BCFMKM_Thermacore_Advanced Solid Conduction k

Fichier : BCFMKM_Thermacore_Advanced Solid Conduction k-Core_082010.doc
Création : 05/08/2010 11:46
Subject to change without notice, please ask for the last updated révision
Advanced Solid Conduction > k-Core®
Conduction Heat Transfer Expertise from k Technology
Advanced solid conduction concepts from k Technology are used in thermal applications all over
the world.
Among its primary thermal solutions, k Technology developed the patented k-Core heat transfer
system, which uses encapsulated graphite to help alleviate heat in high-power electronics for
applications in aerospace, military and commercial applications. The k-Core material uses APG as an
insert within an encapsulating structure. k-Core can be fabricated by employing most conventional
thermal management materials as the encapsulant (e.g., aluminium and copper alloys, ceramics, and
composites), as dictated by user need and application. Light in weight, the passive k-Core system is
highly conductive thermally and offers designers the ability to tailor coefficients of thermal expansion
(CTE) if needed. The k-Core heat transfer system is typically designed for a specific application by
our experienced engineering team.
Because k-Core can be encapsulated in a wide range of conventional thermal management metals and
materials, k-Core heat transfer products provide “drop-in” replacements for the solid metal conductors.
As a result, thermal designers can significantly reduce their electronic component temperatures,
thereby improving performance, reliability and greatly prolonging the life of your most valued
electronics systems.
k Technology’s products are used in aerospace satellites, avionics and military aircraft such as the F35, F-22 and F-16 fighter planes. k Technology thermal management products also cool high power
density electronic packaging, power electronics and other applications requiring high-performance
heat transfer.
The k-Core Product Line
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Patented encapsulated APG material system has three times the conductivity (k) of copper
with the mass of aluminium
APG graphite provides a high k path
Encapsulant sets the CTE and structural properties
Encapsulant material is selected to satisfy requirements
Drop-in replacement for conventional conduction solutions
BCF MKM Matériel Thermique et Electronique
Société Anonyme au capital de 99 091 Euro
Siret : 384 361 861 00022 – Code APE : 4652Z TVA N° : FR 35 384 361 861
B.P. 30139 F-02204 SOISSONS Cedex France
Siège Social : Les Terrasses du Mail 02880 CUFFIES
tél : +33 (0)3 23 53 09 58 fax : +33 (0)3 23 53 74 93
e-mail général : [email protected] Site web : http://www.bcfmkm.fr
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Fichier : BCFMKM_Thermacore_Advanced Solid Conduction k-Core_082010.doc
Création : 05/08/2010 11:46
Subject to change without notice, please ask for the last updated révision
Table 1 k-Core Material Properties with Various Encapsulant Materials
Thermal
Conductivity
(W/mK)
Material
Density (g/cm )
w/o APG with k- w/o
insert
Core APG
insert
390.0
1176.0 8.90
Copper (OFHC)
220.0
Beryllium
Aluminium Beryllium 210.0
(62% Be)
180.0
Aluminium (6061)
126.0
AlSi (40% Si)
3
Coefficient of Specific
Thermal
Conductivity
Expansion
(conductivity/
(CTE) (ppm/K) density)
(W/m·K/g/cm3)
with kCore
4.92
16.9
w/o APG with
insert
k-Core
43.8
239.2
1108.0 1.80
2.08
13.5
122.2
533.7
1104.0 2.10
2.20
13.9
100.0
502.7
1092.0 2.80
2.48
23.6
64.3`
441.0
1070.4 2.53
2.37
15.0
49.8
452.0
Magnesium (AZM)
79.0
1051.6 1.80
2.08
27.3
43.9
506.6
Kovar
14.0
1025.6 8.40
4.72
5.9
1.7
217.5
Custom thermal management solutions tailored to specific user needs. From one-of-a-kind spacecraft
components that satisfy specific and demanding requirements to the production of thousands of
thermal cores and heat spreaders to a given specification, k Technology has the expertise and
experience to solve your thermal management challenges.
BCF MKM Matériel Thermique et Electronique
Société Anonyme au capital de 99 091 Euro
Siret : 384 361 861 00022 – Code APE : 4652Z TVA N° : FR 35 384 361 861
B.P. 30139 F-02204 SOISSONS Cedex France
Siège Social : Les Terrasses du Mail 02880 CUFFIES
tél : +33 (0)3 23 53 09 58 fax : +33 (0)3 23 53 74 93
e-mail général : [email protected] Site web : http://www.bcfmkm.fr
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