI,
est chargée de renforcer et valoriser la filière microélectronique et des
objets communicants de la région Provence-Alpes-Côte d’Azur. A
travers cet événement, ARCSIS souhaite favoriser de nouvelles
collaborations entre les divers acteurs de la filière.
Ces deux journées s’articuleront autour de conférences présentées par
des experts régionaux et internationaux issus de la recherche et de
l’industrie. Une session « poster » se déroulera en parallèle et
comptera une dizaine de posters couvrant des sujets spécifiques.
ARCSIS, Association for the Research on Components and
Secured Integrated Systems, created in 1993 under the name
CREMSI, is an association in charge of strengthening and
promoting the microelectronics and communicating objects
industry of the Provence-Alps-Riviera region. Through this
event, ARCSIS has never stopped favoring new collaborations
between the various players of the industry.
OBJECTIVES
This meeting will be the opportunity for the scientific
community, for IC manufacturers and suppliers involved in the
topic:
to be informed of the latest technical developments and
challenges,
to optimize the technological supply and demand,
to share information and discuss the latest research results
in an informal atmosphere
to open new prospects for partnership
These two days will consist of conferences presented by local
and worldwide experts from research centers and industry. A
poster session runs in parallel, with about ten posters covering
specific aspects of the key topics.
ARCSIS présentera également la plate-forme CIM PACA R&D
Caractérisation notamment dans le domaine de la contamination
avec le projet CIMCONTA.
ARCSIS will also present the R&D CIM PACA
Characterization Platform, particularly in the field of
contamination with the CIMCONTA project.
LIEU DE LA MANIFESTATION
Cette conférence se tiendra dans les locaux de STUniversity à
Fuveau, en face de la montagne « Sainte Victoire » en Provence, au
cœur d’un des pôles majeurs de la microélectronique française.
LOCATION OF THE EVENT
This Meeting will be held at STUniversity in Fuveau at the foot
of the "Sainte Victoire" mountain in Provence, in the heart of
one of the major poles of microelectronics in France.
La manifestation se déroulera à 20km d’Aix en Provence, ville d’art et
de culture. Les paysages sont dominés par la montagne Sainte
Victoire immortalisée par le peintre aixois Paul Cézanne. Mais c’est
aussi la base idéale pour rayonner vers la Provence environnante qui
vous offre à quelques kilomètres les plus beaux paysages. Pour plus
d’informations sur la Provence : www.visitprovence.com
The event will take place at 20 km of Aix en Provence, city of art
and culture. Landscapes are dominated by the "Sainte Victoire"
mountain painted by the famous artist from Aix, Paul Cezanne.
But it is also the best place to visit Provence and its most
beautiful landscapes within a few kilometres. For further
information on Provence : www.visitprovence.com
COMITE D’ORGANISATION / STEERING COMMITTEE
CONTACT / INFORMATION
L. Jeannerot (Atmel) : [email protected]
P.Galand (Plate-forme CIM PACA Caractérisation) :
[email protected]
C. Wyon (CEA Leti) : [email protected]
I. Pages (EMSE-CMP) : [email protected]
S. Dauzere-Peres (EMSE-CMP) : [email protected]
B. Laborie (Kemesys) : [email protected]
D. Goguenheim (L2MP-ISEN) : [email protected]
L. Kwakman (Philips Semiconductor) :
[email protected]
M.Burle (STMicroelectronics) : [email protected]
Corinne JOACHIM
ARCSIS
BP 19 – Place Paul Borde – 13790 Rousset - France
Tel : +33 (0)4 42 53 81 50 Fax: +33 (0)4 42 53 81 51
E-mail : [email protected]
OBJECTIFS
Ces rencontres seront l’occasion pour la communauté scientifique, les
fournisseurs et les fabricants de circuits intégrés concernés par le
sujet:
de s’informer sur les avancées les plus récentes,
d’optimiser l’offre et la demande technologiques,
d’échanger sur les derniers résultats de recherche dans un cadre
non formel,
de favoriser de nouvelles collaborations.
www.arcsis.org
ARCSIS - BP 19 Place Paul Borde - 13790 Rousset – France
Tél. : 33 4 42 53 81 50 - Fax : 33 4 42 53 81 51 - www.arcsis.org - E-mail : [email protected]
8.45 am
Welcome
9.00 am
Introduction - ARCSIS (Rousset, France), E. Palm, Chairman
THURSDAY NOV. 16TH 2006
The 9th Technical and Scientific Meeting of ARCSIS - “Sensitivity of Advanced Devices to Contamination”
SESSION 1: Contamination and Methods of Analysis
Chairmen : Atmel, L. Jeannerot / STMicroelectronics, P. Galand
9.15 am
CIMPACA – R&D Characterization Platform presentation - CIM PACA (Rousset, France) P. Galand
9.35 am
A review of in-line and off-line analytical techniques used to monitor airborne and wafer surface
contamination – STMicroelectronics (Rousset, France), C. Martin, N. Pic
9.55 am
Challenges for analysing acids and bases on semiconductor materials – Philips Semiconductors
(Nijmegen, The Netherlands), J. Philipsen, I. Rusman
10.15 am
Iron contamination monitoring : cross-measurement correlation between techniques – University of
Limerick (Limerick, Ireland), V.Gorodokin / Purdue University (West Lafayette, USA), D. Zemliano /
Tower Semiconductor (Migdal Haemek, Israel), O. Gorodokin
10.35 am Break / Posters
SESSION 1: Contamination and Methods of Analysis (continued)
Chairmen : Philips, L. Kwakman / Centre Microelectronique de Provence, S. Dauzere-Peres
11.15 am
Chromium contamination in crystalline Silicon: detection and effects on devices performances –
TECSEN (Marseille, France), S.Dubois, O. Palais, M. Pasquinelli, S. Martinuzzi, CEA/LITEN/DTS
(Grenoble, France), S.Dubois, C. Jaussaud
11.35 am
Quantitative trace metal analysis on Silicon using Time-of-Flight SIMS – Philips Semiconductors
(Crolles, France), M.J.P. Hopstaken, L.F.Tz. Kwakman / Philips Semiconductors (Nijmegen, The
Netherlands), P. Rostam-Khani, O. O’Halloran, P. Vullings / STMicroelectronics, (Crolles, France), C.
Trouiller, M. Juhel / CEA-DRT-LETI (Grenoble, France), C. Wyon
11.55 am
Advanced VPD analysis for metal-ion contamination analysis in bulk silicon – Philips Semiconductors
(Nijmegen, The Netherlands), H. Eberhard, E. Jansen, P. Vullings / GeMeTec (Munchen, Germany), W.
Boehme
12.15 am
VOCs monitoring in clean environments : two complementary approaches – TERA Environnement
(Bernin, France), P. Kaluzny, L. Pepin, / STMicroelectronics (Crolles, France), A. Roche / SOPRA (BoisColombes, France), D. Zahorski, JL. Stehle
12.35 am Lunch
SESSION 2: Environment: Effects and Control
Chairmen : CEA-LETI, C. Wyon / KEMESYS, B. Laborie
2.15 pm
Keynote speaker : Alain Brochet, STMicroelectronics (Crolles, France)
Contamination control for 90 nm & 65 nm technos – impact on FAB design
2.45 pm
Fluorine contamination from Front Opening Shipping Box: impact on Al pads – STMicroelectronics
(Crolles, France), C. Trouiller, D. Guiheux, V. Lasserre, P. Gayet, M. Juhel / Philips Semiconductors
(Crolles, France), M. Hopstaken, L.F.Tz Kwakman / CEA-Leti (Crolles, France), C. Wyon
3.05 pm
Metallic contamination effect on semi-conductor devices with HF/EG chemical processes – Altis
Semiconductor (Corbeil-Essonnes, France), J.L. Baltzinger, B. Delahaye, M. Sanogo, B. Leroy, G. Richou,
P. Boissy
3.25 pm
Interconnect defectivity related to volatile acidic contamination in mini-environment handling and
storage conditions – CEA-DRT-LETI (Grenoble, France), H. Fontaine / DPTS-CEA/GRE (Grenoble,
France), M. Veillerot
3.45 pm
Break / posters
4.15 pm
Haze defectivity on 193nm reticles - STMicroelectronics (Rousset, France), F. Thibault /
STMicroelectronics (Crolles, France), X. Gerard, S. Gough
435 pm
The cleaning interest of mask containers for mask lifetime enhancement in DUV lithography –
Entegris (Montpellier, France), D. Cheung, / CEA-LETI (Grenoble, France), H. Fontaine
4.55 pm
Poster session / Cocktail
The 9th Technical and Scientific Meeting of ARCSIS - “Sensitivity of
Advanced Devices to Contamination” FRIDAY NOV. 17TH
8.30 am
Welcome
8.45am
Keynote speaker : Twan Bearda, IMEC (Leuven, Belgium)
Impact of contamination on semiconductor materials and devices
9.15 am
Impact of pre-clean contamination on SiGe epitaxy in a bipolar technology – ATMEL (Rousset,
France), S. Bodnar, A. Coze
9.35 am
Electrical effects on CMOS devices related to back-side copper contamination –
STMicroelectronics (Rousset, France), N. Puzenat, J-L. Ogier / L2MP ISEN (Toulon, France) D.
Goguenheim / CEA-LETI (Grenoble, France) A. Danel
9.55 am
Impact of contact resist stripping on data retention of a flash memory - ATMEL (Rousset,
France), F. Guyot, G. Philit, M. Veille
10.15 am
Break / posters
SESSION 3: Contamination and defectivity: issues and solutions
Chairmen : STMicroelectronics, M. Burle / Atmel, L. Jeannerot
10.45 am Digital X-ray topography for crystal-defect imaging and yield enhancement – Philips
Semiconductors (Nijmegen, the Netherlands), A. Joosten-Diesveld, W. Rutten, C. Emons, F. Voogt
11.05 am
Advanced single wafer processing for FEOL photo resist stripping – SEZ AG (Villach, Austria),
T. Hellweg, S. Detterbeck, G. Wagner / ATMEL (Rousset, France), G. Philit
11.25 am
Molybdenum contamination in indium implantation – STMicroelectronics (Agrate, Italy), D.
Codegoni, V. Soncini, M.L. Polignano, C. Bresolin
11.45 am
Critical device defect characterisation from 180 to 150 nm CMOS embedded technology –
ATMEL (Rousset, France), E. Lattard, L. Papciak, J. Font, E, Serres / Physical Electronics
(Chanhassen, USA), D. Paul / Biophy Research (Fuveau, France), T.M. Duc, L. Dupuy
12.05 am Drying performance evaluation of single wafer cleaning tool – Philips Semiconductors (Crolles,
France), P. Garnier, T. Kormann, V. Barec, / STMicroelectronics (Crolles, France), R. Diamanti, N.
Emonet / Freescale Semiconductors (Crolles, France), T. Vessa
12.25 am Closing remarks
12.40 am Lunch
Poster show
P1
Ultraclean vacuum wafer mini-environment for Oxidation & Airbone Molecular contamination prevention
– CNRS-LTML (Crolles, France), B. Pelissier, O. Joubert / Alcatel Vacuum Technology (Annecy, France), E.
Veran, H. Kambara, E. Godot / CEA-Leti (Crolles, France), V. Loup / STMicroelectronics (Crolles, France),
D.C. Bensahel
P2
Innovative toolparts cleaning and characterization : an efficient approach for high yield advanced IC
manufacturing – 40-30 (Seyssinet, France), S. Blanc, B. Préauchat / CEA-Leti (Crolles, France), M. Veillerot
P3
Short loops to evaluate the impact of metallic contaminants – STMicroelectronics (Crolles, France), A.
Roche / CEA-Leti (Crolles, France), Y. Borde, A. Danel, M. Veillerot
P4
STI deposition process change for defectivity & Yield improvement – ATMEL (Rousset, France), N.
Benissad, C. Arnal, E. Rabier, J.P. Mercier
P5
Determining the cleaning efficiency of a cleaning tool – Philips Semiconductors (Nijmegen, the
Netherlands), I. Rusman, D.M. Knotter
P6
New method for the reliability monitoring of the tunnel oxide reliability, using cell array stress test –
STMicroelectronics (Rousset, France) – L. Lopez, A. Remond, M. Messad, E. Blot, J.M. Moragues
P7
Impact of HF last clean on oxide reliability – ATMEL (Rousset, France), A. Coze
P8
Air treatment in clean room – STMicroelectronics (Rousset, France), A. Lanier, C. Martin
P9
Contaminants analyses in semiconductor : the expertise of a chemist – BASF (Fuveau, France), C. Galvez,
M.V. Deydier
P10 Surface contaminant analysis by ToF SIMS – Biophy Research (Fuveau, France), L. Dupuy, M.D. Tran
P11 Chemical contamination detection with Quantox XP® – KLA-TENCOR (San Jose, USA), L. Yu, M. Zhang, J.
Mi
P12 Influence of electromagnetic environment on Si and SiC diode electrical characteristics – TECSEN
(Marseille, France), L. Ottaviani, D. Barakel, M. Pasquinelli / L2MP (Marseille, France), J. Marfaing / LSBB
(Rustrel, France), J. Marfaing
P13 New material analysis by ICP-MS : considerations in generating accurate COAs for the customer – Air
Liquide (Dallas, USA), S. Anderson, P. Clancy, A. Schleisman
P14 Zero defect and advanced yield learning, Work Package 3 of the European Medea+ HYMNE project –
Philips Semiconductors (Nijmegen, the Netherlands), H. Thewissen, M. Knotter, P. Vullings / CEA-LETI
(Grenoble, France), D. Louis / Philips Semiconductors (Crolles, France), L. Kwakman, J. Van Herk /
STMicroelectronics (Crolles, France), C. Wyon
P15 INSEET at the Low Noise Underground Laboratory of Rustrel-Pays d’Apt (France): A usefull actor in
the soft error issues for micro/nano electronics – INSEET (Marseille, France), C. Sudre, G. Rastit / L2MP
(Marseille, France), K. Castellani, J-L. Autran / LSBB (Rustrel, France), G. Waysand, S. Gaffet / XILINX
(San Jose, USA) A. Lesea, J. Le Mauff
FRAIS DE PARTICIPATION
16-17 novembre 2006 : 9èmes Rencontres (repas,
cocktail et actes compris)
200 euros TTC pour les adhérents d’ARCSIS
(170 euros TTC dès la 2 ème inscription)
250 euros TTC pour les non adhérents
La date limite d’inscription est le 27 octobre 2006.
REGISTRATION FEES
November 16-17, 2006 : 9th Meeting (lunches,
cocktail and proceedings included)
200 euros TTC for ARCSIS members
(170 euros TTC for supplementary inscriptions)
250 euros TTC for non members
The deadline for registration is October 27 th
2006.
BULLETIN D’INSCRIPTION / REGISTRATION FORM
9 EMES
9 TH
RENCONTRES D’ARCSIS /
MEETING OF ARCSIS
Fuveau, France – 16 & 17 novembre 2006
A retourner par fax à / To send back by fax to : +33 (0)4 42 53
81 51 Ou par e-mail à / or by e-mail to : [email protected] le
Date limite d’inscription : 27 octobre 2006 / Deadline for
registration : October 27 th, 2006
Société / Company / Organisation :
……………………………………………………………………..
Nom, Prénom / Last Name, first name :
………………………………………………………
Fonction / Function : …………………………………………………………
Activité / Activity :
Fabricant / manufacturer
Fournisseur / supplier
Laboratoire / Research center
Adresse / Address :
……………………………………………………………………………………………….
Téléphone / Phone : ………………….…….
Fax : ………………………………..
E-mail : ……………………………………..
Je souhaite participer à / I wish to attend :
9 èmes Rencontres d’ARCSIS du 16&17 novembre 2006 / the 9th
ARCSIS Meeting on November 16&17, 2006
J’enverrai mon règlement par / I will pay by :
Chèque au / Check to ARCSIS
Virement à / Swift to BNP Aix en Provence
BP 19 – Place Paul Borde – 13790 Rousset
Code banque : 30004 00601 00003239619 21 (France)
Bank code : FR76 3000 4006 0100 0032 3961 921
Je souhaite recevoir / I wish to receive :
La liste des hôtels sélectionnés par ARCSIS / The list of
hotels selected by ARCSIS
Le plan d’accès à STUniversity / The access map to
STUniversity
MICROELECTRONICS IN PROVENCE
ALPES COTE D’AZUR
The 9 th Meeting of ARCSIS will be held on
the Rousset site and will be oriented
“manufacturing”, a field in which the pole has
very specialized skills. ARCSIS manages a
collaborative research and development
program – CIM PACA (PACA Integrated
Microelectronics Center). It groups the
microelectronic community around three
dedicated
platforms
of
collaborative
development for secure communicating
objects : design, characterization and micropackaging. www.arcsis.org
On October 4th & 5 th 2006, the 9th edition
of the Sophia Antipolis MicroElectronics
Forum, SAME 2006, will be dedicated to
“Design
Complexity
Challenges
&
Applications Impacts”. The Forum SAME is
a major European event suitable to all
professionals within the microelectronics
community, taking place in the heart of the
Science Technological Park of Sophia
Antipolis, South of France. SAME, the annual
event at the cutting edge of microelectronic
design
technologies
has
experienced
constant growth each year since its creation,
attracting over 1000 participants.
Key Success Factor for SAME Forum: a
unique opportunity to debate key issues
and future trends within a high level
technical environment:
- More than 1 000 visitors, 25 sponsors, 40
speakers and over 40 exhibitors.
- Facilitated access to a global network of
top decision makers and worldwide business
opportunities.
- A new Exhibition Theater, with 30mn
presentations on New Microelectronic
Products from our sponsors / exhibitors.
- Start-ups focus : a panel dedicated and
shared booth. www.same-conference.org