ELECTRONICS, COMMUNICATIONS and SYSTEMS

ELECTRONICS, COMMUNICATIONS and SYSTEMS
ECS
Professor in charge: Jacques WEISS
COURSES
CLASSES
EXAMS
SUBJECTS
ECTS
Credits
1 - SIGNAL and COMMUNICATIONS
16.5 h
9h
1 WE
Digital modulations
2
18 h
4.5 h
1E
Channel coding
2
22.5 h
10.5 h
1E
Multimedia source coding and signal processing
2
21 h
1.5 h
1 E*
Networks for communication and broadcast
2
2 – ELECTRONICS
18 h
7.5 h
18 h
21 h
3h
7.5 h
7.5 h
1 WE
Integrated analog electronics
1 WE
Microelectronic technologies et packaging
1.5
Programmable Components and processors
1.5
Dedicated architectures for signal processing
0.5
1E
2
3 – SYSTEMS
19.5 h
9h
10.5 h
Digital SoC (Systems on Chip) design
Real-Time systems
0.5
Test and testability of electronic systems
0.5
1E
Embedded and nomad electronic systems
1
1 E*
Companies organization and integrated management
1 E*
12 h
21 h
3h
9h
2
0.5
4 – LAB WORK
22 half-days
Three lab works
50 half-days
Project or Industrial Study
6
8+2
5 – ELECTIVE EDUCATION
30 h
Elective Education Modules 1 and 2
4
21 h
Foreign Languages
2
6 - END OF STUDIES TRAINING PERIOD
20
5 months
april to september
265,5 h
54 h
72 half-days lab
works
WE: written exam
10 exams
E* : exam common with several courses (written or oral exam, or presentation)
TABLEAU DES COEFFICIENTS relatifs aux examens et aux travaux entrant en ligne de compte pour
l’établissement du bulletin d’appréciation donné en fin de 3ème année.
option
ECS
2010
Ces coefficients correspondent au nombre de crédits ECTS attribués à l’activité correspondante.
Ils permettent d’établir, dans chaque rubrique, une note moyenne d’après laquelle est déterminé le niveau ECTS d’appréciation
(A à F).
Les aptitudes en langues sont appréciées dans une grille d’évaluation linguistique de 0 à 4 (du débutant au quasi bilingue).
L’obtention du diplôme d’Ingénieur de l’École Supérieure d’Électricité nécessite, d’une part un niveau au moins satisfaisant
(D à A) dans les cinq premières rubriques et d’autre part, un niveau minimal égal à 2,5 en anglais (il s’agit d’une obligation de
résultat qui n’implique aucune obligation de suivre des cours d’anglais).
COLUMNS
1
DISCIPLINES
THÉORIQUES
ECTS
Credits
SUBJECTS AND EXAMS
Digital modulations
WE
2
Channel coding
E
2
Multimedia source coding and signal processing
E
2
Networks for communication and broadcast
E
2
Integrated analog electronics
WE
2
10
2
APPLICATIONS
TECHNIQUES
Microelectronic technologies
WE
FPGA, processors and dedicated architectures
E
2
Circuits et systems design
E
2.5
Real time systems and test
E
1
Electronic systems
E
1
Project : report
PRO 1
1
Project : final presentation
PRO 2
1
1.5
10
3
LAB WORKS
and
PROJECT
First lab work
ETU 1
2
Second lab work
ETU 2
2
Third lab work
ETU 3
2
Project : work and experiments
PRO 3
8
14
Elective Education Module 2
2
Elective Education Module 2
2
Foreign Languages
2
4
ELECTIVE
EDUCATION
6
5
Industry or Research Laboratory Internship
END OF STUDIES
TRAINING PERIOD
20
E : controls realized by written or oral exams, or by individual or group oral presentation ; they may be shared by some courses.
PRO : project realized by a group of 2 or 3 students.
The aim of the specialization in “Electronics, Communications and Systems” is to train highly skilled engineers in electronic
systems, especially for nomad and mobile applications.
-
Signal processing with case studies for multimedia, digital communications and networks.
Design of analog and digital electronics : define, in good adequacy between technology and applications, architecture
of systems ; main performance targets are speed, cost, power consumption, integration density.
Design management including methods and tools, necessary for engineers to specify, realize, test and qualify industrial
products.
A set of topical seminars on state of the art applications, delivered by industrialists, is used to illustrate the use of these
techniques in the economic world.
The training is thus designed so as to allow the students to master methods and tools used in current developments, but also to
be a driving force for future evolutions in a large industry spectrum.
1- Signals and Communication
DIGITAL MODULATIONS
16.5h C / 9h BE / 1 exam / 2 ECTS credits
ECSTNM
Dominique Leroux (12h) , Yves Louët (4.5h).
Reliable data transmission in noisy environments requires the use of suitable methods. The aim of this course is to introduce the
various digital modulation methods and their performance and to show how the combination of coding and modulation enables
transmission performance to be enhanced.
Transmission channels
Wireless (Radio) channels modelling for indoor and outdoor communication. Wired, phone lines and power-line networks.
Digital modulation
Digital modulation principles. Various types of modulation: PAM, QAM, PSK, FSK
Digital demodulation
Principles and methods. Calculation of performance levels in the presence of noise.
Multi-carrier modulations
OFDM (DVB-T/H, ADSL) : Principles ; realization using an FFT operator.
Coded modulation : COFDM.
Spread-spectrum modulations
CDMA (UMTS, WiFi ), choice criteria.
Carrier synchronization
Three case study practices :
- MAQ-16 modulations MAQ-16, error probabilities, comparison with MDP-2, effects of a bad synchronization.
- Simulation of a transmission chain ; study of adapted filters and Nyquist filters.
- OFDM application : DAB (Digital Audio Broadcasting).
Bibliography :
J.C. Bic, D. Duponteil, J.C. Imbeaux, "Éléments de communications numériques - Transmission sur fréquence porteuse", Collection technique et scientifique
des télécommunications, CNET-ENST, Dunod, 1986.
J.G. Proakis, "Digital communications", McGraw-Hill International Editions, 1995.
M. Engels, "Wireless OFDM systems", Klewer Academic Publishe, 2002.
N. Blaunstein, "Multipath phenomena in cellular networks", Artech House Books, 2003.
CHANNEL CODING
18h C / 3h BE / 1.5h TD / 1 exam / 2 ECTS credits
ECSCDC
Yves Louët (6h), Ramesh Pyndiah (12h).
The aim of this module is to give a good vision of state-of-the-art techniques used in channel coding. Based on high level
concepts, main error-correcting algorithms used in communication standards are presented and explained.
Cyclic codes
- Galois fields, BCH codes, Reed-Solomon codes, principles et decoding algorithms (hard and weighted decisions), Berlekamp
decoding. Error location Polynomial.
- Codes associations : concatenation, interleaving, products codes. Applications examples in DVB, GSM, …
- Digital communication system provisioning with coding.
Coded modulations and block Turbo-Codes
- Introduction to block-coded modulations.
- Introduction to trellis-coded modulations.
- Introduction to block turbo-codes.
Introduction to convolutional turbo-codes
Principles, coding/decoding scheme, decoding algorithms with weighted outputs (SOVA, MAP). Performances, news and
trends.
Case study practice : study of a block-coded decoder with weighted decisions (algorithm of Chase).
Bibliography :
J.C. Bic, D. Duponteil, J.C. Imbeaux, "Éléments de communications numériques - Transmission sur fréquence porteuse", Collection technique et scientifique
des télécommunications, CNET-ENST, Dunod, 1986.
C. Heegard, S.B. Wicker, "Turbo coding", Klewer Academic Publisher, 1999.
F.J. MACWILLIAMS, N.J.A. SLOANE, "The theory of correcting codes", North Holland Press, 2nd Edition 1983.
W.W. PETERSON, E.J.WELDON, "Error correcting codes", The MIT Press.
B. VUCELIC & J. YUAN : “Turbo codes : Principles ans applications“, Kluwer Academic Publishers.
DIGITAL SIGNAL, SOUND AND IMAGE PROCESSING
22.5h C / 6h TD / 3h BE / 1 exam / 2 ECTS credits
ECSCSM
Pierre Leray (9h), Renaud Séguier (7.5h), Jacques Weiss (6h)
In addition to the filtering functions commonly encountered in processing systems, digital processing also allows the use of more
powerful algorithms, such as adaptive filtering and prediction. These are used in speech compression operations, in particular.
Real-time implementation of these algorithms requires the processing time to be taken into account and a compromise has to be
made between performance and the number of calculations. The multi-rate structures are moving in this direction. Finally, the
properties of the transforms (Fourier, cosine and wavelet transforms) also make analysis and processing much easier.
Digital processing
Signal digitization. Representation of numbers. Filtering functions (structures and synthesis).
Signal coding basis
Statistical signal properties, predictive and entropic coding (Huffman, Arithmetic, LZW, Golomb).
Adaptive filtering, linear prediction
Time and frequency-related algorithms. Speech processing applications.
Multi-rate processing systems
Structures. Filter banks. Sub-band coding.
Transforms (Fourier, DCT, wavelet)
Algorithms. Properties. Implementations.
Sound and image compression (MPEG)
Compression of the audio signal in radio communications and digital television (CELP, MUSICAM, Dolby AC3).
Image compression: transformation, quantization, motion estimation and compensation.
International standards : MPEG -1, -2 et -4/AVC, DCI (Digital Cinema)
Neural networks
Modelling the human brain. Structures. Learning algorithms.
3D image synthesis
3D models, vertex generation, texturing and fragment shading
Bibliography :
M. BELLANGER, "Traitement numérique du signal : théorie et pratique", Dunod.
V.K. MADISETTI, D.B.WILLIAMS, "The Digital Signal Processing Handbook", CRC Press.
P.P. VAIDYANATHAN, "Multirate Systems and Filter Bank", PTR Prentice Hall.
B. GOLD B, N. MORGAN, "Speech and Audio Signal Processing", Wiley.
S.J. SOLARI, "Digital Video and Audio Compression", McGRAW-HILL.
D.E. GOLDBERG, "Genetic Algorithms in Search, Optimization and Machine Learning", Ed. Addison-Wesley 1989.
F. I. PARKE, K. WATERS, "Computer Facial Animation", Ed. A K PETERS
NETWORKS FOR COMMUNICATION AND BROADCAST
21h C / 1.5h TD / 1 exam / 2 ECTS credits
ECSRCD
Véronique Alanou (7.5h), Jean-Marie André (3h), Étienne Chevreau (3h), Eric Deniau (3h), Didier Louis (3h), Jacques Weiss
(1.5h)
Any specialist in the field of architecture and integration of electronic systems is affected by data networks in two ways – first as
the designer of components and equipment and second as a network user (CAD, production, etc). This course describes the
architectural concepts of networks, public networks, local area networks and the available services ; media are also concerned
such as radio and power-line networks.
Wide Area Networks (WAN)
The ATM (Asynchronous Transfer Mode) protocol : : physical layer, ATM layer, adaptation layer (AAL). ATM signalling –
access control methods. LAN interconnection using ATM.
Frame Relay : signalling and admission control.
Multi Protocol Label Switching (MPLS) : notions on IP (Internet Protocol), Quality of Service (QoS), Virtual Private Network
(VPN).
Protocols and networks SONET/SDH
Network characteristics, OSI reference model, QoS, nodal functions.
PDH/SDH protocols : PDH and SDH Hierarchies, SDH layers, SDH frames, QoS, protection mechanism, SONET/SDH standard
Wireless networks
IEEE 802.11 (WiFi) protocol
Power-Line networks
Introduction to Power-Line Communication, State of the art. Constraints and technical choices (example OFDM, Reed Solomon,
Viterbi, filters).
Mobile phone networks (GSM, UMTS)
Network protocols and topology ; structure and frequency planning
Terrestrial Digital TV broadcast for nomad and mobile TV (TNT et DVB-H)
Broadcasd networks protocols and topology ; structure and frequency planning
Bibliography :
H. Nussbaumer, "Téléinformatique", volumes 1 à 4, Presses Polytechniques Romandes.
G. Pujolle, "Les réseaux", Eyrolles
P. Rolin, "Réseaux hauts débits - Réseaux et télécommunications", Hermes.
A. Tanenbaum, "Réseaux", Prentice Hall - InterEditions.
A. Tanenbaum, "Réseaux : Architectures, protocoles, applications", InterEditions.
C. Servin, "Télécoms, de la transmission à l’architecture de réseaux", Collection Systèmes distribués.
2- Electronics
INTEGRATED ANALOG ELECTRONICS
19.5h C / 1,5h TD / 6h BE / 1 exam / 2 ECTS credits
ECSEAI
Gilles Tourneur
There is an increasing need to integrate analog functions into VLSI digital blocks: the implementation of analog structures in
equipment suitable for digital applications leads to new constraints. After a brief summary of bipolar analog technology, this
module provides in-depth coverage of the design of CMOS and BICMOS analog circuits.
Overview of bipolar analog design
Methodology, design tools, gate-array approach, standard-cell or full-custom. Elementary integrated structures, operational
amplifiers, current and voltage references(Band Gap), etc.
CMOS and BICMOS analog circuits
CMOS analog circuits, design methodology and tools, technological development, etc. Modelling the MOS transistor, matching,
noise, etc. Amplifying circuits : compromise between “amplification-speed-size-voltage”, comparison between MOS and bipolar
technologies, CMOS and BICMOS operational amplifiers, stability and frequency compensation, transconductance amplifiers,
folded cascode structure. CMOS current and voltage references: use of parasitic bipolar or subthreshold MOS. Current mode and
low voltage circuits: trans-impedance amplifier, translinear circuits, dynamic current mirrors. Filtering : switched capacitance or
switched current filters, synchronised continuous filters. D/A converters : resistor network, current switching and charge
redistribution converters. A/D converters : ramp, successive approximation, flash, pipeline, folded and  converters.
Laboratory work on Cadence Opus.
Bibliography :
C. TOUMAZOU, G. MOSCHYTZ, B. GILBERT, “Trade-offs in analog circuit design : the designer’s companion”, Kluwer academic publishers, 2002, ISBN 14020-7037-3.
Randall L. GEIGER, Phillip E ALLEN, Noel R. STRADER, “VLSI : Design techniques for Analog and Digital circuits”, McGraw Hill, 1990, ISBN 0-07-100728-8.
P. E. ALLEN, D. R. HOLBERG, “CMOS analog circuit design”, Oxford University Press, 2002, 2ème ed., ISBN : 0-19-511644-5.
P.R. GRAY, R.G. MEYER : “Analysis and design of analog integrated circuits. Ed J. Wiley & sons inc.
MICROELECTRONIC TECHNOLOGIES AND PACKAGING
18h C / 1 exam / 1.5 ECTS credits
ECSTMP
Daniel Lambert (6h), Christian Moreau (12h)
Different technological steps : processes and equipment
Obtaining the silicon. Thermal oxidation. Localised insulation. Epitaxy, diffusion, distribution and ion implantation.
Photolithography. Polycrystalline and dielectric silicon deposition. Etching. Metal deposition.
Technology ways
Bipolar: description of the technology, implementation of NPN and PNP transistors, diodes, resistors and capacitors. MOS:
NMOS, CMOS.
Faults, degradation mechanisms and technological improvements
Latch-up. Hot electron ageing. Oxides. Metal deposition.
Development of IC technology
Submicron CMOS. BICMOS. Gallium arsenide, silicon on insulator.
Production of integrated circuits
Development cycle for integrated circuits. Efficiency: line efficiency, electrical efficiency. Organisation of a FAB. Quality tools
in the development cycle and production of integrated circuits: AMDEC/SPC /DOE/QFD.
Packaging and Interconnections
The packaging of electronic systems. Interconnections electronic components and integrated circuits. Thermal and electrical
aspects of packaging. Reliability of micro-electronic assemblies. Interconnection processes and assembly methods. Electronic
packaging evolution (roadmaps).
Bibliography :
M. MADOU, “Fundamentals of microfabrication”, CRC Press, 1997.
P. RAI-CHOUDHRY (Ed), “Handbook of Microlithography, micromachining and microfabrication”, SPIE Press, 1997.
MICROPROCESSORS AND PROGRAMMABLE COMPONENTS
21h C / 1.5h TD / 12h BE/ 1 exam/ 1.5 ECTS credits
ECSCPP
Daniel Le Guennec (3h), Pierre Leray (6h), Jacques Weiss (12h)
Microprocessors and associated components, which have been available since the first digital integrated circuits appeared in
the early ‘70s, now form the core of most electronic products: they are found almost everywhere, particularly in information
technology (from pocket calculators to computers), cars (ABS, injection systems, etc), automation equipment (programmable
controllers, process control, etc) and domestic appliances (thermometers, remote controls, smart cards, etc).
Programmable components (9h C)
Programmable components can be used to implement extremely fast arithmetic logic functions in a short development time Due
to technology improvements, it is now possible to integrate processor cores, this introduce the concept of SoPC (System On
Programmable Chip).
The aim of this course is to place these programmable components in context with the other means of implementing a given task
and to analyse the main architectures available on the market (Actel, Atmel, Altera, Xilinx, etc). After this analysis, student will
be able to assess the enhancements provided by the new architectures and find the most suitable component for a given function.
Design approaches and market for programmable components
Criteria for selecting a particular technology: the technical, industrial and economic aspects.
Families of programmable components
From PAL and CPLDs, right through to FPGA: analysis of various architectures and their potential. Development of families
and position in relation to the market.
Methodology and design tools
EDA tools.
Introduction to VHDL, description language for digital circuits and systems. Functional analysis and logic synthesis
Use of programmable components
Fields of application (signal processing, digital television, etc). Performance and limitations of the technology. Development
systems.
Concept of SoPC (System on Programmable Chip)
Hard and Soft cores, reconfigurable hardware, dynamic reconfiguration
Microprocessors (12h C)
This course present the main architectural concepts used on state-of-the-art general purpose processors with analysis of the
optimal adequacy with technology.
Structure and organisation of programmed systems
Central Unit
Memory : technologies and organisation.
Internal and external busses.
Peripheral components.
Processors architectures
RISC, CISC, VLIW and DSP architectures
Performance optimizations
Hierarchy, technology and structure (cache insertion)
Out-of-Order (speculative) sequencing
Branch prediction
Hyper-threading
Multiprocessing
Programming language (C langage)
Bibliography :
J.L. Hennessy, D.A. Patterson, "Computer Architecture, A Quantitative Approach", 3rd edition, M. Kaufmann, 2002.
W. Stallings, "Computer Organization and Architecture", 5th ed., 2000.
Structured Computer organisation, Prenctice-Hall.
High performance reduced instruction set processors, IBM tech. Rep.
The cache memory book, Academic press.
Computer Architecture, Elsevier Science.
Bibliography :
J.L. Hennessy, D.A. Patterson, "Computer Architecture, A Quantitative Approach", 3rd edition, M. Kaufmann, 2002.
W. Stallings, "Computer Organization and Architecture", 5th ed., 2000.
Structured Computer organisation, Prenctice-Hall.
High performance reduced instruction set processors, IBM tech. Rep.
The cache memory book, Academic press.
Computer Architecture, Elsevier Science.
DEDICATED ARCHITECTURES FOR SIGNAL PROCESSING
7.5h C / 3h BE / 1 exam / 0.5 ECTS credit
ECSADTS
Pierre Leray (6h), Renaud Séguier (1.5h)
Signal and data processing both make considerable use of mathematical algorithms that incorporate complex operations and
functions. The aim of this course is to provide tools and a design methodology for these highly structured digital systems.
Architecture of digital operators.
Representation of digital information and properties. Conversion algorithms. Binary operators: addition, subtraction,
multiplication, division. Decimal operators. Conversion operators.
Digital systems
Signal processing processors : parallel structures, pipelines, systolic processing
Dedicated processors for graphical and intensive computing : GPU (Graphic Processor Unit) and GPGPU (General Purpose
Graphic Processor Unit)
Bibliography :
J. RUDMAN, "Digital Computer Operator", Paperback.
3- Systems
DIGITAL SOC DESIGN
18h C/ 9h BE / 1 exam / 2 ECTS credits
ECSSOC
Didier Louis (9h), Christophe Moy (3h), Amor Nafkha (3h), études de cas : Gérard Taroni (4.5h)
Introduction :
Electronic market technologies, prices and trends
Design techniques, description and comparison
ASIC technologies – Foundry/customer relationship
Design of circuits libraries
From base circuits up to complex functions (IP : Intellectual Property) – integrated memories self-test
Electrical and physical design.
System On a Chip
SOC core blocks
Processors cores – buses – reused logic.
The Reuse Methodology Manual.
SOC design
Specification – functional, architectural and hardware design
Systems design : platforms.
Memory design
DRAM - SRAM - non volatiles Memories.
Complex systems description and design, trends on design approaches
High-level Description Tools and languages, co-deign ; hardware/software partitioning ; heterogeneous platforms
Design of complex systems, trends of methods
High level digital flow of heterogeneous systems.
SystemC design flow .
Hardware-software partitioning. Cosimulation, modelisation
Abstraction levels (UTF, TF, TLM, RTL, …).
Optimisation and Operational research
Graphs theory. Scheduling. Ressources allocation. Parallel computing
REAL-TIME SYSTEMS
10.5h C/ 0.5 ECTS credit
Jean-Marie André (3h), Pierre Chlique (4.5h), Yannick Delibie (3h)
ECSSTR
Real-time systems have to interact with their environment in respect of reliability and timing constraints. After an introduction
of these constraints, needs and mechanisms will be presented in a multi-tasking environment.
Real-time applications needs
Strict, soft and incremental real-time.
Polling mode, interrupt-driven mode. Scheduling problems.
Multitasking and real-time kernels
Tasks scheduling. Synchronization and communication mechanisms. Real-time protocols. Creation of services. Scheduling
algorithms examples.
Specification basis and real-time applications design
Implementation and use of an embedded real-time operating system (RTOS)
Missions and architecture of an Operating System.
Hardware implementation
Real time constraints
Cas of study : mobile phone
Hardware and software architecture of a smartphone
Tasks and ressources administration. Scheduling
Bibliography :
C. Bonnet, I.Demeure, "Introduction aux systèmes temps réel", Ed. Hermès.
G.C. Buttazo, "Hard Real Time Computing Systems", Ed. Kluwer.
M. Klein, "A Pratictionner’s Handbook of Real-Time Analysis", Ed. Kluwer.
R. S. WRIGHT, "OpenGL Super Bible", Ed. Sams.
R. J. ROST, "OpenGL Shading Language", Ed. Addison-Wesley.
TEST AND TESTABILITY OF ELECTRONIC SYSTEMS
12h C / 1 exam / 0.5 ECTS credit
ECSTTS
Dominique Guérin (6h), Jacques Weiss (6h)
System testing is an important aspect of a manufacturer’s strategy. It is used to measure the quality and reliability of products,
and thus to validate the entire production sequence. The complexity and performance of systems are constantly increasing, so
testing equipment is becoming ever more expensive. As a consequence, design strategies are needed that make testing easier,
thus cutting costs. Testing must be carried out at every stage of production (from the integrated component and the printed
circuit board, right through to the finished system). The testing equipment and strategies are therefore adapted to suit the
particular context; characterization and maintenance also impose specific constraints.
Overview of the instrumentation used
Signal integrity, interconnections characterization, disturbance sources.
Power supply and parastics rejection
Power supply circuits, specific components, decoupling.
Characterization
Functional verification,, static and dynamic characterization, functional and parametric tests. Fault diagnosis and location. Test
bench: organisation and quantitative test flow.
Testing printed circuit boards
AOI (Automated Optical Inspection). In-Circuit test. Functional test. JTAG standard.
Testing integrated circuits
Testing with and without contact. Testing mixed circuits: analog and digital access.
Developments and trends
CAD and testing equipment. How far should the testing go? Development of new design and testing approaches.
Testability
Access limitations on integrated circuits, testability analysis, fault modelling and simulation ; test patterns generation (ATPG) ;
DFT : Design For Test.
EMBEDDED AND NOMAD ELECTRONIC SYSTEMS
21h C / 1 exam / 1 ECTS credit
ECSSEEN
Sébastien Amiot (3h), Patrice Gamand (9h), Yannick Guyomarch (3h), Joël Malville (6h)
Development strategies for embedded and nomad systems
Electronic functions dispatching on an integrated system
- Case study of a mobile phone
In this part we will show and discuss about constraints and especially about functions dispatching (power-analog-digital)
Technologies involved : Criteria of choice
- CMOS, BiCMOS, Passive components, integrated passive electronics, packaging
This part is about industrial and economical constraints.
Optimal Choice of a technology
- Speed, consumption, cost and integration criteria
- Radio technologies : RF-CMOS, SiGe, …
- Economical criteria
This part focuses on economical constraints in regard to technology and time-to-market.
Examples
- integrated transceiver : from system specification to product specification (GSM study)
- Technological choices in 2 application domains : mobile phones, automotive electronics
- System In Package (SiP) et System On Chip (SoC)
Automotive
Automotive environment – electronic equipment and design context
Integration in electrical architecture of vehicles.
Electronic design : architecture, majors blocks, fault handling
Constraints and provisioning – Choice of components – Testability
Products manufacturing - Validation
COMPANIES ORGANIZATION AND INTGRATED MANAGEMENT
9h C / 1 exam / 0.5 ECTS credit
ECSOEM
Serge Masserot (9h)
The objective of this course is to approach quality management in a company.
Management models
Quality approaches : constraints or opportunities
Quality concepts evolution (from quality control to total quality). Certification policy (ISO 9000 standard). Quality improvement
strategy. Total quality management (EFQFM). Results and trends.
Quality in design activity
Business Center operation. Development process of a new product. Management of design documents. Project management and
associated indicators.
Human resources management
4- Experimental work
Students will be divided into groups and will carry out laboratory work (long projects lasting 8, 6 and 8 sessions (half-days), for
much of which they will be left to work on their own initiative and will be expected to set up, run and interpret the results of
their experiments) and an industrial study or a project to design and implement a system over a three-month period (scheduled
for 200 hours).
PROJECTS
Each group of students will carry out two projects on the following subjects:
Project 1: 8 sessions
Study and implementation of a digital system on a FPGA for data acquisition or signal processing (e.g. digital frequency
demodulation, digital decimal filter, image compression).
Project 2 : 6 sessions
Study and implementation of a digital system using a DSP for data acquisition or signal processing (e.g. digital frequency
demodulation, digital decimal filter, sound compression).
Project 3: 8 sessions
Design of an integrated circuit (e.g. coprocessor for digital filtering, FIFO memory using CMOS components, NICAM decoder,
phase loop).
INDUSTRIAL STUDY OR PROJECT
Each group will carry out a project on an assembly defined by specifications established jointly with a manufacturer. The group
will study the theoretical aspects, carry out the necessary experiments and produce the assembly. The subjects will be allocated
during the first term and the project will take up an increasing proportion of the students’ time over the course of the second
term. The students will be required to write detailed reports and to justify and present the work they have carried out. They will
also give talks on their work so that their progress can be assessed.
Liste des professeurs intervenant dans l’option ECS
Véronique ALANOU
Ingénieur ESEO, Professeur, campus de Rennes
Jean-Marie ANDRÉ
Ingénieur, Senior VP, Purple Labs, Le Bourget du lac
Sébastien AMIOT
Ingénieur Supélec, NXP, Caen
Étienne CHEVREAU
Ingénieur Supélec, Technical Manager, SPIDCOM Technologies, Bourg-la-Reine
Pierre CHLIQUE
Ingénieur ESSTIN, Diplôme de Spécialisation de Supélec, Professeur , Délégué à l’Enseignement sur
le campus de Rennes
Yannick DELIBIE
Ingénieur FIUPSO, Paris Sud, Master Informatique et Télécoms, Sherbrooke, Canada, Directeur
Technique, KERLINK, Rennes
Eric DENIAU
Ingénieur Supélec, VP Engineering, ENENSYS, Rennes
Patrice GAMAND
Docteur en Électronique, Responsable Développement Circuits Intégrés, NXP, Caen
Dominique GUÉRIN
Ingénieur Support outils CAD, S.A. ATMEL, Nantes
Yannick GUYOMARCH Expert en électronique automobile embarquée (plate-forme OPASS), MEITO, Rennes
Daniel LAMBERT
Docteur de l’Université de Paris VI, Responsable Design physique des cartes électroniques, BULL, Les
Clayes-sous-bois
Daniel LE GUENNEC
Ingénieur Supélec, Professeur, campus de Rennes
Pierre LERAY
Ingénieur INSA, Professeur, campus de Rennes
Dominique LEROUX
Ingénieur ESME, Enseignant-chercheur à TÉLECOM Bretagne, Brest
Yves LOUËT
Ingénieur ISITV, Docteur de l’Université de Rennes I, Professeur, campus de Rennes
Didier LOUIS
Ingénieur ECL et Supélec, Chef d’applications de Télécommunication, IBM France, Corbeil-Essonnes
Joël MALVILLE
Ingénieur ENSEA, ingénierie en systèmes embarqués (automobile), AJS-ïd, BEAUPREAU (49)
Serge MASSEROT
Ingénieur ISTIA Angers, Responsable RH et organisation, S.A. ATMEL, Nantes
Christian MOREAU
Ingénieur INSA, Responsable du domaine d’expertise composants, CELAR, Bruz (35)
Pascal MORIN
Ingénieur expertise électronique CEE, VALEO Electronic & Connective System, Créteil
Christophe MOY
Ingénieur INSA, Docteur INSA, Professeur, campus de Rennes
Amor NAFKHA
Ingénieur SUP’COM Tunis, Docteur de l’Université de Bretagne Sud, Professeur, campus de Rennes
Ramesh PYNDIAH
Ingénieur ENSTB, Enseignant-chercheur à TÉLECOM Bretagne, Brest
Renaud SÉGUIER
Docteur de l’Université de Rennes I, Professeur, campus de Rennes
Gérard TARONI
Ingénieur ISEP, Responsable conception ASICs, IBM France, Corbeil Essonnes
Gilles TOURNEUR
Ingénieur Supélec, Docteur de l’Université de Rennes I, Professeur, campus de Rennes
Jacques WEISS
Ingénieur Supélec, Docteur de l’Université de Rennes I, Professeur, campus de Rennes