Publications dans des revues à comité de lecture

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Publications dans des revues à comité de lecture
Publications dans des revues à comité de lecture
"Purification and characterization of a novel glucuronan lyase from Trichoderma sp.
GL2.", Delattre C., Michaud P., Keller C., Elboutachfaiti R., Beven L., Courtois B., Courtois
J., 2006 Applied microbiology and biotechnology. 70 437-443
"Guest Editorial", Courtois B., 10.1007/s10470-005-2588-8 2005 Analog Integrated
Circuits and Signal Processing August, Volume 44, Number 2 107
"A sweeping mode integrated fingerprint sensor with 256 tactile microbeams",
Charlot B., Parrain F., Galy N., Basrour S., Courtois B., 10.1109/JMEMS.2004.832195
2004 Journal-of-Microelectromechanical-Systems 13(4) 636-44
"Guest Editorial", Courtois B., Korvink J.G., 10.1023/B:ALOG.0000032627.96167.ef
2004 Analog Integrated Circuits and Signal Processing August, Volume 40, Number 2
115-116
"Microsystem Technologies: Foreword to special issue on Design, Test, Integration
and
Packaging
of
MEMS/MOEMS,
2003",
Courtois
B.,
Michel
B.,
10.1007/s00542-004-0419-y 2004 Microsystem Technologies August, Volume 10,
Number 5 345
"Simulation of ion propagation in the microbeam line of CENBG using GEANT4",
Incerti S., Barberet P., Courtois B., Michelet-Habchi C., Moretto P.,
10.1016/S0168-583X(03)01036-X
"From Microelectronics to Integrated Microsystems Testing", Mir S., Charlot B., 2003
Nano et micro technologies Vol3/1-2 249-270
"Building an analogue fault simulation tool and its application to MEMS", Roman C.,
Mir S., Charlot B., 10.1016/S0026-2692(03)00162-9 2003 Microelectronics Journal 34(10)
897-906
"Analog Integrated Circuits and Signal Processing Foreword", Courtois B.,
10.1023/A:1016079805767 2002 Analog Integrated Circuits and Signal Processing
Volume 32, Number 1 5-5
"Studies of low molecular weight samples generated by ultrasonic treatment of
glucuronans with various acetylation degree.", Pau-Roblot C., Petit E., Sarazin C.,
Courtois J., Courtois B., Barbotin J.N., Seguin J.P., 2002 Biopolymers 64 34-43
"A scalable multi-functional thermal test chip family: design and evaluation",
Benedek Z., Courtois B., Farkas G., Kollar E., Mir S., Poppe A., Rencz M., Szekely V.,
Torki K., 10.1115/1.1389846 2001 Transactions of the ASME - Journal of Electornic
Packaging 123(4) 323-30
"Generation of electrically induced stimuli for MEMS self-test", Charlot B., Mir S.,
Parrain F., Courtois B., 10.1023/A:1012860420235 2001 Journal of Electronic Testing:
Theory and Applications 17(6) 459-70
"Fault simulation of MEMS using HDLs", Charlot B., Mir S., Courtois B., 2001 Journal of
Modeling and Simulation of Microsystems 2(1) 35-42
"Generation of electrically induced stimuli for MEMS self-test", Charlot B., Mir S.,
Parrain
F.,
Courtois
B.,
10.1023/A:1012860420235
2001
Journal-of-Electronic-Testing:-Theory-and-Applications. Dec. 17(6) 459-70
"Fault simulation of MEMS using HDLs", Charlot B., Mir S., Courtois B., 2001
Journal-of-Modeling-and-Simulation-of-Microsystems 2(1) 35-42
"Guest Editorial", Courtois B., 10.1023/A:1011242326400 2001 Analog Integrated
Circuits and Signal Processing October, Volume 29, Numbers 1-2 5-6
"Design of an APS CMOS Image Sensor for Low Light Level Applications Using
Standard CMOS Technology", Courtois B., Karam J.M., Goy J., Pressecq F., 2001
Analog Integrated Circuits and Signal Processing Volume 29 , Issue 1-2
October-November 2001 95 - 104
"Deformable magnetic mirror for adaptive optics: technological aspects", Cugat O.,
Basrour S., Divoux C., Mounaix P., Reyne G., 10.1016/S0924-4247 2001 Sensors and
Actuators A 89, issues 1-2 1-9
"Design of an APS CMOS Image Sensor for Low Light Level Applications Using
Standard CMOS Technology", Goy J., Courtois B., Karam J.M., Pressecq F.,
10.1023/A:1011286415014
2001
Analog-Integrated-Circuits-and-Signal-Processing
Oct.-Nov. 29(1-2) 95-104
"Microbeams with electronically controlled high thermal impedance", Mir S., Parrain
F., Charlot B., Veychard D., 10.1023/A:1011282314105 2001 Analog Integrated Circuits
and Signal Processing 29(1-2) 71-83
"THERMODEL: A Tool for Thermal Model Generation, and Application for MEMS",
Szekely V., Rencz M., Poppe A., Courtois B., 10.1023/A:1011226213197 2001 Analog
Integrated Circuits and Signal Processing October, Volume 29, Numbers 1-2 49-59
"THERMODEL: A Tool for Thermal Model Generation, and Application for MEMS",
Szekely V., Courtois B., Poppe A., Rencz M., 10.1023/A:1011226213197 2001 Analog
Integrated Circuits and Signal Processing Volume 29, Numbers 1-2 49 - 59
"Measurement of residual stresses in a plate using bulging test and a dynamic
technique: application to electroplated nickel coatings", Basrour S., Robert L.,
Delobelle P., 10.1016/S0921-5093 2000 Materials Science and Engineering 288, issue 2
160-163
"X-ray characterization of residual stresses in electroplated nickel used in LIGA
technique", Basrour S., Robert L., 10.1016/S0921 2000 Materials Science and
Engineering 288, Issue 2 270-274
"Analog ALC crystal oscillators for high-temperature applications", Bianchi R.A.,
Karam J.M., Courtois B., 10.1109/4.818915 2000 IEEE-Journal-of-Solid-State-Circuits
35(1); Janv. 2000 2-14
"ALC crystal oscillators based pressure and temperature measurement integrated
circuit for high temperature oil well applications", Bianchi R.A., Karam J.M., Courtois
B.,
10.1109/58.869071
2000
IEEE-Transactions-on-Ultrasonics,-Ferroelectrics-and-Frequency-Control Sept. 2000;
Volume: 47, Issue: 5 1241-1245
"CMOS-compatible temperature sensor with digital output for wide temperature
range applications", Bianchi R.A., Karam J.M., Courtois B., Nadal R., Pressecq F., Sifflet
S., 10.1016/S0026-2692(00)00062-8 2000 Microelectronics-Journal Sept. -Oct. 31(9-10):
803-10
"Design of self-checking fully differential circuits and boards", Lubaszewski M., Mir
S., Kolarik V., Nielsen C., Courtois B., 10.1109/92.831432 2000 IEEE Transactions on
Very Large Scale Integration VLSI Systems 8(2): April 113-28
"Extending fault-based testing to microelectromechanical systems", Mir S., Charlot
B., Courtois B., 10.1023/A:1008303717862 2000 Journal of Electronic Testing: Theory and
Applications 16(3): June 279-88
"Extending Fault-Based Testing to Microelectromechanical Systems", Mir S., Charlot
B., Courtois B., 10.1023/A:1008303717862 2000 Journal of Electronic Testing une 2000,
Volume 16, Number 3 279-288
"Extending Fault-Based Testing to Microelectromechanical Systems", Mir S., Charlot
B., Courtois B., 10.1023/A:1008303717862 2000 Journal of Electronic Testing Volume 16,
Number 3, June 279 - 288
"Microsystems for space applications", Palan B., Santos F.V., Courtois B., Husak M.,
2000 Acta-Polytechnica,-Czech-Technical-University-in-Prague 40(3) 53-7
"IDDQ Testing of Submicron CMOS#by Cooling?", Rencz M., Szekely V., Töröka S.,
Torki K., Courtois B., 10.1023/A:1008364515030 2000 Journal of Electronic Testing
October, Volume 16, Number 5 453-461
"The morphology and electrochemical behavior of electrodeposited nickel onto
metallized silicon", Robert L., Basrour S., Wery M., Sittler F., 2000
Plating-and-Surface-Finishing 87(5) 153-9
"New approaches in the transient thermal measurements", Szekely V., Ress S.,
Poppe A., Töröka S., Magyari D., Benedek Z., Torki K., Courtois B., Rencz M.,
10.1016/S0026-2692(00)00051-3 2000 Microelectronics Journal Volume 31, Issues 9-10 ,
October 727-733
"Fault simulation of MEMS using HDLs", Charlot B., Mir S., Courtois B., 1999 Journal of
Modeling and Simulation of Microsystems 1(1) 8
"Fault simulation of MEMS using HDLs", Charlot B., Courtois B., Mir S., 1999
Journal-of-Modeling-and-Simulation-of-Microsystems 1(1) 8
"Guest Editors' Introduction", Courtois B., Blanton R.D., 10.1109/MDT.1999.808199
1999 IEEE Design & Test of Computers Volume: 16 , Issue: 4 16-17
"Design of self-checking fully differential circuits and boards", Lubaszewski M., Mir
S.,
Kolarik
V.,
Nielsen
C.,
Courtois
B.,
10.1109/92.831432
1999
IEEE-Transactions-on-Very-Large-Scale-Integration-VLSI-Systems 2 1058-1061 vol.2
"Dynamic determination of Young's modulus of electroplated nickel used in LIGA
technique", Majjad H., Basrour S., Delobelle P., Schmidt M., 10.1016/S0924-4247 1999
Sensors and Actuators A A74(1-3) 148-51
"On the integration of design and test for chips embedding MEMS", Mir S., Charlot
B., 10.1109/54.808204 1999 IEEE Design and Test Computers 16(4) 28-38
"Sensor interface circuit for ISFET based sensors", Palan B., Vinci-Dos-Santos F.,
Karam J.M., Courtois B., Husak M., 1999 Journal-of-Solid-State-Devices-and-Circuits 7(1);
feb. 1999 17-23
"A step forward in the transient thermal characterization of chips and packages",
Szekely V., Rencz M., Courtois B., 10.1016/S0026-2714(98)00198-X 1999
Microelectronics and Reliability 39(1):; Jan. 1999 89-96
"Thermal monitoring and testing of electronic systems", Szekely V., Rencz M., Pahi
A.,
Courtois
B.,
10.1109/6144.774737
1999
IEEE-Transactions-on-Components-and-Packaging-Technologies 22 Issue 2; June 1999
231 - 237
"CMOS-compatible smart temperature sensors", Bianchi R.A., Dos-Santos F.V.,
Karam J.M., Courtois B., Pressecq F., Sifflet S., 10.1016/S0026-2692(98)00026-3 1998
Microelectronics Journal September 1998 627-636
"CMOS compatible temperature sensor based on the lateral bipolar transistor for
very wide temperature range applications", Bianchi R.A., Dos-Santos F.V., Karam J.M.,
Courtois B., Pressecq F., Sifflet S., 1998 Sensors-and-Actuators-A-Physical Nov. 1998;
A71(1-2): 3-9
"CAD tools and foundries to boost microsystems development", Courtois B., Karam
J.M., Lubaszewski M., Szekely V., Rencz M., Hofmann K., Glesner M., 1998
Materials-Science-&-Engineering-B-Solid-State-Materials-for-Advanced-Technology
7
Feb. 1998; B51(1-3): 242-53
"Deformable mirror using magnetic membranes: application to adaptive optics in
astrophysics", Divoux C., Cugat O., Reyne G., Boussey-Said J., Basrour S.,
10.1109/20.717841 1998 IEEE Transactions on Magnetics 34(5) 3564-7
"A Reliable Fail-Safe System", Lubaszewski M., Courtois B., 10.1109/12.663771 1998
IEEE Transactions on Computers February 1998; Vol. 47, No. 2 236-241
"Reliable fail-safe systems", Lubaszewski M., Courtois B., 10.1109/12.663771 1998
IEEE Transactions on Computers February 1998 ; Vol. 47, No. 2 236-241
"An electrostatic microactuator using LIGA process for a magnetic head tracking
system of hard disk drives", Nakamura S., Suzuki K., Ataka M., Fujita H., Basrour S.,
Soumann V., De-Labachelerie M., 10.1007/s005420050144 1998 Microsystem
Technologies 5(2) 69-71
"Micromachined planar spiral inductor in standard GaAs HEMT MMIC technology",
Ribas R.P., Lescot J., Leclercq J.L., Bennouri N., Karam J.M., Courtois B.,
10.1109/55.704401 1998 IEEE-Electron-Device-Letters Aug. 1998; 19(8) 285-7
"Study of suspended microstrip and planar spiral inductor built using GaAs
compatible micromachining", Ribas R.P., Bennouri N., Karam J.M., Courtois B., 1998
Journal-of-Solid-State-Devices-and-Circuits Feb. 1998; 6(1) 11-16
"Tracing the Thermal Behavior of ICs", Szekely V., Rencz M., Courtois B.,
10.1109/54.679204 1998 IEEE Design and Test of Computers April-June 1998 ; Vol. 15,
No. 2 14-21
"Thermal monitoring of self-checking systems", Szekely V., Rencz M., Karam J.M.,
Lubaszewski
M.,
Courtois
B.,
10.1023/A:1008233907036
1998
Journal-of-Electronic-Testing:-Theory-and-Applications Feb.-April 1998; Volume 12,
Numbers 1-2 81-92
"Microgrippers fabricated by the LIGA technique", Ballandras S., Basrour S., Robert
L.,
Megtert
S.,
Blind
P.,
Roulliay
M.,
Bernede
P.,
Daniau
W.,
10.1016/S0924-4247(97)01396-4 1997 Sensors and Actuators A Vol.58, Issue 3 265-272
"Access to microsystem technology: the CMP services solution", Courtois B.,
10.1016/S0026-2692(96)00066-3 1997 Microelectronics Journal Volume 28, Issue 4 ,
May 1997 407-417
"CAD tools for bridging microsystems and foundries", Karam J.M., Courtois B.,
Boutamine H., 10.1109/54.587739 1997 IEEE-Design-&-Test-of-Computers April-June
1997 (Vol. 14, No. 2) 34-39
"Thermal transient testing", Szekely V.,
Microelectronics-International May 1997; (43) 8-10
Rencz
M.,
Courtois
B.,
1997
"Cooling as a possible way to extend the usability of I/sub DDQ/ testing", Szekely V.,
Rencz M., Töröka S., Courtois B., 1997 Electronics-Letters 4 Dec. 1997; 33(25)
2117-2118
"Fault-based testing and diagnosis of balanced filters", Courtois B., Kolarik V.,
Lubaszewski M., Mir S., 1996 Analog Integrated Circuits and Signal Processing 11(1):
September 5-19
"Fault-based ATPG for linear analog circuits with minimal size multifrequency test
sets", Courtois B., Lubaszewski M., Mir S., 1996 Journal of Electronic Testing: Theory and
Applications 9(1-2) 43-57
"Unified built-in self-test for fully differential analog circuits", Courtois B.,
Lubaszewski M., Mir S., 1996 Journal of Electronic Testing: Theory and Applications
9(1-2) 135-51
"Second Therminic Workshop", Courtois B., 10.1109/MDT.1996.10025 1996 IEEE
Design and Test of Computers Winter 1996 (Vol. 13, No. 4) 5
"Guest editorial", Kaminska B., Courtois B., 10.1007/BF00137560 1996 Journal of
Electronic Testing (Historical Archive) August, Volume 9, Numbers 1-2 7-8
"Guest Editors' Introduction: Mixed Analog and Digital Systems", Kaminska B.,
Courtois B., 10.1109/MDT.1996.500195 1996 IEEE Design and Test of Computers
Summer 1996 (Vol. 13, No. 2) 8-9
"Collective fabrication of gallium-arsenide-based microsystems", Karam J.M.,
Courtois B., Holjo M., Leclercq J.L., Viktorovitch P., 10.1117/12.251219 1996 Proceedings
of SPIE 2879 315-26
"Microsystem design framework based on tool adaptations and library
developments", Karam J.M., Courtois B., Rencz M., Poppe A., Szekely V.,
10.1117/12.250956
1996
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering 2880 236-245
"Unified built-in self-test for fully differential analog circuits", Mir S., Lubaszewski M.,
Courtois B., 10.1007/BF00137570 1996 Journal of Electronic Testing (Historical Archive)
August, Volume 9, Numbers 1-2 135-151
"Fault-based testing and diagnosis of balanced filters", Mir S., Lubaszewski M.,
Kolarik V., Courtois B., 10.1007/BF00174235 1996 Analog Integrated Circuits and Signal
Processing (Historical Archive) September, Volume 11, Number 1 5-19
"Fault-based ATPG for linear analog circuits with minimal size multifrequency test
sets", Mir S., Lubaszewski M., Courtois B., 10.1007/BF00137564 1996
Journal-of-Electronic-Testing:-Theory-and-Applications. August 1996 ; Volume 9,
Numbers 1-2 43 - 57
"Design for thermal testability (DfTT) and a CMOS realization", Szekely V., Marta C.,
Rencz M., Benedek Z., Courtois B., 1996 Sensors-and-Actuators-A-Physical 15 July
1996; A55(1) 29-33
"Deep etch X-ray lithography using silicon-gold masks fabricated by deep etch UV
lithography and electroforming", Ballandras S., Daniau W., Basrour S., Robert L.,
Roulliay M., Blind P., Bernede P., Robert D., Rocher S., Hauden D., Megtert S., Labeque
A., Zewen L., Dexpert H., Comes R., Rousseaux F., Ravet M.F., Launois H.,
10.1088/0960-1317/5/3/001 1995 Journal of Micromechanics and Microengineering Vol.5,
Issue 3 203-8
"LIGA technique application in micro-optics", Basrour S., Ballandras S., Hauden D.,
1995 Annales de Physique Vol.20, Issue 5-6 693-700
"Conference Reports", Chakravarty S., Sridhar R., Upadhyaya S., Zorian Y., Philips G.,
Kaminska B., Courtois B., 10.1109/MDT.1995.10029 1995 IEEE Design and Test of
Computers Winter 1995 (Vol. 12, No. 4) 95-97
"Analog checkers with absolute and relative tolerances", Courtois B., Kolarik V.,
Lubaszewski M., Mir S., 1995 IEEE Transactions on Computer Aided Design of Integrated
Circuits and Systems 14(5): May 607-12
"Fabrication of an electrostatic wobble micromotor using deep-etch UV lithography,
nickel electroforming and a titanium sacrificial layer", Daniau W., Ballandras S., Kubat
L., Hardin J., Martin G., Basrour S., 10.1088/0960-1317/5/4/002 1995
Journal-of-Micromechanics-and-Microengineering Vol.5, Issue4 270-5
"Built-in test for circuits with scan based on reseeding of multiple-polynomial linear
feedback shift registers", Hellebrand S., Rajski J., Tarnick S., Venkataraman S.,
Courtois B., 10.1109/12.364534 1995 IEEE Transactions on Computers February 1995
Vol. 44, No. 2 223-233
"Collective fabrication of microsystems compatible with CMOS through the CMP
service", Karam J.M., Courtois B., Paret J.M., 10.1016/0921-5107(95)01337-7 1995
Materials-Science-&-Engineering-B-Solid-State-Materials-for-Advanced-Technology
December 1995; Volume 35, Issues 1-3 219-223
"Analog checkers with absolute and relative tolerances", Kolarik V., Mir S.,
Lubaszewski
M.,
Courtois
B.,
10.1109/43.384424
1995
IEEE-Transactions-on-Computer-Aided-Design-of-Integrated-Circuits-and-Systems
Volume: 14, Issue: 5 607-612
"CAD framework concept for the design of integrated microsystems", Poppe A.,
Rencz M., Szekely V., Karam J.M., Courtois B., Hofmann K., Glesner M.,
10.1117/12.221171
1995
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering.
September
1995; 2642 215-224
"Multi
project
chip
service
in
France",
Courtois
B.,
Journal-of-the-Institute-of-Electronics,-Information-and-Communication-Engineers
1994; 77(1) 46-51
1994
Jan.
"CAD and testing of ICs and systems: where are we going?", Courtois B., 1994
Journal-of-Microelectronic-Systems-Integration. Sept. 1994; 2(3) 139-201
"Deep etch lithography at LURE-D.C.I. storage ring", Megtert S., Labeque A., Liu Z.W.,
Dexpert H., Comes R., Rousseaux F., Ravet M.F., Launois H., Ballandras S., Daniau W.,
Basrour S., Roulliay M., Blind P., Hauden D., 1994 Journal de Physique IV Colloque 4(C9)
269-72
"Electronic systems CAD", Bayle P., Courtois B., Dana M., 1993 L'Onde-Electrique.
Nov.-Dec. 1993; 73(6) 25-31
"A study of structural phase transitions by infrared spectroscopy of vibrational
excitons: application to crystalline phenothiazine", Guerin R., Courtois B., Rezzouk A.,
Le-Roy
A.,
1993
Comptes-Rendus-de-l'Academie-des-Sciences
Serie-II-Mecanique,-Physique,-Chimie-Sciences-de-la-Terre-et-de-l'Univers. 18 Feb.
1993; 316(4) 441-8
"Design of built-in current sensors for concurrent checking in radiation
environments", Nicolaidis M., Vargas F., Courtois B., 10.1109/23.273553 1993 IEEE
Transactions on Nuclear Science Dec. ; 40(6) pt. 1 1584-90
"Design of built-in current sensors for concurrent checking in radiation
environments", Nicolaidis M., Vargas F., Courtois B., 10.1109/23.273553 1993
IEEE-Transactions-on-Nuclear-Science Volume: 40 , Issue: 6 , Part 1-2 1584 - 1590
"Multiple adjacent image processing for automated failure location using electron
beam testing [VLSI]", Conard D., D. Russell J., Laurent J., Courtois B., Skaf A.,
10.1016/0026-2714(92)90463-U 1992 Microelectronics and Reliability Volume 32, Issue
11 , November 1992 1615-1620
"E-beam testing using multiple adjacent image processing for prototype validation",
Russell J. D., Vargas F., Courtois B., 10.1016/0167-9317(92)90362-U 1992
Microelectronic Engineering Volume 16, Issues 1-4 , March 1992 413-420
"Chemical bonds and spin properties of a-Si/sub x/Ge/sub y/:H/sub z/ alloys",
Basrour S., Bustarret E., Bruyere J.C., 10.1016/0040-6090(91)90304-G 1991 Thin Solid
Films 205(2) 223-6
"Nature of deep defects in bulk VHF-GD a-Si:H", Favre M., Shah A., Hubin I., Bustarret
E., Hachicha M.A., Basrour S., 10.1016/S0022-3093(05)80124-3 1991 Journal of Non
Crystalline Solids 137-138 pt.1 335-8
"Band tails and deep-defect density of states in hydrogenated amorphous
germanium", Godet C., Bouizem Y., Chahad L., El-Zawawi I., Theye M.L., Meaudre M.,
Meaudre R., Basrour S., Bruyere J.C., 1991 Physical Review B 44(11) 5506-9
"Photoconductivity and fluorescence properties of divalent ytterbium ions in
fluoride crystals", Moine B., Courtois B., Pedrini C., 10.1016/0022-2313(91)90179-Y
1991 Journal of Luminescence Volumes 48-49, Part 2 , January-February 1991 501-504
"Photoionization and luminescences in BaF/sub 2/:Eu/sup 2", Moine B., Courtois B.,
Pedrini C., 10.1016/0022-2313(91)90007-I 1991 Journal of Luminescence Volume 50,
Issue 1 , May-June 1991 31-38
"Silicon compilation of hierarchical control sections with unified BIST testability",
Nicolaidis M., Torki K., Jerraya A.A., Courtois B., 10.1016/0141-9331(91)90067-P 1991
Microprocessors and Microsystems June ; 15(5) 257-69
"Failure analysis using E-beam", Collin J., Conard D., Courtois B., Denis P., Savart D.,
10.1016/0167-9317(90)90045-U 1990 Microelectronic Engineering Volume 12, Issues 1-4
, May 1990 305-324
"High-level tools and methods for electron-beam debug and failure analysis of
integrated circuits", Conard D., Courtois B., Laurent J., Marzouki M., 1990
Periodica-Polytechnica 34(4) 281-304
"Fluorescence, photoconductivity and polarization properties of divalent rare earth
ions
in
fluoride
crystals",
Moine
B.,
Courtois
B.,
Pedrini
C.,
10.1016/0022-2313(90)90159-9 1990 Journal of Luminescence Volume 45, Issues 1-6 ,
January-February 1990 248-250
"Random Pattern Testing Versus Deterministic Testing of RAMs", David R., Fuentes
A., Courtois B., 10.1109/12.24267 1989 IEEE Transactions on Computers May 1989 (Vol.
38, No. 5) 637-650
"The SYCO silicon compiler", Jerraya A.A., Courtois B., Mhaya N., Jamier R., Geronimi
J., Bekkara N., 1989 Technique-et-Science-Informatiques 8(6) 489-507
"Luminescence and photoionization processes of Yb/sup 2+/ in CaF/sub 2/, SrF/sub
2/ and BaF/sub 2/", Moine B., Courtois B., Pedrini C., 1989 Journal de Physique Aug. ;
50(15) 2105-19
"Self-checking logic arrays", Nicolaidis M., Courtois B., 1989 Microprocessors and
Microsystems May; 13(4) 281-90
"Definition and design of strongly language disjoint checkers", Jansch I., Courtois B.,
10.1109/12.2215 1988 IEEE Transactions on Computers June; 37(6) 745-8
"SYCO-a silicon compiler for VLSI ASICs specified by algorithms", Jerraya A.A.,
Mhaya N., Geronimi J., Courtois B., 1988 Computer Aided Engineering Journal 5(3): June
122-30
"Strongly code disjoint checkers", Nicolaidis M., Courtois B., 10.1109/12.2217 1988
IEEE Transactions on Computers June ; 37(6) 751-6
"Strongly Code Disjoint Checkers", Nicolaidis M., Courtois B., 10.1109/12.2217 1988
IEEE Transactions on Computers June 1988 (Vol. 37, No. 6) 751-756
"An integrated debugging system based on E-beam test", Guiguet I., Marzouki M.,
Courtois B., 10.1016/S0167-9317(87)80022-9 1987 Microelectronic Engineering 7(2-4)
275-82
"Design methods of electron beam sensitive devices in NMOS and CMOS
technologies", Micollet D., Courtois B., 10.1016/S0167-9317(87)80038-2 1987
Microelectronic Engineering 7(2-4) 419-26
"Automatic failure of analysis of VLSI circuits using E-beam", Savart D., Courtois B.,
10.1016/S0167-9317(87)80020-5 1987 Microelectronic Engineering 7(2-4) 259-66
"Testing CMOS: a challenge", Baschiera D., Courtois B., 1984 VLSI Design Oct. ; 5(10)
58-62
"A new domain for image analysis: VLSI circuits testing, with ROMUALD,
specialized in parallel image processing", Rubat-Du-Merac C., Jutier P., Laurent J.,
Courtois B., 10.1016/0167-8655(83)90074-0 1983 Pattern recognition letters July ; 1(5-6)
347-57
"SKALP: skeleton architecture for fault-tolerant distributed processing", Courtois B.,
Marinescu M., Pons J.-F., 1981 Microprocessing-&-Microprogramming May ; 7(5) 312-25
"Safety, availability, and maintenance evaluation for redundant systems", Courtois
B., 1981 Digital Processes 7(1) 47-64
"Safety and reliability of non-repairable systems", Courtois B., 1976 Digital-Processes
Winter ; 2(4) 341-6
Proceedings à comité de lecture
"Global simulation and co-simulation of Self Powered Micro Systems", Ammar Y.,
Basrour S., Zenati A., Matou K., Cusinu P., 2005 178-181 Symposium on Design, Test,
Integration and Packaging of MEMS/MOEMS (DTIP'05), June 1-3 TIMA Symposium on
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'05), June 1-3
"Design and fabrication of piezoelectric micro power generators for autonomous
microsystems", Basrour S., Charlot B., Marzencki M., Grasso A., Colin M., Valbin L.,
2005 299-302 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
(DTIP'05), June 1-3 TIMA Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS (DTIP'05), June 1-3
"Fabrication and characterization of high damping electrostatic micro devices for
vibration energy scavenging", Basrour S., Chaillout J.J., Charlot B., Despesse G., Jager
T., Leger J.M., Vassilev A., 2005 386-390 Symposium on Design, Test, Integration and
Packaging of MEMS/MOEMS (DTIP 2005), June 1-3 TIMA Symposium on Design, Test,
Integration and Packaging of MEMS/MOEMS (DTIP 2005), June 1-3
"High Damping Electrostatic System For Vibration Energy Scavenging", Basrour S.,
Charlot B., Despesse G., Chaillout J.J., Dekkaki I., Jager T., Leger J.M., Vassilev A., 2005
375 - 378 Technical Proceedings of the 2005 NSTI Nanotechnology Conference and
Trade Show NSTI Technical Proceedings of the 2005 NSTI Nanotechnology Conference
and Trade Show
"Design, Modelling and Optimisation of Integrated Piezoelectric Micro Power
Generators", Basrour S., Charlot B., Marzencki M., 2005 545 - 548 Technical
Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
NSTI Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade
Show, Volume 3
"5B:Emerging technologies - reliable and fault-tolerant wireless sensor networks",
Courtois B., Kaminska B., 10.1109/VTS.2005.16 2005 173 IEEE Comput. Soc, Los
Alamitos, CA, USA 23rd-IEEE-VLSI-Test-Symposium.
"A bi-stable micro-machined piezoelectric transducer for mechanical to electrical
energy transformation", Dogheche K., Cavallier B., Delobelle P., Hirsinger L., Cattan E.,
Remiens D., Marzencki M., Charlot B., Basrour S., Ballandras S., 2005 3 DTIP of MEMS
"A Bi-stable Micro-machined Piezoelectric Transducer for Mechanical to Electrical
Energy Transformation", Dogheche K., Cavallier B., Delobelle P., Hirsinger L., Cattan E.,
Rèmiens D., Marzencki M., Charlot B., Basrour S., Ballandras S., 2005 303-304
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'05),
June 1-3 TIMA Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
(DTIP'05), June 1-3
"Thermal characterization and modeling of stacked die packages", Szabo P., Rencz
M., Szekely V., Poppe A., Farkas G., Courtois B., 2005 IPACK2005-73437 ASME
Technical Conference and Exhibition on Integration and Packaging of Micro, Nano and
Electronic Systems (InterPACK'05), San Francisco, Ca., USA, July 17-22
"Fabrication and characterization of high-Q microresonators using thin plate
mechanical mod", Basrour S., Coudevylle J.R., De-Labachelerie M., 10.1117/12.524751
2004 273-283 Proceedings of SPIE -- Volume 5343 Reliability, Testing, and
Characterization of MEMS/MOEMS III SPIE Proceedings of SPIE -- Volume 5343
Reliability, Testing, and Characterization of MEMS/MOEMS III
"Behavioural modeling of micro-batteries for Self Powered Micro Systems", Basrour
S., Ammar Y., 2004 10-105 Design, Test, Integration, and Packaging of MEMS/MOEMS
(DTIP'04), May 12-14 TIMA Laboratory Design, Test, Integration, and Packaging of
MEMS/MOEMS (DTIP'04), May 12-14
"Infrastructures for education, research and industry in microelectronics - a
review", Courtois B., 10.1109/DELTA.2004.10010 2004 149-54 IEEE Comput. Soc, Los
Alamitos,
CA,
USA
DELTA-2004.-Second-IEEE-International-Workshop-on-Electronic-Design,-Test-and-Applications.
"On-chip testing of embedded transducers", Mir S., Rufer L., Charlot B., Courtois B.,
10.1109/ICVD.2004.1260965
2004
463-72
Proceedings.-17th-International-Conference-on-VLSI-Design. IEEE Comput. Soc, Los
Alamitos, CA, USA Proceedings 17th International Conference on VLSI Design
"On-chip testing of embedded silicon transducers", Mir S., Charlot B., Rufer L.,
Courtois
B.,
10.1109/SOCC.2004.1362334
2004
13-18
Proceedings.-IEEE-International-SOC-Conference-IEEE-Cat.-No.04TH8744.
IEEE,
Piscataway,
NJ,
USA,
Proceedings.-IEEE-International-SOC-Conference-IEEE-Cat.-No.04TH8744
"On-chip testing of embedded silicon transducers", Mir S., Rufer L., Charlot B.,
Courtois B., 10.1109/ICM.2004.1434190 2004 1-7 IEEE, Piscataway, NJ, USA
The-16th-International-Conference-on-Microelectronics-IEEE-Cat.-No.04EX918
"A procedure to correct the error in the structure function based thermal measuring
methods", Rencz M., Poppe A., Kollar E., Ress S., Szekely V., Courtois B.,
10.1109/STHERM.2004.1291307
2004
92-7
IEEE,
Piscataway,
NJ,
USA
Twentieth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium-IEEE-C
"Increasing the accuracy of structure function based evaluation of thermal transient
measurements", Rencz M., Poppe A., Kollar E., Ress S., Szekely V., Courtois B., 2004
85-90
Vol.1
IEEE,
Piscataway,
NJ,
USA
The-Ninth-Intersociety-Conference-on-Thermal-and-Thermomechanical-Phenomena-In-Electronic-Sys
"Die attach quality control of 3D stacked dies", Rencz M., Szekely V., Courtois B.,
Zhang L., Howard N., Nguyen L., 10.1109/IEMT.2004.1321636 2004 78-84 IEEE,
Piscataway,
NJ,
USA
IEEE/CPMT/SEMI-29th-International-Electronics-Manufacturing-Technology-Symposium-IEEE-Cat.-N
"Thermal qualification of 3D stacked die packages", Rencz M., Farkas G., Szekely V.,
Poppe
A.,
Courtois
B.,
2004
30-5
IEEE,
Piscataway,
NJ,
USA
Proceedings-of-6th-Electronics-Packaging-Technology-Conference-EPTC-2004-IEEE-Cat.-No.04EX9
"Single molecule detection and macromolecular weighting using an
all-carbon-nanotube nanoelectromechanical sensor", Roman C., Ciontu F., Courtois
B., 2004 263-6 IEEE, Piscataway, NJ, USA 4th IEEE Conference on Nanotechnology.
16-19 Aug. 2004 Munich, Germany
"A sweeping mode integrated tactile fingerprint sensor", Charlot B., Parrain F., Galy
N., Courtois B., 10.1109/JMEMS.2004.832195 2003 1031-4 vol.2 IEEE, Piscataway, NJ,
USA
TRANSDUCERS-'03.-12th-International-Conference-on-Solid-State-Sensors,-Actuators-and-Microsys
"Information coding and intramolecular integration of logic functionality", Ciontu F.,
Roman C., Courtois B., 2003 117-20 vol.2 Computational Publications, Cambridge, MA,
USA
2003-Nanotechnology-Conference-and-Trade-Show.-Nanotech-2003.-Nanotech-2003-Joint-Meeting."Fabrication and characterization of high Q microresonators using thin plate
mechanical
mode",
Coudevylle
J.-R.,
Basrour
S.,
De-Labachelerie
M.,
10.1117/12.524751
2003
273-83
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Electro-thermal simulation for the prediction of chip operation within the package",
Rencz M., Szekely V., Poppe A., Torki K., Courtois B., 2003 168-75 IEEE, Piscataway, NJ,
USA
Nineteenth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium-Cat.-N
"Boundary condition independent dynamic compact models of packages and heat
sinks from thermal transient measurements", Rencz M., Farkas G., Szekely V., Poppe
A.,
Courtois
B.,
2003
479-84
IEEE,
Piscataway,
NJ,
USA
Proceedings-of-the-5th-Electronics-Packaging-Technology-Conference-EPTC-2003
"A methodology for the generation of dynamic compact models of packages and
heat sinks from thermal transient measurements", Rencz M., Farkas G., Poppe A.,
Szekely
V.,
Courtois
B.,
2003
117-23
IEEE,
Piscataway,
NJ,
USA
IEEE/CPMT/SEMI.-28th-International-Electronics-Manufacturing-Technology-Symposium-Cat.-No.03C
"Algorithmic and modeling aspects in the electro-thermal simulation of thermally
operated microsystems", Rencz M., Szekely V., Poppe A., Courtois B., 2003 476-9 vol.2
Computational
Publications,
Cambridge,
MA,
USA
2003-Nanotechnology-Conference-and-Trade-Show.-Nanotech-2003.-Nanotech-2003-Joint-Meeting."Electro-thermal simulation of MEMS elements", Rencz M., Szekely V., Poppe A.,
Courtois
B.,
2003
15-20
IEEE,
Piscataway,
NJ,
USA
Design,-Test,-Integration-and-Packaging-of-MEMS/MOEMS-2003-IEEE-Cat.-No.03EX713
"Access to microsystem technology: the CMP services solution", Charlot B., Courtois
B., Delori H., Paillotin J.F., Torki K., 2002 47-53 vol.1 IEEE, Piscataway, NJ, USA
2002-23rd-International-Conference-on-Microelectronics.-Proceedings-Cat.-No.02TH8595
"Application-specific architecture for quantum cellular automata", Ciontu F., Courtois
B.,
Cucu
C.,
2002
351-4
IEEE,
Piscataway,
NJ,
USA
Proceedings-of-the-2002-2nd-IEEE-Conference-on-Nanotechnology-Cat.-No.02TH8630
"SystemC-based cosimulation for global validation of MOEMS", Kriaa L., Youssef W.,
Nicolescu G., Martinez S., Levitan S., Martinez J., Kurzweg T., Jerraya A.A., Courtois B.,
2002
4755:
64-70
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Application of multi-domain and multi-language cosimulation to an optical MEM
switch design", Nicolescu G., Martinez S., Kriaa L., Youssef W., Yoo S., Charlot B.,
Jerraya A.A., 10.1109/ASPDAC.2002.994958 2002 426-31 IEEE Comput. Soc, Los
Alamitos,
CA,
USA
Proceedings-of-ASP-DAC/VLSI-Design-2002.-7th-Asia-and-South-Pacific-Design-Automation-Confere
"Design and characterization of levitated suspended RF inductors", Palan B., Torki
K., Courtois B., Husak M., 10.1117/12.462799 2002 4755: 97-104 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering.
"CMOS-compatible micromachined tactile fingerprint sensor", Parrain F., Charlot B.,
Galy N., Courtois B., 10.1117/12.462857 2002 Volume 4755; 97-104 Proceedings of SPIE
Design, Test, Integration, and Packaging of MEMS/MOEMS
"Inclusion of RC compact models of packages into board level thermal simulation
tools", Rencz M., Szekely V., Poppe A., Courtois B., 10.1109/STHERM.2002.991348
2002
71-6
IEEE,
Piscataway,
NJ,
USA
Eighteenth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium.-Proce
"Measuring interface thermal resistance values by transient testing", Rencz M.,
Szekely V., Farkas G., Courtois B., 10.1109/ITHERM.2002.1012449 2002 136-41 IEEE,
Piscataway,
NJ,
USA
ITherm-2002.-Eighth-Intersociety-Conference-on-Thermal-and-Thermomechanical-Phenomena-in-Ele
"Co-simulation of dynamic compact models of packages with the detailed models of
printed circuit boards", Rencz M., Szekely V., Poppe A., Courtois B., 2002 285-90 IEEE,
Piscataway,
NJ,
USA
Twenty-Seventh-Annual-IEEE/CPMT/SEMI-International-Electronics-Manufacturing-Technology-Symp
"An algorithm for the direct co-simulation of dynamic compact models of packages
with the detailed thermal models of boards", Rencz M., Szekely V., Poppe A., Courtois
B.,
2002
293-8
IEEE,
Piscataway,
NJ,USA
Proceedings-4th-Electronics-Packaging-Technology-Conference-EPTC-2002-Cat.-No.02EX566
"Electroacoustic interaction between SAW and vibration modes of high-aspect-ratio
electrodes built using LIGA-UV techniques on singly rotated lithium niobate
wafers", Robert L., Laude V., Basrour S., Daniau W., Pastureaud T., Ballanchras S., 2002
40-4 2001-Microelectromechanical-Systems-Conference IEEE, Piscataway, NJ, USA
2001-Microelectromechanical-Systems-Conference
"Characteristics of torsional resonator with two degrees of freedom fabricated by
UV-LIGA", Usuda T., Basrour S., Majjad H., Coudevylle J.-R., De Labacherie M., 2002
594-600
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Simulation and Characterization of High Q Microresonators Fabricated by UV #
LIGA", Basrour S., Coudevylle J.R., De-Labachelerie M., Majjad H., 2001 294 - 297
Technical Proceedings of the 2001 International Conference on Modeling and Simulation
of Microsystems NSTI Technical Proceedings of the 2001 International Conference on
Modeling and Simulation of Microsystems
"Design and test of new high Q microresonators fabricated by UV-LIGA", Basrour S.,
Majjad H., Coudevylle J.R., De-Labachelerie M., 10.1117/12.425337 2001 4408: 310-16
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering SPIE-Int. Soc.
Opt. Eng Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Electrically induced stimuli for MEMS self-test", Charlot B., Mir S., Parrain F.,
Courtois
B.,
10.1109/VTS.2001.923441
2001
210-15
Proceedings-19th-IEEE-VLSI-Test-Symposium.-VTS- IEEE Comput. Soc, Los Alamitos,
CA, USA Proceedings-19th-IEEE-VLSI-Test-Symposium.-VTS"A self-testable CMOS thermopile-based infrared imager", Charlot B., Parrain F., Mir
S., Courtois B., 2001 96-103 Design, Test, Integration, and Packaging of MEMS/MOEMS
SPIE-Int. Soc. Opt. Eng Design, Test, Integration, and Packaging of MEMS/MOEMS
"Electrically induced stimuli for MEMS self-test", Charlot B., Mir S., Parrain F.,
Courtois B., 10.1023/A:1012860420235 2001 210-15 IEEE Comput. Soc, Los Alamitos,
CA, USA Proceedings-19th-IEEE-VLSI-Test-Symposium.-VTS"A self-testable CMOS thermopile-based infrared imager", Charlot B., Parrain F., Mir
S., Courtois B., 10.1117/12.425341 2001 4408: 96-103 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Guest Editorial", Courtois B., 2001 Volume 29 , Issue 1-2 October-November 2001,
Pages: 5 - 6 Kluwer Academic Publishers Hingham, MA, USA Analog Integrated Circuits
and Signal Processing
"Design and test of an active pixel sensor (APS) for space applications", Goy J.,
Courtois B., Karam J.M., Pressecq F., 10.1117/12.426945 2001 4306: 93-9 SPIE-Int. Soc.
Opt. Eng Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"MEMS synthesis and optimization", Juneidi Z., Torki K., Charlot B., Courtois B.,
10.1117/12.425364
2001
4408;
159-64
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Global modeling and simulation of System-on-Chip embedding MEMS devices",
Juneidi Z., Torki K., Martinez S., Nicolescu G., Courtois B., Jerraya A.A.,
10.1109/ICASIC.2001.982651
2001
666-9
IEEE,
Piscataway,
NJ,
USA
ASICON-2001.-2001-4th-International-Conference-on-ASIC-Proceedings-Cat.-No.01TH8549
"Experimental observation of higher order surface acoustic modes in high aspect
ratio electroplated nickel electrodes on Y+128 lithium niobate", Laude V., Robert L.,
Pastureaud T., Wilm M., Basrour S., Daniau W., Ballandras S., Khelif A.,
10.1109/ULTSYM.2001.991619
2001
249-52
vol.1
2001-IEEE-Ultrasonics-Symposium.-Proceedings.-An-International-Symposium
IEEE
2001-IEEE-Ultrasonics-Symposium.-Proceedings.-An-International-Symposium
"Modeling and characterization of Lame-mode microresonators realized by
UV-LIGA", Majjad H., Coudevylle J.-R., Basrour S., De Labachelerie M., 2001 300-3 vol. 1
Springer
TRANSDUCERS-'01.-EUROSENSORS-XV.-11th-International-Conference-on-Solid-State-Sensors-an
"Insertion losses in micromachined free-space optical cross-connects due to fiber
misalignments", Martinez S., Courtois B., 2001 4408; 289-300 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Design issues of a multi-functional intelligent thermal test die", Poppe A., Farkas G.,
Rencz M., Benedek Z., Pohl L., Szekely V., Torki K., Mir S., Courtois B.,
10.1109/STHERM.2001.915144
2001
50-7
Seventeenth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium-Cat.
IEEE,
Piscataway,
NJ,
USA
Seventeenth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium-Cat.
"New tools and methods for the thermal transient testing of packages", Rencz M.,
Szekely V., Poppe A., Farkas G., Courtois B., 2001 Vol.4428, 268-73 IMAPS - Int.
Microelectron.
&
Packaging
Soc,
Washington,
DC,
USA
Proceedings-2001-HD-International-Conference-on-High-Density-Interconnect-and-Systems-Packagin
"Thermal and mechanical evaluation of micromachined planar spiral inductors",
Ribas R.P., Lescot J., Leclercq J.L., Courtois B., 10.1117/12.425369 2001 4408, 438-44
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"CMP: the access to advanced low cost manufacturing", Torki K., Courtois B., 2001 6
IEEE
Comput.
Soc,
Los
Alamitos,
CA,
USA
Proceedings-2001-International-Conference-on-Microelectronic-Systems-Education
"Experimental and theoretical analysis of silicon-based piezoelectric transducers
for ultrasound imaging", Ballandras S., Basrour S., Griffaton N., Gelly J.F., Lanteri F.,
10.1109/MMB.2000.893750 2000 97 - 100 Microtechnologies in Medicine and Biology, 1st
Annual International, Conference IEEE Microtechnologies in Medicine and Biology, 1st
Annual International, Conference
"Towards design and validation of mixed-technology SOCs", Courtois B., Mir S.,
Charlot B., Nicolescu G., Coste P., Parrain F., Zergainoh N., Jerraya A.A., Rencz M.,
10.1145/330855.330950 2000 29 - 33 Great Lakes Symposium on VLSI Proceedings of
the 10th Great Lakes symposium on VLSI
"Deformable magnetic mirror for adaptive optics: first results", Cugat O., Mounaix P.,
Basrour S., Divoux C., Reyne G., 10.1109/MEMSYS.2000.838475 2000 485-90
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro
Mechanical Systems (Cat. No.00CH36308) IEEE, Piscataway, NJ, USA Proceedings IEEE
Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat.
No.00CH36308)
"An induction micromotor on a permanent magnet bearing", Fernandez V., Cugat O.,
Reyne
G.,
Basrour
S.,
Gilles
P.A.,
2000
189-92
ACTUATOR-2000.-7th-International-Conference-on-New-Actuators-and-International-Exhibition-on-Sm
MESSE
BREMEN
GMBH,
Bremen,
Germany
ACTUATOR-2000.-7th-International-Conference-on-New-Actuators-and-International-Exhibition-on-Sm
"Design of an APS CMOS image sensor for space applications using standard CAD
tools and CMOS technology", Goy J., Courtois B., Karam J.M., Pressecq F.,
10.1117/12.382275
2000
4019:
145-52
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"High thermal impedance beams for suspended MEMS", Mir S., Charlot B., Parrain F.,
Veychard D., 2000 99-107 Design, Test, Integration, and Packaging of MEMS/MOEMS
SPIE-Int. Soc. Opt. Eng Design, Test, Integration, and Packaging of MEMS/MOEMS
"CMOS ISFET-based structures for biomedical applications", Palan B., Roubik K.,
Husak
M.,
Courtois
B.,
2000
502-6
IEEE,
Piscataway,
NJ,
USA
1st-Annual-International-IEEE-EMBS-Special-Topic-Conference-on-Microtechnologies-in-Medicine-an
"Design of a scalable multi-functional thermal test die with direct and boundary
scan access for programmed excitation and data measurement", Poppe A., Farkas
G., Rencz M., Benedek Z., Pohl L., Szekely V., Torki K., Mir S., Courtois B., 2000 267-72
6th-International-Workshop-on-Thermal-Investigations-of-ICs-and-Systems-plus-a-special-Half-Day-on
TIMA
Lab
6th-International-Workshop-on-Thermal-Investigations-of-ICs-and-Systems-plus-a-special-Half-Day-on
"Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages", Rencz
M., Szekely V., Kohari Z., Courtois B., 10.1109/ITHERM.2000.866817 2000 120-6 IEEE,
Piscataway,
NJ,
USA
ITHERM-2000.-The-Seventh-Intersociety-Conference-on-Thermal-and-Thermomechanical-Phenomen
"Friendly tools for the thermal simulation of power packages", Rencz M., Szekely V.,
Poppe
A.,
Courtois
B.,
2000
51-4
IEEE,
Piscataway,
NJ,
USA
IWIPP-2000.-International-Workshop-on-Integrated-Power-Packaging-Cat.-No.00EX426
"From MEMS to the global simulation of SoCs", Rencz M., Szekely V., Poppe A.,
Courtois B., 10.1117/12.405418 2000 4228: 9-20 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"THERMODEL: a tool for thermal model generation and application for MEMS
packages", Szekely V., Rencz M., Poppe A., Courtois B., 10.1117/12.382288 2000 4019;
39-49
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"New hardware tools for the thermal transient testing of packages", Szekely V.,
Rencz M., Poppe A., Courtois B., 10.1109/EPTC.2000.906348 2000 46-52 IEEE,
Piscataway,
NJ,
USA
Proceedings-of-3rd-Electronics-Packaging-Technology-Conference-EPTC-2000-Cat.-No.00EX456.
"ALC crystal oscillator based pressure and temperature integratedmeasurement
system for high temperature oil well applications", Bianchi R.A., Karam J.M., Courtois
B., 10.1109/FREQ.1999.841487 1999 1058-61 vol.2 IEEE, Piscataway, NJ, USA
European Frequency and Time Forum, 1999 and the IEEE International Frequency
Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the
"CMOS compatible temperature sensor with digital output for wide temperature
range applications", Bianchi R.A., Karam J.M., Courtois B., Nadal R., Pressecq F., Sifflet
S., 10.1016/S0026-2692(00)00062-8 1999 43-8 TIMA Lab, Grenoble, France
5th-International-Workshop-Thermal-Investigations-of-ICs-and-Systems
"Pressure and temperature integrated measurement system for high temperature oil
well applications based on ALC crystal oscillators", Bianchi R.A., Karam J.M.,
Courtois
B.,
1999
282-4
TIMA
Lab,
Grenoble,
France
5th-International-Workshop-Thermal-Investigations-of-ICs-and-Systems
"Fault simulation of MEMS using HDLs", Charlot B., Mir S., Cota E.F., Lubaszewski M.,
Courtois B., 1999 pt. 1-2, 70-7 Design, Test, and Microfabrication of MEMS and MOEMS.
SPIE-Int. Soc. Opt. Eng Design, Test, and Microfabrication of MEMS and MOEMS.
"Fault modeling of electrostatic comb-drives for MEMS", Charlot B., Moussouris S.,
Mir S., Courtois B., 1999 398-405 Design, Test, and Microfabrication of MEMS and
MOEMS SPIE-Int. Soc. Opt. Eng Design, Test, and Microfabrication of MEMS and
MOEMS
"Fault simulation of MEMS using HDLs", Charlot B., Mir S., Cota E.F., Lubaszewski M.,
Courtois B., 10.1117/12.341215 1999 3680 pt. 1-2: 70-7 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering.
"Fault modeling of electrostatic comb-drives for MEMS", Charlot B., Moussouris S.,
Mir S., Courtois B., 10.1117/12.341226 1999 3680 pt. 1-2: 398-405 SPIE-Int. Soc. Opt.
Eng Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Fault modeling of suspended thermal MEMS", Charlot B., Mir S., Cota E.F.,
Lubaszewski M., Courtois B., 10.1109/TEST.1999.805646 1999 319-28 Int. Test.
Conference,
Washington,
DC,
USA
International-Test-Conference-1999.-Proceedings-IEEE-Cat.-No.99CH37034
"Design and test of MEMS", Courtois B., Karam J.M., Mir S., Lubaszewski M., Szekely
V., Rencz M., Hofmann K., Glesner M., 10.1109/ICVD.1999.745160 1999 270-5
Proceedings Twelfth International Conference on VLSI Design IEEE Comput. Soc, Los
Alamitos, CA, USA Proceedings Twelfth International Conference on VLSI Design
"Design and test of MEMS", Courtois B., Karam J.M., Mir S., Lubaszewski M., Szekely
V., Rencz M., Hofmann K., Glesner M., 10.1109/ICVD.1999.745160 1999 270-275 IEEE
Comput.
Soc,
Los
Alamitos,
CA,
USA
Proceedings-Twelfth-International-Conference-on-VLSI-Design.-Cat.-No.PR00013
"Fault modeling of suspended thermal MEMS", Courtois B., Mir S., Charlot B., Cota
E.F., Lubaszewski M., 10.1109/TEST.1999.805646 1999 319 International Test
Conference 1999 (ITC'99) IEEE Computer Society International Test Conference 1999
(ITC'99)
"Laser diode wavelength locking using a micromachined silicon mirror", Kaou N.,
Chappaz
C.,
Basrour
S.,
De-Labachelerie
M.,
1999
765-72
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering SPIE-Int. Soc.
Opt. Eng Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Advanced integrated solution for MEMS design", Liateni K., Moulinier D., Affour B.,
Boutamine H., Karam J.M., Veychard D., Courtois B., Cao A., 10.1117/12.341194 1999
3680
pt.
1-2:
161-70
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Extending fault-based testing to microelectromechanical systems", Mir S., Charlot
B.,
Courtois
B.,
10.1109/ETW.1999.804234
1999
64-8
European-Test-Workshop-1999-Cat.-No.PR00390 IEEE Comput. Soc, Los Alamitos, CA,
USA European-Test-Workshop-1999-Cat.-No.PR00390
"Extending fault-based testing to microelectromechanical systems", Mir S., Charlot
B., Courtois B., 10.1109/ETW.1999.804234 1999 64-8 IEEE Comput. Soc, Los Alamitos,
CA, USA European-Test-Workshop-1999-Cat.-No.PR00390
"New ISFET sensor interface circuit for biomedical applications", Palan B., Santos
F.-V., Karam J.M., Courtois B., Husak M., 1999 7 Sept. 1999; B57(1-3): 63-8 Elsevier
Sensors-and-Actuators-B-Chemical
"Providing technology infrastructure for MEMS", Ribas R.P., Veychard D., Karam
J.M., Courtois B., 10.1117/12.341213 1999 3680 pt. 1-2: 298-305 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"New way for thermal transient testing [IC packaging]", Szekely V., Rencz M., Poppe
A.,
Courtois
B.,
1999
182-8
IEEE,
Piscataway,
NJ,
USA
Fifteenth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium-Cat.-No
"Simulation, testing and modeling of the thermal behavior and electro-thermal
interactions in ICs, MCMs and PWBs", Szekely V., Rencz M., Courtois B.,
10.1109/SSMSD.1999.768612 1999 168-73 IEEE, Piscataway, NJ, USA Mixed-Signal
Design, 1999. SSMSD '99. 1999 Southwest Symposium on
"Tool and method for the thermal transient evaluation of packages", Szekely V.,
Rencz M., Courtois B., 10.1117/12.368429 1999 3893: 94-103 SPIE-Int. Soc. Opt. Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Transient thermal measurements for dynamic package modeling: new
approaches", Szekely V., Ress S., Poppe A., Töröka S., Magyari D., Benedek Z., Torki
K., Courtois B., Rencz M., 1999 7-11 TIMA Lab, Grenoble, France
5th-International-Workshop-Thermal-Investigations-of-ICs-and-Systems
"Advanced low cost manufacturing from CMP service", Torki K., Courtois B.,
10.1109/MSE.1999.787009 1999 4-5 IEEE Comput. Soc, Los Alamitos, CA, USA IEEE
International Conference on Microelectronic Systems Education, 1999. MSE '99.
"3D CMOS SOI for high performance computing", Abou-Samra S.J., Aisa P.A., Guyot
A., Courtois B., 10.1145/280756.280783 1998 54 - 58 ACM, New York, NY, USA
International Symposium on Low Power Electronics and Design
"Miniaturized deformable magnetic mirror for adaptive optics", Basrour S.,
Boussey-Said J., Cugat O., Divoux C., Mounaix P., Kern P., 1998 850-857 Int. Symp. on
Astronomical Telescopes and Instrumentation. SPIE Int. Symp. on Astronomical
Telescopes and Instrumentation.
"Failure
Mechanisms
and
Fault
Classes
for
CMOS-Compatible
Microelectromechanical Systems", Castillejo A., Veychard D., Karam J.M., Mir S.,
Courtois B., 10.1109/TEST.1998.743197 1998 541 Proceedings International Test
Conference 1998 IEEE Computer Society Proceedings International Test Conference
1998
"An integrated mixed-technology design environment to support micro electro
mechanical systems development", Karam J.M., Courtois B., Cao A., Hofmann K.,
10.1117/12.323899
1998
3514:
278-86
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Microsystems testing: an approach and open problems", Lubaszewski M., Cota E.F.,
Courtois B., 10.1109/DATE.1998.655908 1998 524 - 529 Design, Automation, and Test in
Europe archive Proceedings of the conference on Design, automation and test in Europe
"A new ISFET sensor interface circuit", Palan B., Dos-Santos F.V., Karam J.M.,
Courtois
B.,
Husak
M.,
1998
171-4
vol.1
Eurosensors-XII.-Proceedings-of-the-12th-European-Conference-on-Solid-State-Tranducers-and-the-9
"Bulk micromachining characterization of 0.2 mu m HEMT MMIC technology for
GaAs MEMS design", Ribas R.P., Leclercq J.L., Karam J.M., Courtois B., Viktorovitch P.,
1998
27
Feb.
1998;
B51(1-3):
267-73
Elsevier
Materials-Science-&-Engineering-B-Solid-State-Materials-for-Advanced-Technology.
"Thermal transient testing of packages without a tester", Szekely V., Rencz M.,
Courtois
B.,
1998
236-9
IEEE,
Piscataway,
NJ,
USA
Proceedings-of-2nd-Electronics-Packaging-Technology-Conference-Cat.-No.98EX235
"Designing with 3D SOI CMOS", Abou-Samra S.J., Dudek V., Ayache F., Guyot A.,
Courtois B., Hoefflinger B., 1997 384-8 Electrochem. Soc, Pennington, NJ, USA
Proceedings-of-the-Eighth-International-Symposium-on-Silicon-on-Insulator-Technology-and-Devices
"Mechanical characterization of microgrippers realized by LIGA technique",
Ballandras S., Basrour S., Robert L., Hauden D., 10.1109/SENSOR.1997.613722 1997
599-602 International Solid State Sensors and Actuators Conference (Transducers '97).
IEEE International Solid State Sensors and Actuators Conference (Transducers '97).
"A microcatalytic support realised by LIGA technique: the devil's comb", Basrour S.,
Mougin
P.,
Pons
M.,
Bernede
P.,
Daniau
W.,
Villermaux
J.,
10.1109/SENSOR.1997.613735 1997 649-52 Proceedings of International Solid State
Sensors and Actuators Conference (Transducers '97). IEEE, New York, NY, USA
Proceedings of International Solid State Sensors and Actuators Conference (Transducers
'97).
"Engineering tool set for monolithic and hybrid microsystem design", Boutamine H.,
Karam J.M., Courtois B., Drake P., Oudinot J., El-Tahawi H., Cao A., Poppe A., Rencz M.,
Szekely
V.,
1997
76-84
SPIE-Int.
Soc.
Opt.
Eng
Proceedings-of-the-SPIE-The-International-Society-for-Optical-Engineering
"Engineering tool set for monolithic and hybrid microsystem design", Boutamine H.,
Karam J.M., Courtois B., Drake P., Oudinot J., El-Tahawi H., Cao A., Rencz M., Poppe A.,
Szekely V., 10.1117/12.284556 1997 3225: 76-84 SPIE-Int. Soc. Opt. Eng Proceedings of
SPIE -- Volume 3225 Microlithography and Metrology in Micromachining III
"Generation
of
the
HDL-A-Model
of
a
Micromembrane
from
Its
Finite-Element-Description", Hofmann K., Glesner M., Sebe N., Manolescu A., Marco S.,
Samitier J., Karam J.M., Courtois B., 10.1109/EDTC.1997.582341 1997 108 1997
European Design and Test Conference (ED&TC '97)
"CAD and foundries for microsystems", Karam J.M., Courtois B., Boutamine H., Drake
P., Poppe A., Szekely V., Rencz M., Hofmann K., Glesner M., 10.1145/266021.266317
1997 674 - 679 Annual ACM IEEE Design Automation Conference Proceedings of the
34th annual conference on Design automation
"Synchrotron radiation for microstructure fabrication", Megtert S., Roulliay M., Liu
Z.W., Kupka R., Labeque A., Casses V., Basrour S., Bernede P., 1997 745-8
AIP-Conference-Proceedings.Application of Accelerators in Research and Industry.
Fourteenth International Conference AIP AIP-Conference-Proceedings.Application of
Accelerators in Research and Industry. Fourteenth International Conference
"GaAs MEMS design using 0.2 mu m HEMT MMIC technology", Ribas R.P., Bennouri
N., Karam J.M., Courtois B., 1997 127-30 IEEE, New York, NY, USA
GaAs-IC-Symposium.-IEEE-Gallium-Arsenide-Integrated-Circuit-Symposium.-19th-Annual-Technical-D
"Thermal testing methods to increase system reliability", Szekely V., Rencz M.,
Courtois
B.,
1997
210-17
IEEE,
New
York,
NY,
USA
Thirteenth-Annual-IEEE-Semiconductor-Thermal-Measurement-and-Management-Symposium-Cat.-N
"Integrating on-chip temperature sensors into DfT schemes and BIST
architectures", Szekely V., Rencz M., Courtois B., 10.1109/VTEST.1997.600330 1997
440-5
IEEE
Comput.
Soc.
Press,
Los
Alamitos,
CA,
USA
Proceedings.-15th-IEEE-VLSI-Test-Symposium-Cat.-No.TB100125
"A step forward in the transient thermal characterization of packages", Szekely V.,
Rencz M., Courtois B., 1997 296-301 IMAPS - Int. Microelectron. & Packaging Soc,
Reston,
VA,
USA
Proceedings.-1997-International-Symposium-on-Microelectronics-SPIE-vol.3235
"CAD tools for thermal testing of electronic systems", Szekely V., Rencz M., Courtois
B.,
1997
2209-15
vol.2
ASME,
New
York,
NY,
USA
Advances-in-Electronic-Packaging-1997.-Proceedings-of-the-Pacific-Rim/ASME-International-Intersoc
"Automatic test generation for maximal diagnosis of linear analog circuits", Courtois
B., Kolarik V., Lubaszewski M., Mir S., 10.1109/EDTC.1996.494157 1996 254-8
Proceedings.-European-Design-and-Test-Conference-ED&TC-96 IEEE Comput. Soc.
Press,
Los
Alamitos,
CA,
USA
Proceedings.-European-Design-and-Test-Conference-ED&TC-96
"Some trends in CAD, test and fabrication of circuits and systems", Courtois B.,
10.1109/ICEDTM.1994.496085 1996 1-8 IEEE Comput. Soc. Press, Los Alamitos, CA,
USA
Proceedings.-Third-International-Conference-on-the-Economics-of-Design,-Test,-and-Manufacturing
"Developments at CMP service: from microelectronics to microsystems", Courtois
B., Karam J.M., Paret J.M., 1996 85-91 World Scientific, Singapore
Proceedings-of-the-European-Workshop-Microelectronics-Education
"CMP services: basic principles and developments", Courtois B., Delori H., Karam
J.M., Paillotin J.F., Torki K., 1996 417-420 Shanghai Sci. & Technol. Literature Publishing
House,
Shanghai,
China
2nd-International-Conference-on-ASIC-Proceedings-IEEE-Cat.-No.96TH8140.
"Applied design and analysis of microsystems", Karam J.M., Courtois B., Poppe A.,
Hofmann K., Rencz M., Glesner M., Szekely V., 10.1109/EDTC.1996.494351 1996 528
1996 European Design and Test Conference (ED&TC '96)
"High level CAD melds microsystems with foundries", Karam J.M., Courtois B., Bauge
M., 10.1109/EDTC.1996.494338 1996 442-447 IEEE Comput. Soc. Press, Los Alamitos,
CA, USA 1996 European Design and Test Conference (ED&TC '96)
"From the MEMS idea to the MEMS product: CAD and foundries", Karam J.M.,
Courtois B., 10.1109/WESCON.1996.553966 1996 73-8 IEEE, New York, NY, USA
Wescon/96-Conference-Proceedings
"Automatic Test Generation for Maximal Diagnosis of Linear Analogue Circuits", Mir
S., Courtois B., Lubaszewski M., Kolarik V., 10.1109/EDTC.1996.494157 1996 254 1996
European Design and Test Conference (ED&TC '96)
"Automatic test generation for maximal diagnosis of linear analog circuits", Mir S.,
Lubaszewski M., Kolarik V., Courtois B., 10.1109/EDTC.1996.494157 1996 254-258 IEEE
Comput. Soc. Press, Los Alamitos, CA, USA 1996 European Design and Test Conference
(ED&TC '96)
"Built-in self-test approaches for analogue and mixed-signal integrated circuits", Mir
S., Lubaszewski M., Liberali V., Courtois B., 1996 1145-50 vol.2 IEEE, New York, NY,
USA 38th-Midwest-Symposium-on-Circuits-and-Systems.-Proceedings
"Thermal Monitoring Of Safety-Critical Integrated Systems", Szekely V., Rencz M.,
Karam J.M., Lubaszewski M., Courtois B., 10.1109/ATS.1996.555172 1996 282 Fifth
Asian Test Symposium (ATS'96)
"Thermal
monitoring
of
memories",
Szekely
10.1109/MTDT.1996.782497 1996 86 IEEE International
Technology, Design and Testing (MTDT '96)
V.,
Courtois
B.,
Workshop on Memory
"Test structure for thermal monitoring", Szekely V., Kohari Z., Marta C., Rencz M.,
Courtois B., 10.1109/ICMTS.1996.535630 1996 111-115 IEEE, New York, NY, USA
ICMTS-1996.-1996-IEEE-International-Conference-on-Microelectronic-Test-Structures-Proceedings
"Thermal transient testing [IC packaging]", Szekely V., Rencz M., Courtois B., 1996
18-23
Microelectron.
Soc,
Reston,
VA,
USA
1996-International-Symposium-on-Microelectronics-SPIE-Vol.2920.
"Microgrippers realized by LIGA techniques", Ballandras S., Daniau W., Basrour S.,
Robert D., Rocher S., Robert L., Blind P., Roulliay M., Bernede P., Megtert S., Liu Z.W.,
Labeque A., Rousseaux F., Ravet M.F., Hauden D., 10.1109/ETFA.1995.496667 1995
271-4 INRIA/IEEE Symposium on Emerging Technologies and Factory Automation.
ETFA'95. 10-13 Oct. IEEE INRIA/IEEE Symposium on Emerging Technologies and
Factory Automation. ETFA'95. 10-13 Oct.
"Built-in self-test approaches for analogue and mixed-signal integrated circuits",
Courtois B., Liberali V., Lubaszewski M., Mir S., 10.1109/MWSCAS.1995.510298 1995
1145-50 38th-Midwest-Symposium-on-Circuits-and-Systems.-Proceedings- IEEE, New
York, NY, USA 38th-Midwest-Symposium-on-Circuits-and-Systems.-Proceedings"On-line and off-line testing: from digital to analog, from circuits to boards", Courtois
B., Lubaszewski M., 1995 34-37 Editions Frontieres, Gif sur Yvette, France
ESSCIRC-'95.-Twenty-First-European-Solid-State-Circuits-Conference.-Proceedings
"Frequency-based BIST for analog circuit testing", Khaled S., Kaminska B., Courtois
B., Lubaszewski M., 10.1109/VTEST.1995.512617 1995 54 - 59 IEEE Comput. Soc.
Press, Los Alamitos, CA, USA Proceedings-13th-IEEE-VLSI-Test-Symposium"Mixed-signal circuits and boards for high safety applications", Lubaszewski M.,
Kolarik V., Mir S., Nielsen C., Courtois B., 10.1109/EDTC.1995.470 1995 34 European
Design and Test Conference (ED&TC '95) IEEE Computer Society European Design and
Test Conference (ED&TC '95)
"A general CAD concept and design framework architecture for integrated
microsystems", Poppe A., Karam J.M., Hofmann K., Rencz M., Courtois B., Glesner M.,
Szekely V., 1995 259-66 Comput. Mech. Publications, Southampton, UK
Simulation-and-Design-of-Microsystems-and-Microstructures
"Built-in self-test and fault diagnosis of fully differential analogue circuits", Courtois
B., Kolarik V., Lubaszewski M., Mir S., Nielsen C., 1994 486-90 Proceedings of 1994 IEEE
International Conference on Computer Aided Design (CAD-94). 6-10 Nov. 1994 ACM,
New York, NY, USA Proceedings of 1994 IEEE International Conference on Computer
Aided Design (CAD-94). 6-10 Nov. 1994
"MPC services available worldwide", Courtois B., 10.1109/APCCAS.1994.514561 1994
266
275
IEEE,
New
York,
NY,
USA
APCCAS-'94.-1994-IEEE-Asia-Pacific-Conference-on-Circuits-and-Systems
"Designing self-exercising analogue checkers", Kolarik V., Lubaszewski M., Courtois
B., 10.1109/VTEST.1994.292304 1994 252-7 IEEE Comput. Soc. Press, Los Alamitos,
CA, USA Proceedings-12th-IEEE-VLSI-Test-Symposium-
"Built-in self-test and fault diagnosis of fully differential analogue circuits", Mir S.,
Kolarik V., Lubaszewski M., Nielsen C., Courtois B., 1994 486-90 ACM, New York, NY,
USA
1994-IEEE/ACM-International-Conference-on-Computer-Aided-Design.-Digest-of-Technical-Papers-IE
"Checking signatures on boundary scan boards", Castro-Alves V., Courtois B.,
Lubaszewski
M.,
Nicolaidis
M.,
10.1109/ETC.1993.246573
1993
339-48
Proceedings-of-ETC-93.-Third-European-Test-Conference-Cat.-No.93TH0494-5
IEEE
Comput.
Soc.
Press,
Los
Alamitos,
CA,
USA
Proceedings-of-ETC-93.-Third-European-Test-Conference-Cat.-No.93TH0494-5
"Towards self-checking mixed-signal integrated circuits", Kolarik V., Lubaszewski M.,
Courtois B., 1993 202-5 Editions Frontieres, Gif sur Yvette, France
ESSCIRC-93.-Nineteenth-European-Solid-State-Circuits-Conference
"Checking signatures on boundary scan boards", Lubaszewski M., Castro-Alves V.,
Nicolaidis M., Courtois B., 1993 339-48 IEEE Comput. Soc. Press, Los Alamitos, CA, USA
Proceedings-of-ETC-93.-Third-European-Test-Conference
"Reliable fail-safe systems", Lubaszewski M., Courtois B., 1993 32-7 IEEE Comput.
Soc. Press, Los Alamitos, CA, USA Proceedings-of-the-Second-Asian-Test-Symposium-
"Quiescent current monitoring to improve the reliability of electronic systems in
space radiation environments", Vargas F., Nicolaidis M., Courtois B.,
10.1109/ICCD.1993.393307 1993 596-600 IEEE Comput. Soc. Press, Los Alamitos, CA,
USA
Proceedings-1993-IEEE-International-Conference-on-Computer-Design:-VLSI-in-Computers-and-Proc
"Testing embedded single and multi-port RAMs using BIST and boundary scan",
Castro-Alves V., Lubaszewski M., Nicolaidis M., Courtois B., 10.1109/EDAC.1992.205914
1992
159-63
Proceedings.-The-European-Conference-on-Design-Automation-Cat.-No.92TH0414-3
IEEE
Comput.
Soc.
Press,
Los
Alamitos,
CA,
USA
Proceedings.-The-European-Conference-on-Design-Automation-Cat.-No.92TH0414-3
"Testing embedded single and multi-port RAMs using BIST and boundary scan",
Castro-Alves V., Lubaszewski M., Nicolaidis M., Courtois B., 10.1109/EDAC.1992.205914
1992
159-63
IEEE
Comput.
Soc.
Press,
Los
Alamitos,
CA,
USA
Proceedings.-The-European-Conference-on-Design-Automation
"Generation of vector patterns through reseeding of multiple-polynomial linear
feedback shift registers", Hellebrand S., Tarnick S., Rajski J., Courtois B., 1992 120-9
Int. Test Conference, Altoona, PA, USA Proceedings-International-Test-Conference-1992"On the design of self-checking boundary scannable boards", Lubaszewski M.,
Courtois B., 10.1109/54.386006 1992 372-81 Int. Test Conference, Altoona, PA, USA
Proceedings-International-Test-Conference-1992
"Built-in self-test in multi-port RAMs", Castro-Alves V., Nicolaidis M., Lestrat P.,
Courtois
B.,
10.1109/ICCAD.1991.185244
1991
248-51
1991-IEEE-International-Conference-on-Computer-Aided-Design.-Digest-of-Technical-Papers-91CH30
IEEE
Comput.
Soc.
Press,
Los
Alamitos,
CA,
USA
1991-IEEE-International-Conference-on-Computer-Aided-Design.-Digest-of-Technical-Papers-91CH30
"Built-in self-test in multi-port RAMs", Castro-Alves V., Nicolaidis M., Lestrat P.,
Courtois B., 1991 248-51 IEEE Comput. Soc. Press, Los Alamitos, CA, USA
1991-IEEE-International-Conference-on-Computer-Aided-Design.-Digest-of-Technical
"Coupling electron-beam probing with knowledge-based fault localization", Marzouki
M., Laurent J., Courtois B., 1991 238-47 Int. Test Conference, Altoona, PA, USA
Proceedings.-International-Test-Conference-1991-IEEE
"NAUTILE: a safe environment for silicon compilation", Bondono P., Jerraya A.A.,
Hornik A., Courtois B., Bonifas D., 1990 SESSION: Physical design optimization, Pages:
605 - 609 IEEE Computer Society Press Los Alamitos, CA, USA European Design
Automation Conference Proceedings of the conference on European design automation
"Description of a safe programming microprocessing unit for railway signalling",
Chaumontet G., Nicolaidis M., Guyot A., Castro-Alves V., Courtois B., Gruere Y., Trousson
D.,
1990
509-13
CNET,
Lannion,
France
7th-International-Conference-on-Reliability-and-Maintainability.-Proceedings.
"Robust tests for stuck-open faults and design for testability of reconvergent
fan-out CMOS logic networks", Darlay F., Courtois B., 1990 344-9 IEEE Comput. Soc.
Press,
Washington,
DC,
USA
EDAC.-Proceedings-of-the-European-Design-Automation-Conference.
"Study of hydrogen configurations by infrared spectroscopy, effusion and nuclear
analysis in A-Si/sub x/Ge/sub y/H/sub z/ alloys", Basrour S., Bruyere J.C., Bustarret E.,
Godet
C.,
Stoquert
J.P.,
Sardin
G.,
1989
1010-12
Commission-of-the-European-Communities.-Ninth-E.C.-Photovoltaic-Solar-Energy-Conference.-Proce
Kluwer
Commission-of-the-European-Communities.-Ninth-E.C.-Photovoltaic-Solar-Energy-Conference.-Proce
"A generalized theory of fail-safe systems", Courtois B., Nicolaidis M., Noraz S., 1989
398-406
FTCS-19-Digest-of-Papers.-The-Nineteenth-International-Symposium-on-Fault-Tolerant-Computing-C
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
FTCS-19-Digest-of-Papers.-The-Nineteenth-International-Symposium-on-Fault-Tolerant-Computing-C
"Test and design for testability of reconvergent fan-out CMOS logic networks",
Darlay F., Courtois B., 10.1109/TEST.1989.82406 1989 956 IEEE Comput. Soc. Press,
Washington,
DC,
USA
International-Test-Conference-1989.-Proceedings.-Meeting-the-Tests-of-Time-
"Architecture experimentation with the behavioural silicon compiler SYCO", Jerraya
A.A., Courtois B., 10.1109/MELCON.1989.50041 1989 296-302 IEEE, New York, NY, USA
MELECON-'89:-Mediterranean-Electrotechnical-Conference-Proceedings.-Integrating-Research,-Indu
"Debugging integrated circuits: AI can help", Marzouki M., Courtois B.,
10.1109/ETC.1989.36242
1989
184-91
Proceedings-of-the-1st-European-Test-Conference-IEEE-Cat.-No.89CH2696-3
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
Proceedings-of-the-1st-European-Test-Conference-IEEE-Cat.-No.89CH2696-3
"ADVICE project: final balance and future perspectives", Melgara M., Whyte I., Vernay
Y.J., Boland F., Courtois B., 1989 89-99 Kluwer Academic Publishers, Dordrecht,
Netherlands ESPRIT-'89.-Proceedings-of-the-6th-Annual-ESPRIT-Conference
"A generalized theory of fail-safe systems", Nicolaidis M., Noraz S., Courtois B.,
10.1109/FTCS.1989.105602
1989
398-406
FTCS-19-Digest-of-Papers.-The-Nineteenth-International-Symposium-on-Fault-Tolerant-Computing-C
1989:
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
FTCS-19-Digest-of-Papers.-The-Nineteenth-International-Symposium-on-Fault-Tolerant-Computing-C
1989:
"VLSI implementation for control of critical systems", Noraz S., Nicolaidis M., Courtois
B.,
1989
53-8
Safety-of-Computer-Control-Systems-1989-SAFECOMP'89-Proceedings-of-the-IFAC/IFIP-Workshop.
Pergamon,
Oxford,
UK
Safety-of-Computer-Control-Systems-1989-SAFECOMP'89-Proceedings-of-the-IFAC/IFIP-Workshop.
"VLSI implementation for control of critical systems", Noraz S., Nicolaidis M., Courtois
B.,
1989
53-8
Pergamon,
Oxford,
UK
Safety-of-Computer-Control-Systems-1989-SAFECOMP'89-Proceedings-of-the-IFAC/IFIP-Workshop.
"Fault simulation and test pattern generation at the multiple-valued switch level",
Caisso
J.-P.,
Courtois
B.,
10.1109/TEST.1988.207785
1988
94-101
International-Test-Conference-1988-Proceedings-New-Frontiers-in-Testing-Cat.-No.88CH2610-4
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
International-Test-Conference-1988-Proceedings-New-Frontiers-in-Testing-Cat.-No.88CH2610-4
"Gap state studies in a-Si/sub 1-x/Ge/sub x/:H alloys", Chahad L., Theye M.L., Basrour
S.,
Bruyere
J.C.,
Godet
C.,
Lloret
A.,
1988
846-50
Eighth-E.C.-Photovoltaic-Solar-Energy-Conference.-Proceedings-of-the-International-Conference-EUR
Kluwer
Eighth-E.C.-Photovoltaic-Solar-Energy-Conference.-Proceedings-of-the-International-Conference-EUR
"Testing integrated circuits from an ergonomic point of view: the expert system
PESTICIDE",
Marzouki
M.,
Laurent
J.,
Courtois
B.,
1988
317-27
ERGO-IA-'88.-Colloque-Europeen-Ergonomie-et-Intelligence-Artificielle.-Actes-ERGO-IA-'88.-Europea
AFCET,
Paris,
France
ERGO-IA-'88.-Colloque-Europeen-Ergonomie-et-Intelligence-Artificielle.-Actes-ERGO-IA-'88.-Europea
"UBIST version of the SYCO's control section compiler", Torki K., Nicolaidis M.,
Jerraya
A.A.,
Courtois
B.,
10.1109/ICCD.1988.25730
1988
392-6
Proceedings-of-the-1988-IEEE-International-Conference-on-Computer-Design:-VLSI-in-Computers-an
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
Proceedings-of-the-1988-IEEE-International-Conference-on-Computer-Design:-VLSI-in-Computers-an
"A history of research in fault tolerant computing at the Grenoble University", David
R.,
Courtois
B.,
Saucier
G.,
1987
337-53
Evolution-of-Fault-Tolerant-Computing.-In-the-Honor-of-William-C.-Carter Springer-Verlag,
Vienna, Austria Evolution-of-Fault-Tolerant-Computing.-In-the-Honor-of-William-C.-Carter
"The SYCO silicon compiler and its environment", Jerraya A.A., Courtois B., 1987
499-526
Design-Systems-for-VLSI-Circuits.-Logic-Synthesis-and-Silicon-Compilation.-Proceedings-of-the-NAT
Martinus
Nijhoff,
Dordrecht,
Netherlands
Design-Systems-for-VLSI-Circuits.-Logic-Synthesis-and-Silicon-Compilation.-Proceedings-of-the-NAT
"Design of a self-checking microprocessor for real-time applications", Osseiran A.,
Bied-Charreton D., Nicolaidis M., Schoellkopf J.-P., Courtois B., Le Trung B., 1987 337-43
Control-in-Transportation-Systems-1986.-Proceedings-of-the-5th-IFAC/IFIP/IFORS-Conference
Pergamon,
Oxford,
UK
Control-in-Transportation-Systems-1986.-Proceedings-of-the-5th-IFAC/IFIP/IFORS-Conference
"Advances in fault modelling and test pattern generation for CMOS", Baschiera D.,
Courtois
B.,
1986
82-5
Proceedings-of-the-IEEE-International-Conference-on-Computer-Design:-VLSI-in-Computers.-ICCD-'8
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
Proceedings-of-the-IEEE-International-Conference-on-Computer-Design:-VLSI-in-Computers.-ICCD-'8
"Towards automatic failure analysis of complex ICs through e-beam testing",
Bergher
L.,
Laurent
J.,
Courtois
B.,
Collin
J.,
1986
465-71
International-Test-Conference-1986-Proceedings.-Testing's-Impact-on-Design-and-Technology-Cat.-N
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
International-Test-Conference-1986-Proceedings.-Testing's-Impact-on-Design-and-Technology-Cat.-N
"Self-checking circuits: from theory to practice", Courtois B., Nicolaidis M., 1986 83-8
Safety-of-Computer-Control-Systems-1986-SAFECOMP-'86.-Trends-in-Safe-Real-Time-Computer-Sy
Pergamon,
Oxford,
UK
Safety-of-Computer-Control-Systems-1986-SAFECOMP-'86.-Trends-in-Safe-Real-Time-Computer-Sy
"Random testing versus deterministic testing of RAMs", Fuentes A., David R.,
Courtois
B.,
1986
266-71
FTCS-Digest-of-Papers.-16th-Annual-International-Symposium-on-Fault-Tolerant-Computing-Systems
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
FTCS-Digest-of-Papers.-16th-Annual-International-Symposium-on-Fault-Tolerant-Computing-Systems
"Electron beam observability and controllability for the debugging of integrated
circuits", Guiguet I., Micollet D., Laurent J., Courtois B., 1986 181-3
ESSCIRC-'86.-Twelfth-European-Solid-State-Circuits-Conference Delft Univ. Technol,
Delft, Netherlands ESSCIRC-'86.-Twelfth-European-Solid-State-Circuits-Conference
"Principles of the SYCO compiler", Jerraya A.A., Varinot P., Jamier R., Courtois B.,
10.1145/318013.318148 1986 715 - 721 ACM IEEE Annual ACM IEEE Design Automation
Conference
"Self-checking circuits: from theory to practice", Nicolaidis M., Courtois B., 1986 83-8
Safety-of-Computer-Control-Systems-1986-SAFECOMP-'86.-Trends-in-Safe-Real-Time-Computer-Sy
Pergamon,
Oxford,
UK
Safety-of-Computer-Control-Systems-1986-SAFECOMP-'86.-Trends-in-Safe-Real-Time-Computer-Sy
"Design of NMOS strongly fault secure circuits using unidirectional errors detecting
codes",
Nicolaidis
M.,
Courtois
B.,
1986
22-7
FTCS-Digest-of-Papers.-16th-Annual-International-Symposium-on-Fault-Tolerant-Computing-Systems
IEEE
Comput.
Soc.
Press,
Washington,
DC,
USA
FTCS-Digest-of-Papers.-16th-Annual-International-Symposium-on-Fault-Tolerant-Computing-Systems
"Are
VLSI
circuits
testable?",
Courtois
B.,
1985
vol.B
;
20-5
Data-Processing:-Opportunities-and-Drawbacks.-Proceedings-of-Convention-Informatique
Convention
Inf,
Paris,
France
Data-Processing:-Opportunities-and-Drawbacks.-Proceedings-of-Convention-Informatique
"Strongly language disjoint checkers", Jansch I., Courtois B., 1985 390-5
Fifteenth-Annual-International-Symposium-on-Fault-Tolerant-Computing-FTCS-15.-Digest-of-Papers.IEEE
Comput.
Soc.
Press,
Silver
Spring,
MD,
USA
Fifteenth-Annual-International-Symposium-on-Fault-Tolerant-Computing-FTCS-15.-Digest-of-Papers."Microarchitecture of the MC68000 and evaluation of a self checking version",
Marchal
P.,
Nicolaidis
M.,
Courtois
B.,
1985
225-86
Microarchitecture-of-VLSI-Computers.-Proceedings-of-the-NATO-Advanced-Study-Institute
Martinus
Nijhoff,
Dordrecht,
Netherlands
Microarchitecture-of-VLSI-Computers.-Proceedings-of-the-NATO-Advanced-Study-Institute
"Methodology for the use of an electron-beam tester of integrated circuits", Courtois
B.,
1984
vol.1
;
217-20
1984-IEEE-International-Symposium-on-Circuits-and-Systems.-Proceedings-Cat.-No.-84CH1993-5.
IEEE,
New
York,
NY,
USA
1984-IEEE-International-Symposium-on-Circuits-and-Systems.-Proceedings-Cat.-No.-84CH1993-5.
"Design of self-checking N-MOS (H-MOS) integrated circuits", Courtois B., Nicolaidis
M.,
1984
13/1-20
AGARD-Conference-Proceedings-No.-361.-Design-for-Tactical-Avionics-Maintainability-AGARD-CP-3
Oct.
AGARD,
Neuilly
sur
Seine,
France
AGARD-Conference-Proceedings-No.-361.-Design-for-Tactical-Avionics-Maintainability-AGARD-CP-3
Oct.
"Test pattern generation with respect to fault modelling", Courtois B., 1984 199-203
Advances-in-Microprocessing-and-Microprogramming.-Tenth-EUROMICRO-Symposium-on-Microproc
Myhrhaug,-B.;
Wilson,-D.-R.
Advances-in-Microprocessing-and-Microprogramming.-Tenth-EUROMICRO-Symposium-on-Microproc
"Advances in test pattern generation for integrated circuits", Courtois B., 1984
3/28-44 Proceedings-of-Automatic-Testing-and-Test-Instrumentation-'84 Network Events,
Buckingham, UK Proceedings-of-Automatic-Testing-and-Test-Instrumentation-'84
"Design of SCD checkers based on analytical fault hypotheses", Jansch I., Courtois
B., 1984 109-12 ESSCIRC-'84.-Tenth-European-Solid-State-Circuits-Conference CEP
Consultants,
Edinburgh,
UK
ESSCIRC-'84.-Tenth-European-Solid-State-Circuits-Conference
"Design of self-checking N-MOS (H-MOS) integrated circuits", Nicolaidis M., Courtois
B.,
1984
13/1-20
AGARD-Conference-Proceedings-No.-361.-Design-for-Tactical-Avionics-Maintainability-AGARD-CP-3
AGARD,
Neuilly
sur
Seine,
France
AGARD-Conference-Proceedings-No.-361.-Design-for-Tactical-Avionics-Maintainability-AGARD-CP-3
"Strongly code disjoint checkers", Nicolaidis M., Jansch I., Courtois B., 1984 16-21
Fourteenth-International-Conference-on-Fault-Tolerant-Computing.-Digest-of-Papers-Cat.-No.-84CH2
IEEE
Comput.
Soc.
Press,
Silver
Spring,
MD,
USA
Fourteenth-International-Conference-on-Fault-Tolerant-Computing.-Digest-of-Papers-Cat.-No.-84CH2
"Functional testing vs. structural testing of RAMS", Sahami H., Courtois B., 1984
391-403
Fault-Tolerant-Computing-Systems.-2nd-GI/NTG/GMR-Conference.
Springer-Verlag,
Berlin,
West
Germany
Fault-Tolerant-Computing-Systems.-2nd-GI/NTG/GMR-Conference.
"Testing for failure analysis: new tools and new test methods", Baille G., Bergher L.,
Courtois
B.,
Laurent
J.,
Rubat-Du-Merac
C.,
1983
266-9
FTCS-13th-Annual-International-Symposium.-Fault-Tolerant-Computing.-Digest-of-Papers
IEEE,
New
York,
NY,
USA
FTCS-13th-Annual-International-Symposium.-Fault-Tolerant-Computing.-Digest-of-Papers
"Error confinement/data recovery in distributed systems", Ben-Romdhane M.,
Courtois
B.,
1982
11-18
Proceedings-of-the-Second-Symposium-on-Reliability-in-Distributed-Software-and-Database-Systems
IEEE,
New
York,
NY,
USA
Proceedings-of-the-Second-Symposium-on-Reliability-in-Distributed-Software-and-Database-Systems
"Performance modeling of partially self-checking systems", Courtois B., 1982 140-46
FTCS-12th-Annual-International-Symposium-on-Fault-Tolerant-Computing.-Digest-of-Papers
IEEE,
New
York,
NY,
USA
FTCS-12th-Annual-International-Symposium-on-Fault-Tolerant-Computing.-Digest-of-Papers
"On detecting the hardware failures disrupting programs in microprocessors",
Marchal
P.,
Courtois
B.,
1982
249-56
FTCS-12th-Annual-International-Symposium-on-Fault-Tolerant-Computing.-Digest-of-Papers
IEEE,
New
York,
NY,
USA
FTCS-12th-Annual-International-Symposium-on-Fault-Tolerant-Computing.-Digest-of-Papers
"A methodology for on-line testing of microprocessors", Courtois B., 1981 272-4
FTCS-11.-The-Eleventh-Annual-International-Symposium-on-Fault-Tolerant-Computing.
1981:
IEEE,
New
York,
NY,
USA
FTCS-11.-The-Eleventh-Annual-International-Symposium-on-Fault-Tolerant-Computing.
1981:
"Analytical testing of data processing sections of integrated CPUs", Courtois B.,
1981 21-8 1981-International-Test-Conference.-Testing-in-the-1980's IEEE, New York,
NY, USA 1981-International-Test-Conference.-Testing-in-the-1980's
"Failure mechanisms, fault hypotheses and analytical testing of LSI-NMOS (HMOS)
circuits",
Courtois
B.,
1981
341-50
VLSI-81.-Very-Large-Scale-Integration.-Proceedings-of-the-First-International-Conference-on-Very-La
Academic
Press,
London,
UK
VLSI-81.-Very-Large-Scale-Integration.-Proceedings-of-the-First-International-Conference-on-Very-La
"A light efficient and microprocessor-oriented ATE", Courtois B., Postigo C., Geay F.,
Girard
J.-M.,
Meinguss
A.,
1981
7/42-53
vol.7
Automatic-Testing-81-&-Test-Instrumentation
Network,
Buckingham,
UK
Automatic-Testing-81-&-Test-Instrumentation
"On-line oriented functional testing of control sections of integrated CPUs", Courtois
B.,
1981
221-31
Implementing-Functions:-Microprocessors-and-Firmware.-Seventh-EUROMICRO-Symposium-on-Micr
North-Holland,
Amsterdam,
Netherlands
Implementing-Functions:-Microprocessors-and-Firmware.-Seventh-EUROMICRO-Symposium-on-Micr
"Optimal frequencies for concurrent and periodical tests of logical systems",
Courtois
B.,
1980
460-6
Second-International-Conference-on-Reliability-and-Maintainability Centre de Fiabilite
CNET,
Lannion,
France
Second-International-Conference-on-Reliability-and-Maintainability
"Project of an architecture for the command of an electronic switching system",
Anceau F., Courtois B., Marinescu M., Olaiwan A., Pons J.-F., Lecerf C., 1979 608-14
International-Switching-Symposium. 1979: Colloque International de la Communication,
Paris, France International-Switching-Symposium. 1979:
"Some results about the efficiency of simple mechanisms for the detection of
microcomputer
malfunctions",
Courtois
B.,
1979
71-4
Ninth-Annual-International-Symposium-on-Fault-Tolerant-Computing. 1979: IEEE, New
York, NY, USA Ninth-Annual-International-Symposium-on-Fault-Tolerant-Computing.
1979:
"On balancing safety and reliability of hybrid and `Bi-duplexed' systems", Courtois
B., 1976 52-7 1976-International-Symposium-on-Fault-Tolerant-Computing IEEE, New
York, NY, USA 1976-International-Symposium-on-Fault-Tolerant-Computing
"Microprogramming as a means of evaluation of a computer's performance and
reliability",
Courtois
B.,
Saucier
G.,
1975
53-61
Workshop-on-the-Microarchitecture-of-Computer-Systems North-Holland, Amsterdam,
Netherlands Workshop-on-the-Microarchitecture-of-Computer-Systems
Communications à des congrès, symposium
"Wireless sensor network node with asynchronous architecture and vibration
harvesting micro power generator", Ammar Y., A. B., Marzencki M., Charlot B., Basrour
S., Matou K., Renaudin M., 2005 287-292 The Smart Objects and Ambient Intelligence
Conference (SoC-EUSAI'05), October 12-14 Imatec Diffusion
"Design and fabrication of a new system for vibration energy harvesting", Despesse
G., Jager T., Chaillout J.J., Leger J.M., Basrour S., 10.1109/RME.2005.1543034 2005 225
- 228 vol.1 Research in Microelectronics and Electronics, 2005 PhD IEEE
"Piezoelectric micro-machined ultrasonic transducer (pMUT) for energy harvesting",
Dogheche K., Cavallier B., Delobelle P., Hirsinger L., Ballandras S., Cattan E., Rémiens
D., Marzencki M., Charlot B., Basrour S., 2005 939 - 942 Ultrasonics Symposium, 18-21
Sept. IEEE
"A MEMS piezoelectric vibration energy harvesting device", Marzencki M., Basrour S.,
Charlot B., Spirkovich S., Colin M., 2005 45 # 48 Fifth Int. Workshop on Micro and
Nanotechnology for Power Generation and Energy Conversion Applications
(PowerMEMS'05), , November 28-30 MSI
"Thermo-Mechanical Characterization and Integrity Checking of Packages and
Movable-Structures", Szabo P., G. P., G.Y. B., G.Y. H., Ress S., Poppe A., Szekely V.,
Rencz M., Courtois B., 2005 331 - 334 : Vol.3 Technical Proceedings of the 2005
Nanotechnology Conference and Trade Show, Volume 3 NSTI
"CMP: the access to advanced low cost manufacturing", Torki K., Courtois B., 2001 6
Proceedings 2001 International Conference on Microelectronic Systems Education.
MSE'01. Designing Microsystems in the New Millennium, 17-18 June6 IEEE
Séminaires, workshops
"Thermal modelling of multiple die packages", Szabo P., Rencz M., Szekely V., Poppe
A., Farkas G., Courtois B., 10.1109/EPTC.2005.1614459 2005 Volume: 2, On page(s): 5
pp.- Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
IEEE
Chapitres dans les ouvrages
"Dépôts en phase liquide : application aux microtechniques", Basrour S., 2004
91-120 Hermès Techniques de fabrication des microsystèmes 1 : structures et
microsystèmes électromécaniques en couches minces
"From Microelectronics to Integrated Microsystems Testing", Mir S., Charlot B., 2003
241-263 Hermes Penton Science Microsystems Technology # Fabrication, test and
reliability
"Microbobines pour MAGMAS", Basrour S., 2002 Vol.1 Hermès Micro-actionneurs
électromagnétiques MAGMAS
"Les technologies de fabrication des microsystèmes", Charlot B., 2002 chapitre 3:
69-100 Hermès Science, 220 p. Conception de microsystèmes sur silicium
"Les domaines d'application des microsystèmes", Charlot B., 2002 39-68 : chapitre 2
Hermès Science Conception de microsystèmes sur silicium (Traité EGEM, série
Electronique et micro-électronique)
"La CAO des microsystèmes", Charlot B., Martinez S., Mir S., 2002 129-176 : chapitre 5
Hermès Science, 220 p. Conception de microsystèmes sur silicium
"Perspectives des microsystèmes sur silicium", Mir S., Charlot B., 2002 199-214 :
chapitre 6 Hermès Science, 218 p. Dispositifs et physique des microsystèmes sur silicium
"Les microsystèmes thermiques", Mir S., Charlot B., Parrain F., 2002 chapitre 2: 65-104
Hermès Science, 218p. Dispositifs et physique des microsystèmes sur silicium (Traité
EGEM, série Electronique et micro-électronique)
"Micro-accéléromètre intégré 3 axes", Jeannot J.C., Schropfer G., Goy J., Courtois B.,
De Labachelerie M., 2000 Vol. 1 N°1 Hermès Science Microcapteurs et microsystèmes
intégrés (NMT, Nano et Micro Technologies)
"Models for the control of the test and of the reconfiguration of a computer",
Courtois
B.,
1979
vol.V.
:
410-8
Wiley,
Chichester,
UK
Progress-in-cybernetics-and-systems-research,
Livres et ouvrages
"Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP
2004), 12-14 May 2004, Montreux, Switzerland: Special Issue, Analog Integrated
Circuits and Signal Processing", Courtois B., 2005 Volume 44, Number 2, 107-183
Springer Science+Business Media B.V., Formerly Kluwer Academic Publishers B.V.
"Proceedings of Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS (DTIP 2005), Montreux,Switzerland, June 1-3, 2005", Courtois B.,
Markus K., 2005 422 pages TIMA Laboratory
"Proceedings on 11th International Workshop on THERMAL INVESTIGATIONS of
ICs and Systems (THERMINIC 2005), 27 - 30 September 2005, Belgirate, Lake
Maggiore, Italy", Courtois B., Lasance C., Rencz M., Szekely V., 2005 305 pages TIMA
EDITIONS, 46 avenue Félix Viallet, 38031 Grenoble Cedex
"Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP
2003), 5-7 May 2003, Mandelieu-La Napoule, "Côte d'Azur", France: Special issue,
Microsystem Technologies", Courtois B., Michel B., 10.1007/s00542-004-0419-y 2004
Volume 10, Number 5, 345-437 Springer-Verlag GmbH
"Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP
2003), 5-7 May 2003 - Mandelieu-La Napoule, "Côte d'Azur", France: Special issue,
Analog Integrated Circuits and Signal Processing", Courtois B., Korvink J., 2004
Volume 40, Number 2, 185 pages Publisher: Springer Science+Business Media B.V.,
Formerly Kluwer Academic Publishers B.V.
"Proceedings on Symposium on Design, Test, Integration, and Packaging of
MEMS/MOEMS (DTIP'04), Montreux, Switzerland, May 12-14, 2004", Courtois B.,
Markus K., 2004 487 pages TIMA Laboratory
"Proceedings on 10th International Workshop on THERMAL INVESTIGATIONS of
ICs and Systems (THERMINIC 2004), 29 September - 1 October 2004, Sophia
Antipolis, Côte d'Azur, France", Courtois B., Lasance C., Rencz M., Szekely V., 2004
335 pages TIMA Laboratory
"Proceedings on Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS (DTIP'03), Cannes, France, May 5-7, 2003", Courtois B., Markus K.,
2003 412 pages TIMA Laboratory
"Proceedings on 9th International Workshop on THERMAL INVESTIGATIONS of ICs
and Systems (THERMINIC 2003), 24-26 September 2003, Aix-en-Provence, France",
Courtois B., Lasance C., Rencz M., Szekely V., 2003 341 pages TIMA Laboratory
"Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP
2001), 25-27 April 2001-Cannes-Mandelieu, "Côte d'Azur", France: Special Issue,
Analog Integrated Circuits and Signal Processing", Courtois B., 2002 Volume 32,
Number 1, 101 pages Publisher: Springer Science+Business Media B.V., Formerly Kluwer
Academic Publishers B.V.
"Proceedings on Symposium on Design, Test, Integration, and Packaging of
MEMS/MOEMS (DTIP'02), Cannes-Mandelieu, France, May 5-8, 2002", Courtois B.,
Markus K., 2002 830 pages TIMA Laboratory
"Proceedings on 8th International Workshop on THERMal INvestigations of ICs and
Systems (THERMINIC 2002), 1-4 October 2002, Madrid, Spain", Courtois B., Lasance
C., Rencz M., Szekely V., 2002 321 pages TIMA Laboratory
"Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP
2000), Paris, France, 9-11 May 2000: Special Issue, Analog Integrated Circuits and
Signal Processing", Courtois B., 2001 Volume 29, Numbers 1-2, 158 pages Springer
Science+Business Media B.V., Formerly Kluwer Academic Publishers B.V.
"Proceedings on Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS (DTIP'2001), Cannes - Mandelieu, France, April 25-27, 2001", Courtois
B., Markus K., 2001 556 pages TIMA Laboratory
"Proceedings on 7th International Workshop on THERMal INvestigations of ICs and
Systems (THERMINIC 2001), September 24-27, 2001, Paris, France", Courtois B.,
Lasance C., Rencz M., Szekely V., 2001 299 pages TIMA Laboratory
"Proceedings on Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS (DTIP of MEMS/MOEMS ), Paris, France, 9-11 May 2000", Courtois B.,
Markus K., 2000 594 pages TIMA Laboratory
"Proceedings on 6th International Workshop on THERMal INvestigations of ICs and
Systems (THERMINIC 2000), September 24-27, 2000, Budapest, Hungary", Courtois
B., Rencz M., Szekely V., Lasance C., Poppe A., 2000 275 pages TIMA Laboratory
"5th International Workshop on THERMAL INVESTIGATIONS of ICs and
MICROSTRUCTURES (THERMINIC 1999), October 3-6, 1999, ROME, Italy: Special
Issue, Microelectronics Journal", Rencz M., Courtois B., Lasance C., Szekely V., 2000
Volume 31, Issues 9-10, 725-824 Elsevier
"Proceedings of Symposium on Design, Test, Integration and Packaging of
MEMS/MOEMS (DTIP 2005), Paris,France, 30 March-1st April 1999", Courtois B.,
Markus K., 1999 1189 pages TIMA Laboratory
"Proceedings on 5th International Workshop on THERMAL INVESTIGATIONS of ICs
and MICROSTRUCTURES (THERMINIC 1999) October 3-6, 1999,ROME, Italy",
Courtois B., Rencz M., Szekely V., Lasance C., 1999 370 pages Tima Laboratory
"4th International Workshop on THERMAL INVESTIGATIONS of ICs and
MICROSTRUCTURES (THERMINIC 1998) September 27-29,Cannes, "Côte d'Azur",
France: Special Issue, Microelectronics Journal", Rencz M., Szekely V., Courtois B.,
1999 Volume 30, Issue 11 , November, 1083-1172 Elsevier
"3rd International Workshop on THERMAL INVESTIGATIONS of ICs and
MICROSTRUCTURES (THERMINIC 1997), September 21-23, Cannes, "Côte d'Azur",
France: , Volume", Courtois B., Szekely V., Rencz M., 1998 Issues 1-2 , November, 157
p. Elsevier
"3rd International Workshop on THERMAL INVESTIGATIONS of ICs and
MICROSTRUCTURES (THERMINIC 1997), September 21-23, Cannes, "Côte d'Azur",
France: Special Issue, Microelectronics Journal", Szekely V., Rencz M., Courtois B.,
1998 Issues 4-5, April-May, 159-297 Elsevier
"2nd International Workshop onTHERMAL INVESTIGATIONS of ICs and
MICROSTRUCTURES (THERMINIC 1996), September 25-27,Budapest Hungary:
Special Issue, IEEE Transactions on VLSI Systems", Szekely V., Courtois B., Rencz
M., 1997 Vol. 5, N° 3, Sept., 250-343 IEEE
"International Workshop on Thermal Investigations of ICs and Microstructures
(THERMINIC 1996) September 25-27, 1996, Budapest, Hungary: Special Issue of
Microelectronics Journal", Szekely V., Rencz M., Courtois B., 1997 Volume 28, Issue 3 ,
March, 205-365 Elsevier
"International Workshop on Thermal Investigations of ICs and Microstructures
(THERMINIC 1995) September 25-26, 1995, Grenoble, France: Special Issue, Sensors
and Actuators A: Physical", Szekely V., Rencz M., Courtois B., 1996 Issue 1 , 15 July,
1-70 Elsevier
Brevets
"Test device for a combinatorial logic circuit and integrated circuit including such a
device", Courtois B., Baschiera D., EP0229433 1988-12-06
Thèses
"Modélisation de fautes et
microsystèmes", Charlot B.,
conception
en
vue
du
test
structurel
des
"Test et LSI", Courtois B.,
"Etude d'un calculateur tolérant des pannes, ses fiabilité, sécurité, performance et
coût", Courtois B.,
Autres
"Micro-convertisseur d'énergie mécano-électrique", Hirsinger L., S. B., Basrour S.,
Emmanuel F., Bethillier M., De Labachelerie M., Marzencki M., 2004

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