Procurement Industrial Briefing - emits

HERSCHEL / PLANCK
Procurement
Industrial Briefing
ESTEC 10/07/02
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© Alcatel Space Industries
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Bidders Briefing.ppt - 10/07/02 - 1
Agenda
▼ Introduction & Objectives of the Industrial Briefing.
▼ List of Remaining ITT’ presented (ASPI / Astrium / Alenia).
▼ Presentation of each ITT, per Company.
▼ Clarification & answer to questions.
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ESTEC 10/07/02 - 2
Introduction
▼ The H-P Project of the Agency’s Horizon 2000 Programme is close
to completing its design phase (PDR).
▼ Alcatel as Prime Contractor is leading the procurement of both
Herschel & Planck Satellites, with the support of Alenia Spazio for
both Service Modules (SVM) and Astrium GmbH for the Herschel
Payload Module.
▼ The Procurement Process is presently more than half way and 24
ITT’s are still to be released on EMITS.
▼ The purpose of this briefing is to provide to all potential Bidders,
before the ITT is put on EMITS:
G advanced information,
G answer questions or provide clarification.
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ESTEC 10/07/02 - 3
Objectives (Cont’d)
▼ Provide potential Bidders with the necessary information, to
prepare competitive offers.
▼ To introduce driving Technical and Programmatic aspects of the
ITT and background information:
G Introduction / subject of the ITT,
G Spacecraft or Module configuration,
G Main Technical requirements & Driving requirements overview,
G Procurement approach,
G Programmatic requirements & delivery dates,
G Tender conditions.
▼ Procurement process schedule & near term planning.
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ESTEC 10/07/02 - 4
Remaining ITT’s still to be issued
Title:
Per ITT:
▼ Context in the Spacecraft
▼ Driving Requirements
& Critical Aspects
▼ Model Philosophy, Deliverables
& Need Dates
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ASPI & Planck
ISV
RF Mock-up & Test
RF Suitcase
VMC
ASED HPLM
MTD
He System Tubing
Thermal Shield
Internal MLI
Support Structure H/W
SVM Thermal Shield
External MLI
Optical Windows & Filters
LOU Alignment Camera
LOU Waveguides
OBA
ALS HP SVM's:
SVF
SVM Harness
CDMU ASW
ACMS / RWS
ACMS / QRS
ACMS / STR
ACMS / AAD
ACMS / SAS
ACMS / ASW
© Alcatel Space Industries
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RFQ Direct Customer:
or
ITT:
ITT
ITT
ITT
ITT
ASPI
ASPI
ASPI
ASPI
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ALS
ALS
ALS
Dutch Space
Dutch Space
Dutch Space
Dutch Space
Dutch Space
Dutch Space
ESTEC 10/07/02 - 5
Herschel - Planck
▼ Context in the Spacecraft:
G Herschel
G Planck
G H & P SVM
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ESTEC 10/07/02 - 6
Launch configuration
Launch configuration
▼launch from Kourou
G baseline launcher is Ariane 5 ES/V
G compatibility with Ariane 5 ECA ensured
▼Dual launch configuration
G Herschel in upper position
G Planck in lower position under SYLDA 5
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ESTEC 10/07/02 - 7
HERSCHEL
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ESTEC 10/07/02 - 8
Herschel overall configuration
Modular concept
▼H-EPLM
G provides cryogenic environment for
instrument FPU’s
G accommodates ∅ 3.5 m telescope
▼SVM
G houses instrument warm units and
platform equipment
Thermal insulation of the cryostat drives
overall architecture
▼conductive insulation: GFRP truss at
interface, cryo harness (using SST or brass)
between FPU and warm units
▼radiative insulation: Sunshield/Sunshade
and SVM shield, low emissivity MLI’s
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ESTEC 10/07/02 - 9
Architecture and Main Design Feature
Sunshade
Herschel S/C Overall
Configuration
Height
7,45 m
Ømax
3,97 m
Mass ~3125 kg
Power ~1500 W
(BOL)
Telescope
CVV Upper
Bulkhead
LOU & LOU
Radiators
+Y Radiator
Sunshield
-Z Radiator
CVV
SVM Thermal
Shield
LOU
waveguide
-Y Radiator
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SVM
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ESTEC 10/07/02 - 10
Herschel Block diagram
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ESTEC 10/07/02 - 11
ISO QM Satellite
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ESTEC 10/07/02 - 12
Architecture and Main Design Feature
Internal CVV Configuration and Helium Control System
Cover
Baffle
Aperture
PACS
Optical Bench
Shield
HIFI
Optical Bench
Three Radiation
Shields with MLI
Cryostat Vacuum
Vessel (CVV)
SPIRE
Helium Ventline
Heat Exchanger
Helium II
Tank (HTT)
Tank Support
Structure
Helium I
Tank (HOT)
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ESTEC 10/07/02 - 13
PLANCK
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ESTEC 10/07/02 - 14
Planck overall configuration
Modular concept as on Herschel
▼P-PLM
G provides a 60 K environment to FPU
and primary and secondary mirrors
G provides cold interfaces for the active
cooling system
G protects the telescope against
straylight
▼SVM
G main design driver is sorption cooler
implementation: need to dissipate
640 W at 260-280 K (peak
dissipation of 1300 W)
G common equipment panels with
Herschel
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ESTEC 10/07/02 - 15
Planck Payload Module
MODULE OVERVIEW
Baffle
Telescope
Cryo-Structure
Instruments
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ESTEC 10/07/02 - 16
Planck Block diagram
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ESTEC 10/07/02 - 17
SVM CONFIGURATION
CONFIGURATION
-Y+Z PANEL
ACMS
+Z PANEL
-Z PANEL
SCS (SCE)
-Y-Z PANEL
SCS (SCC)
+Y-Z PANEL
SCS (SCC)
+Y+Z PANEL
TTC
-Y PANEL
TTC
-Y PANEL
HIFI (Horizontal Polarization)
+Y PANEL
HFI (4K Panel)
+Y PANEL
POWER & CDMS
-Y-Z PANEL
HIFI (Vertical Polarization)
-Y+Z PANEL
POWER &CDMS
+Y+Z PANEL
HFI & LFI (DCCU & REBAs)
-Z PANEL
SPIRE
+Y-Z PANEL
PACS
+Z PANEL
HFI (REU & DPU)
HERSCHEL
Configuration
PLANCK
Configuration
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ESTEC 10/07/02 - 18
Alcatel ITT’s
▼ Independent Software Verification & Validation
▼ RF Mock-up & Test
▼ RF Suitcase
▼ Video Monitoring Camera
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ESTEC 10/07/02 - 19
ISVV ITT
▼ Independent Software Verification & Validation (ISVV) Overview:
❏ ISVV is a verification and validation process performed by an
organisation independent from the supplier of the On-Board Software
(OBSW) to be verified and/or validated.
▼ ISVV Objectives (Verification process):
❏ To verify OBSW requirements against system functional requirements,
including interface requirements.
❏ To verify OBSW architectural and detailed design against OBSW
Requirement/Interface documents and Design Standards.
❏ To perform OBSW Code analysis against OBSW design, requirements
and coding standards.
❏ To perform run-time error detection.
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ESTEC 10/07/02 - 20
ISVV ITT
▼ ISVV Objectives (Validation process):
To check exhaustively that the OBSW behaviour is operationally correct
regarding the operational modes of the satellite.
To validate exhaustively that the software capabilities are available in
nominal and contingency situations.
To validate exhaustively the software performances with regard to worst
case operational conditions.
▼ ISVV Driving requirements:
The following OBSW shall be subject to a complete ISVV:
Central Data Management Unit (CDMU) SW.
Attitude Control Computer SW.
Start Tracker SW.
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ESTEC 10/07/02 - 21
ISVV ITT
▼ ISVV Driving Requirements (cont’d):
ISVV shall be performed twice for each OBSW:
First ISVV on the OBSW release delivered by the supplier after its respective
Qualification Review,
Final ISVV on the final release of the OBSW (if different from the previous one).
The ISVV shall be performed on the Software Validation Facility (SVF)
delivered by ASPI and installed at ISVV contractor’s premises.
All ISVV Verification and Validation processes shall be compliant with
ESA standards ECSS-E-40B and ECSS-Q-80B.
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ESTEC 10/07/02 - 22
ISVV ITT
▼ ISVV Schedule:
The qualified HERSCHEL and PLANCK SW will be made available in the
time frame 11/2003 - 07/2004
All the final flight OBSW will be available by 06/2005 (TBC).
Results of ISVV contract shall be available before:
12/2004 (TBC) for the first ISVV campaign.
03/2006 (TBC) for the final ISVV campaign.
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ESTEC 10/07/02 - 23
RF Mock-up & Tests
▼ RF MOCK-UP & TESTS - 1/3
❏ One mock-up will be manufactured per satellite and main features
are:
➔ full representativity of the satellite body and dimensions (scale 1),
➔ reflective coating (for RF purpose),
➔ will be equipped with actual Low Gain Antenna (flight items),
➔ can be tested indoor or outdoor.
❏ The RF tests will measure the Low Gain Antennas patterns in
presence of the satellite structure.
❏ This RF test campaign will close the RF performances verification of
the TTC subsystem.
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ESTEC 10/07/02 - 24
RF Mock-up & Tests
▼ RF MOCK-UP & TESTS - 2/3
❏ Main test requirements are :
➔ X band measurements
➔ measurement of the antennae pattern over 4PI (Tx & Rx) co & cross polarisation
➔ measurement steps 1° azimuth, 2° elevation
❏ Outputs
➔ max & min gains
➔ iso-level contours at 11 different levels
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ESTEC 10/07/02 - 25
RF Mock-up & Tests
▼ RF MOCK-UP & TESTS - 3/3
❏ Critical aspects:
➔ Representativity (simplification) versus cost optimisation
➔ Use of flight hardware (cleanliness, configuration, traceability)
❏ Deliverables:
➔ Test results mainly. The mock-ups are not needed at system level.
❏ Earlier Deadlines:
➔ The flight antennas will be available beginning of 2004.
➔ The deadline is to complete all tests before the system QR (Dec. 2004)
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ESTEC 10/07/02 - 26
ISO RF Mock up
ISO RF
Mock up
In test
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ESTEC 10/07/02 - 27
RF Suitcase
▼ Ground equipment used by ESOC to perform RF
compatibility tests between ground stations and spacecraft
▼ Includes flight representative hardware from the TTC
subsystem and CDMS subsystem and ground support
equipment to operate them
▼ Representative of the RF interface of the satellite as well as of
data structures (transfer frames and packets) transmitted by
the spacecraft
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ESTEC 10/07/02 - 28
RF Suitcase
General architecture
TC/TM
RF
Diplexer
RF
Attenuator
TM/TC Interface
&
Packet Generation
TTC
Equipment
DC Power
Supply
PC Notebook
Network
hub
Monitoring & Control rack
Ethernet network
(TCP/IP)
Man Machine
Interface
AC Power
Distribution & Safety
RF Suitcase cabinet
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ESTEC 10/07/02 - 29
RF Suitcase
▼One suitcase used for both Herschel and Planck satellite
G possibility to easily exchange the transponder shall be offered
to switch between Herschel and Planck configuration
▼Delivery date to ESOC end of 2005
▼Kick-off planned for mid-2004
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ESTEC 10/07/02 - 30
VMC
▼ Visual Monitoring Camera = VMC
▼ Camera mounted on Herschel and Planck Service Module
used to produce images for public relation purpose
▼ Used for a short time at the beginning of the mission to
produce images of the satellites separation from launcher or
shortly after
▼ One camera on each spacecraft
▼ Main requirements
G mass ∼ 0.5 kg
G volume < 150 mm x 100 mm x 100 mm
G power consumption < 3 W
G data rate < 1 Mbps
G serial data link to CDMU : RS-422
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ESTEC 10/07/02 - 31
VMC
VMC
VMC implementation on
Planck
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VMC implementation on
Herschel
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ESTEC 10/07/02 - 32
VMC
▼ Deliverable items
G 2 Models, one for Herschel, one for Planck
▼ Need date
G end of 2004
▼ In addition a breadboard shall be delivered end of 2003 for
testing on system test bench (TBC)
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ESTEC 10/07/02 - 33
Astrium ITT’s
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
Mechanical & Thermal Dummies
Helium System Tubing
Thermal Shield
Internal MLI
External MLI
Support Structure H/W
SVM Thermal Shield
Optical Window & Filters
Local Oscillator Unit (LOU) Alignment Camera
LOU Waveguides.
Optical Bench Assembly
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ESTEC 10/07/02 - 34
Alenia ITT’s
▼ Software Validation Facility
▼ SVM Harness
▼ CDMU Application S/W
▼ ACMS Equipment's
G Application S/W
G Reaction wheels
G Star-trackers
G Attitude Anomaly Detectors
G Sun Acquisition Sensors
G Coarse Rate Sensors
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ESTEC 10/07/02 - 35
ITT process
Title:
▼ For each ITT the
documentation package is
issued on EMITS
▼ Bidders have 6 weeks to
prepare their offers
▼ The selection process will
follow the program procedure
derived from the general ESA
selection procedure and “best
practices”
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RFQ Direct Customer: Planned date
of issue on
or
EMITS
ITT:
ASPI & Planck
ISV
RF Mock-up & Test
RF Suitcase
VMC
ASED HPLM
MTD
He System Tubing
Thermal Shield
Internal MLI
Support Structure H/W
SVM Thermal Shield
External MLI
Optical Windows & Filters
LOU Alignment Camera
LOU Waveguides
OBA
ALS HP SVM's:
SVF
SVM Harness
CDMU ASW
ACMS / RWS
ACMS / QRS
ACMS / STR
ACMS / AAD
ACMS / SAS
ACMS / ASW
© Alcatel Space Industries
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ITT
ITT
ITT
ITT
ASPI
ASPI
ASPI
ASPI
August
End July
September
September
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
ASED
End July
End July
August
End July
End July
End July
August
September
September
September
End July
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ITT
ALS
ALS
ALS
Dutch Space
Dutch Space
Dutch Space
Dutch Space
Dutch Space
Dutch Space
September
August
August
End July
End July
End July
End July
End July
August
ESTEC 10/07/02 - 36