Thunderbolt™ Port - Rapid Electronics
Transcription
Thunderbolt™ Port - Rapid Electronics
Thunderbolt™ Port ESD & Overcurrent Protection Solution Products CDDFN10-0524P Objective Compliance Thunderbolt™ is an interface for connecting peripheral devices to a computer via an expansion bus. Thunderbolt™ is a 10 Gbps dual-channel, dual-protocol (PCI Express and DisplayPort), bidirectional port. This solution provides ESD and overcurrent protection to this hot-pluggable interface. IEC 61000-4-2 Level 4 (8 kV / 15 kV) Solution CDSOD323-T05SC MF-MSMF260-2 1 TVS Diode Array: CDDFN10-0524P 1 TVS Diode: CDSOD323-T05SC 1 Multifuse® PPTC Resettable Fuse: MF-MSMF260-2 VBUS D0P D0N Thunderbolt™ Interface D1P D1N GND Design Kit Alternate Recommendations A model CDMSP10-0504M may be used and would replace both the CDDFN10-0524P and the CDSOD323-T05SC devices. Other PortNote® Solutions: • HDMI 1.4 - ESD & Overcurrent Protection • DisplayPort 1.2 – ESD & Overcurrent Protection • USB 3.0 - ESD & Overcurrent Protection Benefit This solution provides ESD protection without impairing the Thunderbolt™ signal. MF-MSMF260-2 CDSOD323-T05SC CDDFN10-0524P VDD D0P D0N Thunderbolt™ Controller D1P D1N GND The schematic above illustrates the application protection and does not constitute the complete circuit design. Customers should verify actual device performance in their specific applications. PN-DESIGNKIT-33 Americas: Tel +1-951 781-5500 Fax +1-951 781-5700 Europe: Tel +41-(0)41 768 55 55 Asia-Pacific: Tel +886-2 256 241 17 Fax +41-(0)41 768 55 10 Fax +886-2 256 241 16 COPYRIGHT© 2012 • BOURNS, INC. • 6/12 • e/CPK1145 • “PortNote” is a registered service mark of Bourns, Inc. “Bourns” and “Multifuse” are registered trademarks of Bourns, Inc. in the U.S. and other countries. “Thunderbolt” is a trademark of Intel Corporation in the U.S. and/or other countries. Bourns® PortNote® solutions provide protection recommendations for typical port threats. For more information, go to: www.bourns.com or email: [email protected] PL IA NT CO M *R oH S Features Applications ■ RoHS compliant* ■ HDMI 1.4 ■ Low capacitance - 0.5 pF ■ Digital Visual Interface (DVI) ■ ESD protection >15 kV ■ USB 3.0 / USB OTG ■ Memory protection ■ SIM card ports CDDFN10-0524P - Surface Mount TVS Diode Array General Information The CDDFN10-0524P device provides ESD, EFT and Surge protection for highspeed data ports meeting IEC 61000-4-2 (ESD) requirements. The Transient Voltage Suppressor array, protecting up to 4 data lines, offers a Working Peak Reverse Voltage of 5 V and Minimum Breakdown Voltage of 6 V. Pin 1 Pin 2 Pin 4 Pin 5 The DFN10 packaged device will mount directly onto the industry standard DFN10 footprint. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle with standard pick and place equipment and their flat configuration minimizes roll away. Pins 3, 8 Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Peak Pulse Power (tp = 8/20 μS) Peak Pulse Current (tp = 8/20 μS) Operating Voltage (I/O pin - GND) Storage Temperature Operating Temperature Symbol Ppp Ipp VDC TSTG TOPR CDDFN10-0524P 30 3.8 6 -55 to +150 -55 to +85 Unit W A V ºC ºC Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Breakdown Voltage @ 1 mA Reverse Standoff Voltage Forward Voltage If =15 mA (Gnd to I/O Pin) Channel Leakage Current VRWM = 5 V, (I/O Pin to Gnd) Clamping Voltage IEC 61000-4-2 +6 kV, Contact mode (I/O Pin to Gnd) Channel Input Capacitance Vpin3,8=0 V, Vin=2.5 V, f=1 MHZ (I/O Pin to Gnd) Channel to Channel Input Capacitance Vpin3,8=0 V, Vin=2.5 V, f=1 MHZ (Between I/O pins) ESD Protection per IEC 6-1000-4-2 Contact Discharge Air Discharge ESD Dynamic Turn-on Resistance (any I/O Pin to Gnd) EFT Protection per IEC 61000-4-4 @ 5/50 ns Surge Protection per IEC 61000-4-5 @ 8/20 μs Symbol VBR VRWM Min. 6 VF Typ. 0.9 ID Max. 5 Unit V V 1.1 V 1.5 μA VC 12 CIN 0.5 0.65 pF CCROSS 0.04 0.08 pF 10 15 kV 8 15 Rdynamic V Ω 0.3 40 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. A 3.8 A CDDFN10-0524P - Surface Mount TVS Diode Array Product Dimensions Recommended Footprint This is a molded DFN10 package with lead free 100 % Matte sn on the lead frame. It weighs approximately 7 mg and has a flammability rating of UL 94V-0. PIN 1 MARKING 0.4 (.016) 0.2 (.008) 1.000 ± 0.050 (.039 ± .002) 1.55 (.061) 0.20 (.008) 0.875 (.034) 2.500 ± 0.050 (.098 ± .002) 0.675 (.027) 0.400 ± 0.050 (.016 ± .002) 0.500 BSC (.020) 0.50 (.020) PIN 1 IDENTIFICATION CHAMFER 0.100 X 45 ° (.039) 1.00 (.039) Typical Part Marking 0.100 R (.039) TYP. CDDFN10-0524P ........................................................................524 1.950 (.077) REF. 0.400 ± 0.050 (.016 ± .002) 0.05 (.002) How to Order 0.250 ± 0.050 (.008 ± .002) CD DFN10 - 05 24 P Common Diode Chip Diode 0.200 ± 0.050 (.008 ± .002) Package DFN10 = DFN-10 Package Working Peak Reverse Voltage 05 = 5 VRWM (Volts) 0.50 - 0.60 (0.020 - 0.024) Number of Lines 24 = 2 Ground / 4 Data Lines Suffix P = Ultra-low Capacitance 0.152 (.006) REF. 0.000 - 0.050 (.000 - .002) DIMENSIONS: MM (INCHES) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDDFN10-0524P - Surface Mount TVS Diode Array Rating & Characteristic Curves Typical Variation of CIO-to-IO vs VIN 1.0 0.10 0.9 0.09 0.8 0.08 Input Capacitance (pF) Input Capacitance (pF) Typical Variation CIN vs VIN 0.7 0.6 0.5 0.4 0.3 0.2 0.06 0.05 0.04 0.03 0.02 f = 1 MHz, T = 25 °C 0.1 0.07 f = 1 MHz, T = 25 °C 0.01 0.0 0.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 Input Voltage (V) 2.5 3.0 3.5 4.0 Analog Cross Talk 0 20 -3 10 -6 -9 -12 -15 -18 -21 -24 3 GHz: -0.92 dB 4.3 GHz: -3 dB -27 -30 Analog Cross Talk (dB) Insertion Loss (dB) Insertion Loss S21 (I/O-to-GND) 1e+8 2.0 Input Voltage (V) 0 -10 -20 -30 -40 -50 -60 -70 -80 1e+9 1e+8 Frequency (Hz) 1e+9 Frequency (Hz) Transmission Line Pulsing (TLP) Data Lines Connection Transmission Line Pulsing (TLP) Current (A) I/O 1 To I/O-Port Connector 18 data line I/O 1 data line I/O 2 To Protected IC 16 V_pulse 14 Line-1 Pulse from a transmission line 12 10 Line-2 TLP_V 8 1 10 NC 2 9 3 8 4 7 NC 5 6 NC TLP_I + 100 ns - GND NC GND 6 Line-3 4 I/O to GND 2 Line-4 0 0 2 4 6 8 10 12 14 Transmission Line Pulsing (TLP) Voltage (V) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. I/O 3 data line I/O 3 To I/O-Port I/O 4 Connector data line I/O 4 To Protected IC CDDFN10-0524P - Surface Mount TVS Diode Array Packaging Information The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-A standard. P 0 P 1 d T E Index Hole Pin 1 Location 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... Leader ....... ....... ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) MM (INCHES) 10 pitches (min.) Direction of Feed Item Symbol DFN-10 Carrier Width A 1.45 ± 0.05 (0.057 ± 0.002) Carrier Length B 2.95 ± 0.05 (0.116 ± 0.002) Carrier Depth C 0.90 ± 0.05 (0.035 ± 0.002) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 50.0 MIN. (1.969) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 Quantity per Reel -- Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com 14.4 MAX. (0.567) 3000 REV. 08/17/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. T PL IA N M CO ** Ro HS Features Applications ■ Lead free as standard* ■ Computer notebooks ■ ESD protection 30 kV max. ■ Cellular phones ■ Surge protection >24 A ■ Personal Digital Assistants (PDAs) ■ Protects 1 line ■ Digital cameras ■ Uni/bidirectional configuration CDSOD323-TxxSC - TVS Diode Series General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. UNIDIRECTIONAL 1 BIDIRECTIONAL 1 Bourns offers Transient Voltage Suppressor Diodes for surge and ESD protection applications in SOD323 package size format. The Transient Voltage Suppressor series offers a choice of voltage types ranging from 3 V to 36 V in a unidirectional or bidirectional configuration. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns® device meets IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. 2 2 Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Value Unit Unidirectional Peak Pulse Power (tp = 8/20 µs) PPP 500 W Bidirectional Peak Pulse Power (tp = 8/20 µs) PPP 400 W TL -55 to +150 ºC TSTG -55 to +150 ºC ESD ±8 ±30 ±15 ±30 Operating Temperature Storage Temperature ESD Protection (per IEC 61000-4-2) Contact - Min. Contact - Max. Air - Min. Air - Max. kV CDSOD323Symbol UniT03S BiT03SC UniT05S BiT05SC UniT08S BiT08SC UniT12S BiT12SC Unit Min. Breakdown Voltage @ 1 mA VBR 4.0 4.0 6.0 6.0 8.5 8.5 13.3 13.3 V Working Peak Voltage VM 3.3 3.3 5.0 5.0 8.0 8.0 12.0 12.0 V Maximum Clamping Voltage @ IP = 1 A VF 7.0 8.0 9.8 9.8 13.4 13.4 19.0 19.0 V Typical Clamping Voltage @ 8/20 µs @ IPP VC 10.9 V @ 43 A 10.9 V @ 43 A 13.5 V @ 42 A 14.5 V @ 28 A 16.9 V @ 34 A 18.5 V @ 17 A 25.9 V @ 21 A 29.5 V @ 14 A V Maximum Leakage Current @ VWM ID 125 125 10 10 10 10 1 1 µA Typical Capacitance @ 0 V, 1 MHz CP 500 200 350 175 250 150 150 50 pF Parameter Notes: 1. Part numbers with suffix “C” indicate bidirectional device, i.e. CDSOD323-T05SC. 2. For bidirectional devices only, the electrical specifications apply in both directions. *No lead detected in standard tests of homogeneous materials. **RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDSOD323-TxxSC - TVS Diode Series Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) CDSOD323Symbol UniT15S BiT15SC UniT18S BiT18SC UniT24S BiT24SC UniT36S BiT36SC Unit Min. Breakdown Voltage @ 1 mA VBR 16.7 16.7 20.0 20.0 26.7 26.7 40.0 40.0 V Working Peak Voltage VM 15.0 15.0 18.0 18.0 24.0 24.0 36.0 36.0 V Maximum Clamping Voltage @ IP = 1 A VF 24.0 24.0 29.0 29.0 43.0 43.0 60.0 60.0 V Typical Clamping Voltage @ 8/20 µs @ IPP VC 30.0 V @ 17 A 33.0 V @ 12 A 40.0 V @9A 40.0 V @9A 49.0 V @ 12 A 46.2 V @9A 75.0 V @5A 75.0 V @5A V Maximum Leakage Current @ VWM ID Typical Capacitance @ 0 V, 1 MHz CP Parameter 1 100 40 90 40 µA 88 40 75 35 pF Notes: 1. Part numbers with suffix “C” indicate bidirectional device, i.e. CDSOD323-T05SC. 2. For bidirectional devices only, the electrical specifications apply in both directions. Performance Graphs Peak Pulse Power vs. Pulse Time Pulse Waveform 120 500 W, 8/20 µs Waveform 1,000 100 400 W, 8/20 µs Waveform IPP – Peak Pulse Current (% of IPP) PPP – Peak Pulse Current (W) 10,000 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 80 et 60 40 td = t|IPP/2 20 0 10 0.1 1 10 100 1,000 10,000 0 5 10 Block Diagram 15 20 25 30 t – Time (µs) td – Pulse Duration (µs) How to Order UNIDIRECTIONAL 1 BIDIRECTIONAL 1 CD SOD323 - T 05 SC Common Code Chip Diode Package • SOD323 = SOD-323 Package Model T = Transient Voltage Suppressor Working Peak Reverse Voltage 05 = 5 VRWM (Volts) 2 2 Suffix S = Standard Capacitance Unidirectional Diode SC = Standard Capacitance Bidirectional Diode Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDSOD323-TxxSC - TVS Diode Series Product Dimensions Recommended Footprint This is a molded JEDEC SOD-323 package with lead free 100 % Sn plating on the terminations. It weighs approximately 30 mg and has a flammability rating of UL 94V-0. C A A E B B C D Dimensions (Nominal) F D H A 0.80 (0.031) B 0.80 (0.031) Dimensions A 1.60 - 1.90 (0.063 - 0.075) C 1.40 (0.055) B 1.15 - 1.45 (0.045 - 0.057) D 0.80 (0.031) C 2.39 - 2.70 (0.094 - 0.106) D 0.92 - 1.10 (0.036 - 0.043) E 0.25 - 0.40 (0.010 - 0.016) F 0.10 - 0.20 (0.004 - 0.008) H 0.10 MAX. (0.004) ......... DIMENSIONS: MM (INCHES) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. DIMENSIONS: MM (INCHES) Typical Part Marking Each device has device marking outlined below and the unidirectional devices have an additional Polarity Band indicating the cathode. CDSOD323-T03S ........................................................................... A CDSOD323-T03SC ........................................................................G CDSOD323-T05S ........................................................................... B CDSOD323-T05SC ........................................................................ H CDSOD323-T08S ........................................................................... C CDSOD323-T08SC .........................................................................J CDSOD323-T12S ........................................................................... D CDSOD323-T12SC ........................................................................ K CDSOD323-T15S ........................................................................... E CDSOD323-T15SC .........................................................................L CDSOD323-T18S ...........................................................................O CDSOD323-T18SC ........................................................................ N CDSOD323-T24S ........................................................................... F CDSOD323-T24SC ....................................................................... M CDSOD323-T36S ........................................................................... R CDSOD323-T36SC ........................................................................ T CDSOD323-TxxSC - TVS Diode Series Packaging Information The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard. P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer C Device Leader ....... ....... ....... ....... ....... ....... ....... ....... End W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol SOD-323 Carrier Width A 1.55 ± 0.10 (0.061 ± 0.004) Carrier Length B 2.90 ± 0.10 (0.114 ± 0.004) Carrier Depth C 1.35 ± 0.10 (0.053 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 80.0 ... Min. (3.150) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 13.5 . Max. (0.531) Quantity per Reel MM (INCHES) -- 3,000 Devices are packed in accordance with EIA standard RS-481-A. REV. 09/11 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. *R & oHS AE C C OM AP P PR LI OV AN ED T Features ■ Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications ■ 100 % electrically compatible with all previous generations of 1812 SMT devices ■ Compatible with Pb and Pb-free solder reflow profiles ■ RoHS compliant* and halogen free** ■ Surface mount packaging for automated assembly ■ Agency recognition: ■ Standard 4532 mm (1812 mils) footprint ■ Patents pending MF-MSMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 V max. Volts I max. Amps 60.0 60.0 30.0 60.0 30.0 15.0 13.2 24.0 6.0 16.0 24.0 6.0 6.0 24.0 8.0 8.0 16.0 6.0 40 40 80 40 10 100 100 40 100 100 20 100 100 20 100 40 100 100 Itrip Amperes at 23 °C Hold Trip 0.10 0.30 0.14 0.34 0.20 0.40 0.20 0.40 0.30 0.60 0.50 1.00 0.75 1.50 0.75 1.50 1.10 2.20 1.10 2.20 1.10 2.20 1.25 2.50 1.50 3.00 1.50 3.00 1.60 2.80 2.00 4.00 2.50 5.00 2.60 5.20 Resistance Ohms at 23 °C RMin. R1Max. 0.70 15.00 0.40 6.50 0.40 6.00 0.40 6.00 0.30 3.00 0.15 1.00 0.11 0.45 0.11 0.45 0.04 0.21 0.04 0.21 0.06 0.18 0.035 0.14 0.03 0.120 0.03 0.120 0.035 0.099 0.020 0.080 0.015 0.100 0.015 0.080 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 0.5 1.5 6.0 1.5 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 1.50 0.15 0.06 0.15 0.10 0.15 0.20 0.20 0.30 0.30 0.50 0.40 0.5 1.50 2.0 3.0 5.0 5.0 Tripped Power Dissipation Watts at 23 °C Typ. 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 1.0 0.8 0.8 1.2 0.8 Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change Condition A Test Procedures And Requirements For Model MF-MSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number .................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number .................................................. CA110338 http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000 TÜV Certificate Number ....................................... R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Applications ■ Overcurrent and overtemperature ■ Point-of-sale (POS) equipment protection of automotive electronics ■ Hard disk drives ■ PC motherboards ■ PC peripherals ■ PCMCIA cards ■ USB port protection - USB 2.0, 3.0 & OTG ■ HDMI 1.4 Source protection MF-MSMF Series - PTC Resettable Fuses Product Dimensions (see next page for outline drawings) Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 A Min. 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) B Max. 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) Min. 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) C Max. 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) Packaging: MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel. MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel. MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel. Min. 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.55 (0.015) 0.55 (0.015) 0.55 (0.015) 0.45 (0.018) 0.45 (0.018) 0.70 (0.028) 0.55 (0.015) 0.55 (0.015) 0.70 (0.028) 0.55 (0.015) 0.55 (0.015) 0.70 (0.028) 0.48 (0.019) Max. 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) DIMENSIONS: Style 1 1 1 1 1 1 1 1 1 1 2 1 1 2 1 1 2 1 MM (INCHES) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. MF-MSMF Series - PTC Resettable Fuses Product Dimensions (see previous page for dimensions) Style 1 Top and Bottom View A Side View Recommended Pad Layout C 1.5 ± 0.05 (.059 ± .002) Terminal material: Electroless Ni under immersion Au 1.5 ± 0.05 (.059 ± .002) Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. 3.2 ± 0.1 (0.126 ± .004) B Recommended Storage: 40 °C max./70 % RH max. 2.7 ± 0.1 (.106 ± .004) D Style 2 Top View Bottom View Side View A Recommended Pad Layout C 8 C 2.95 ± 0.10 (.114 ± .004) B 1.68 ± 0.05 (.066 ± .002) D 3.1 ± 0.10 (.122 ± .004) Typical Time to Trip at 23 ˚C 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-MSMF010 MF-MSMF200 10 Time to Trip (Seconds) MF-MSMF030 1 MF-MSMF260 0.1 MF-MSMF160 MF-MSMF150 MF-MSMF125 0.01 MF-MSMF110 MF-MSMF075 MF-MSMF014 MF-MSMF020 MF-MSMF075/24 0.001 MF-MSMF110/16 MF-MSMF050 0.1 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. MF-MSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 -40 ˚C 0.16 0.23 0.29 0.29 0.44 0.77 1.15 1.15 1.59 1.59 2.00 1.80 2.17 2.10 2.30 3.08 3.90 4.00 -20 ˚C 0.14 0.19 0.26 0.26 0.39 0.68 1.01 1.01 1.43 1.43 1.70 1.63 1.95 1.90 2.20 2.71 3.42 3.52 Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 0.10 0.08 0.07 0.14 0.12 0.10 0.20 0.17 0.15 0.20 0.17 0.15 0.30 0.26 0.23 0.50 0.44 0.40 0.75 0.65 0.60 0.75 0.65 0.60 1.10 0.95 0.87 1.10 0.95 0.87 1.10 0.95 0.88 1.25 1.08 0.99 1.50 1.30 1.18 1.50 1.25 1.13 1.60 1.45 1.30 2.00 1.80 1.60 2.50 2.24 1.98 2.60 2.34 2.08 0 ˚C 0.12 0.17 0.23 0.23 0.35 0.59 0.88 0.88 1.26 1.26 1.40 1.43 1.72 1.70 1.90 2.35 2.96 3.06 60 ˚C 0.06 0.09 0.14 0.14 0.21 0.37 0.55 0.55 0.80 0.80 0.80 0.91 1.09 1.00 1.15 1.50 1.85 1.95 70 ˚C 0.05 0.08 0.12 0.12 0.18 0.33 0.49 0.49 0.71 0.71 0.73 0.81 0.97 0.88 1.03 1.40 1.29 1.39 85 ˚C 0.03 0.06 0.10 0.10 0.15 0.29 0.43 0.43 0.60 0.60 0.61 0.68 0.82 0.69 0.91 1.25 0.94 1.04 Solder Reflow Recommendations Preheating 300 Soldering Cooling Notes: Temperature (°C) 250 200 • MF-MSMF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 150 100 • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC product soldering recommendation guidelines. 50 0 160–220 10–20 120 Time (seconds) How to Order MF - MSMF 075/24 - 2 Typical Part Marking Represents total content. Layout may vary. Multifuse Product Designator Series MSMF = 4532 mm (1812 mils) Surface Mount Component Hold Current, Ihold 010-260 (0.10 Amps - 2.60 Amps) Higher Voltage Option __ = Standard Voltage /16 = 16 Volt Rated /24 = 24 Volt Rated /60 = 60 Volt Rated X= Multifuse® freeXpansion Design™ MF-MSMF Series Packaging Packaged per EIA 481-1 -2 = Tape and Reel 115Y ® BI-WEEKLY DATE CODE: WEEKS 49-50 = Y YEAR CODE: 5 = 2005 PART IDENTIFICATION EXAMPLES: MF-MSMF050 = 50 MF-MSMF075 = 75 MF-MSMF110 = 11 MF-MSMF150 = 15 8 C PART IDENTIFICATION EXAMPLES: MF-MSMF110/24X = 6 MF-MSMF150/24X = 8 MF-MSMF250/16X = C BI-WEEKLY DATE CODE: WEEKS 5-6 = C MF-MSMF SERIES, REV. AD, 02/13 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. MF-MSMF Series Tape and Reel Specifications Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. MF-MSMF010 MF-MSMF030 per EIA-481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.58 ± 0.10 (0.141 ± 0.004) 4.93 ± 0.10 (0.194 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 1.30 ± 0.10 (0.051 ± 0.004) 390 (15.35) 160 (6.30) MF-MSMF050 MF-MSMF260 per EIA 481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.66 ± 0.15 (0.144 ± 0.006) 4.98 ± 0.10 (0.196 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.95 ± 0.10 (0.037 ± 0.004) 390 (15.35) 160 (6.30) MF-MSMF-110/24X MF-MSMF150/24X MF-MSMF250/16X per EIA 481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.70 ± 0.10 (0.146 ± 0.004) 5.10 ± 0.10 (0.200 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 1.50 ± 0.10 (0.059 ± 0.004) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) Reel Dimensions A max. N min. W1 W2 max. DIMENSIONS: P0 T D0 P2 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. W1(MEASURED AT HUB)