docEtat de l`art des BGA plastique - CCT
download 
Plainte Transcription
Etat de l`art des BGA plastique - CCT
Etat de l’art des BGA plastique I T &S A e r o s p a c e D e f e n c e Charles Le Coz TRT Orsay THALES Research & Technology Séminaire CNES - 11/09/2003 Types de BGA plastique Marché Applications Dimensions Avantages et limitations Evolutions 2 THALES Research & Technology This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Plan Types de BGA plastique Circuit intégré Résine de surmoulage Vias thermiques Billes de brasure SnPb PBGA “ full populated ” PBGA “ depopulated ” Capot collé Séminaire CNES - 11/09/2003 Encapsulation Glob Top Solder bumps Dissipateur cuivre Billes de brasure PbSn SBGA = PBGA haute dissipation 3 THALES Research & Technology Flip-Chip BGA This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Substrat d ’interconnexion This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Séminaire CNES - 11/09/2003 Flip-Chip BGA Principale technologie utilisée pour les PBGA de plus de 600 E/S 4 THALES Research & Technology Types de BGA plastique (2) : les CSP Flex tape Die Encapsulant Solder balls Wire bonding Elastomer pad Solder bumps Tape Ex: µBGA TESSERA Séminaire CNES - 11/09/2003 Flex-circuit interposer Leadframe type 5 THALES Research & Technology Substrate Flip Chip Rigid substrate Wafer-level assembly This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Wires This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Séminaire CNES - 11/09/2003 Marché des boîtiers DCA 6 THALES Research & Technology DIP Séminaire CNES - 11/09/2003 Fonctions PLD 7 THALES Research & Technology Nb d ’entrées/sorties 200 - 1700 1.0 mm Microprocesseurs 300 - 400 1.27 & 1.0 mm Mémoires, Logique 30 - 120 0.8 mm Discrets, Ampli Op 4-8 0.5 mm This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Applications des boîtiers BGA Pas typique Séminaire CNES - 11/09/2003 Pin count BGA 300 8 100 30 TQFP TSSOP Cost driven THALES Research & Technology BGA/CSP CSP Cost/performance driven Performance driven This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Domaine d ’application des BGA 3000 1000 This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Séminaire CNES - 11/09/2003 Dimensions 9 THALES Research & Technology Avantages Limitations Grand nombre d ’E/S Fragilité du boîtier au report (MSL) Intégration Performances électriques et thermiques Séminaire CNES - 11/09/2003 Coplanarité 10 Risque de déformation grand boîtier (warpage) Difficulté d ’inspection Auto-alignement Difficulté de réparation (rework) Rendement fabrication (yield) Complexité de la carte THALES Research & Technology This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 BGA : Avantages et limitations 11 This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Séminaire CNES - 11/09/2003 Evolutions THALES Research & Technology Evolutions (2) Composition des billes de brasure Température de fusion SnPb SnAgCu 183°C 217°C « Green » = absence de Br, Sb, Cd,... Séminaire CNES - 11/09/2003 Nouvelle résine de surmoulage 12 Tenue au report THALES Research & Technology Coefficient de dilatation bas Fragilisation due à la température, bien que maintien des classifications (typiquement MSL Niveau 3) This document and any data included are the property of THALES. They cannot be reproduced , disclosed or used without THALES' prior written approval . ©THALES 2003. Template trtco version 7.0.0 Leadfree
