Thunderbolt™ Port - Rapid Electronics

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Thunderbolt™ Port - Rapid Electronics
Thunderbolt™ Port
ESD & Overcurrent Protection
Solution Products
CDDFN10-0524P
Objective
Compliance
Thunderbolt™ is an interface for connecting
peripheral devices to a computer via an
expansion bus. Thunderbolt™ is a 10 Gbps
dual-channel, dual-protocol (PCI Express
and DisplayPort), bidirectional port. This
solution provides ESD and overcurrent
protection to this hot-pluggable interface.
IEC 61000-4-2 Level 4 (8 kV / 15 kV)
Solution
CDSOD323-T05SC
MF-MSMF260-2
1 TVS Diode Array: CDDFN10-0524P
1 TVS Diode: CDSOD323-T05SC
1 Multifuse® PPTC Resettable Fuse:
MF-MSMF260-2
VBUS
D0P
D0N
Thunderbolt™
Interface
D1P
D1N
GND
Design Kit
Alternate Recommendations
A model CDMSP10-0504M may be used and
would replace both the CDDFN10-0524P and the
CDSOD323-T05SC devices.
Other PortNote® Solutions:
• HDMI 1.4 - ESD & Overcurrent Protection
• DisplayPort 1.2 – ESD & Overcurrent Protection
• USB 3.0 - ESD & Overcurrent Protection
Benefit
This solution provides ESD protection without
impairing the Thunderbolt™ signal.
MF-MSMF260-2
CDSOD323-T05SC
CDDFN10-0524P
VDD
D0P
D0N
Thunderbolt™
Controller
D1P
D1N
GND
The schematic above illustrates the application protection and does not constitute the complete circuit design.
Customers should verify actual device performance in their specific applications.
PN-DESIGNKIT-33
Americas: Tel +1-951 781-5500
Fax +1-951 781-5700
Europe: Tel +41-(0)41 768 55 55 Asia-Pacific: Tel +886-2 256 241 17
Fax +41-(0)41 768 55 10 Fax +886-2 256 241 16
COPYRIGHT© 2012 • BOURNS, INC. • 6/12 • e/CPK1145 • “PortNote” is a registered service mark of Bourns, Inc.
“Bourns” and “Multifuse” are registered trademarks of Bourns, Inc. in the U.S. and other countries.
“Thunderbolt” is a trademark of Intel Corporation in the U.S. and/or other countries.
Bourns® PortNote® solutions provide protection
recommendations for typical port threats.
For more information, go to:
www.bourns.com
or email: [email protected]
PL
IA
NT
CO
M
*R
oH
S
Features
Applications
■ RoHS compliant*
■ HDMI 1.4
■ Low capacitance - 0.5 pF
■ Digital Visual Interface (DVI)
■ ESD protection >15 kV
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
CDDFN10-0524P - Surface Mount TVS Diode Array
General Information
The CDDFN10-0524P device provides ESD, EFT and Surge protection for highspeed data ports meeting IEC 61000-4-2 (ESD) requirements. The Transient Voltage
Suppressor array, protecting up to 4 data lines, offers a Working Peak Reverse Voltage
of 5 V and Minimum Breakdown Voltage of 6 V.
Pin
1
Pin
2
Pin
4
Pin
5
The DFN10 packaged device will mount directly onto the industry standard DFN10
footprint. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle with
standard pick and place equipment and their flat configuration minimizes roll away.
Pins
3, 8
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Power (tp = 8/20 μS)
Peak Pulse Current (tp = 8/20 μS)
Operating Voltage (I/O pin - GND)
Storage Temperature
Operating Temperature
Symbol
Ppp
Ipp
VDC
TSTG
TOPR
CDDFN10-0524P
30
3.8
6
-55 to +150
-55 to +85
Unit
W
A
V
ºC
ºC
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Breakdown Voltage @ 1 mA
Reverse Standoff Voltage
Forward Voltage If =15 mA
(Gnd to I/O Pin)
Channel Leakage Current
VRWM = 5 V, (I/O Pin to Gnd)
Clamping Voltage
IEC 61000-4-2 +6 kV,
Contact mode (I/O Pin to Gnd)
Channel Input Capacitance
Vpin3,8=0 V, Vin=2.5 V, f=1 MHZ
(I/O Pin to Gnd)
Channel to Channel Input Capacitance
Vpin3,8=0 V, Vin=2.5 V, f=1 MHZ
(Between I/O pins)
ESD Protection per IEC 6-1000-4-2
Contact Discharge
Air Discharge
ESD Dynamic Turn-on Resistance
(any I/O Pin to Gnd)
EFT Protection per IEC 61000-4-4
@ 5/50 ns
Surge Protection per IEC 61000-4-5
@ 8/20 μs
Symbol
VBR
VRWM
Min.
6
VF
Typ.
0.9
ID
Max.
5
Unit
V
V
1.1
V
1.5
μA
VC
12
CIN
0.5
0.65
pF
CCROSS
0.04
0.08
pF
10
15
kV
8
15
Rdynamic
V
Ω
0.3
40
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
A
3.8
A
CDDFN10-0524P - Surface Mount TVS Diode Array
Product Dimensions
Recommended Footprint
This is a molded DFN10 package with lead free 100 % Matte sn on
the lead frame. It weighs approximately 7 mg and has a flammability
rating of UL 94V-0.
PIN 1
MARKING
0.4
(.016)
0.2
(.008)
1.000 ± 0.050
(.039 ± .002)
1.55
(.061)
0.20
(.008)
0.875
(.034)
2.500 ± 0.050
(.098 ± .002)
0.675
(.027)
0.400 ± 0.050
(.016 ± .002)
0.500
BSC
(.020)
0.50
(.020)
PIN 1
IDENTIFICATION
CHAMFER
0.100
X 45 °
(.039)
1.00
(.039)
Typical Part Marking
0.100
R
(.039)
TYP.
CDDFN10-0524P ........................................................................524
1.950
(.077)
REF.
0.400 ± 0.050
(.016 ± .002)
0.05
(.002)
How to Order
0.250 ± 0.050
(.008 ± .002)
CD DFN10 - 05 24 P
Common Diode
Chip Diode
0.200 ± 0.050
(.008 ± .002)
Package
DFN10 = DFN-10 Package
Working Peak Reverse Voltage
05 = 5 VRWM (Volts)
0.50 - 0.60
(0.020 - 0.024)
Number of Lines
24 = 2 Ground / 4 Data Lines
Suffix
P = Ultra-low Capacitance
0.152
(.006)
REF.
0.000 - 0.050
(.000 - .002)
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDDFN10-0524P - Surface Mount TVS Diode Array
Rating & Characteristic Curves
Typical Variation of CIO-to-IO vs VIN
1.0
0.10
0.9
0.09
0.8
0.08
Input Capacitance (pF)
Input Capacitance (pF)
Typical Variation CIN vs VIN
0.7
0.6
0.5
0.4
0.3
0.2
0.06
0.05
0.04
0.03
0.02
f = 1 MHz,
T = 25 °C
0.1
0.07
f = 1 MHz,
T = 25 °C
0.01
0.0
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
Input Voltage (V)
2.5
3.0
3.5
4.0
Analog Cross Talk
0
20
-3
10
-6
-9
-12
-15
-18
-21
-24
3 GHz: -0.92 dB
4.3 GHz: -3 dB
-27
-30
Analog Cross Talk (dB)
Insertion Loss (dB)
Insertion Loss S21 (I/O-to-GND)
1e+8
2.0
Input Voltage (V)
0
-10
-20
-30
-40
-50
-60
-70
-80
1e+9
1e+8
Frequency (Hz)
1e+9
Frequency (Hz)
Transmission Line Pulsing (TLP)
Data Lines Connection
Transmission Line Pulsing (TLP) Current (A)
I/O 1
To
I/O-Port
Connector
18
data line
I/O 1
data line
I/O 2
To
Protected
IC
16
V_pulse
14
Line-1
Pulse from a
transmission line
12
10
Line-2
TLP_V
8
1
10 NC
2
9
3
8
4
7
NC
5
6
NC
TLP_I
+
100 ns
-
GND
NC
GND
6
Line-3
4
I/O to GND
2
Line-4
0
0
2
4
6
8
10
12
14
Transmission Line Pulsing (TLP) Voltage (V)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
I/O 3
data line
I/O 3
To
I/O-Port
I/O 4
Connector
data line
I/O 4
To
Protected
IC
CDDFN10-0524P - Surface Mount TVS Diode Array
Packaging Information
The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-A standard.
P
0
P
1
d
T
E
Index Hole
Pin 1
Location
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
Leader
.......
.......
.......
.......
W1
Start
DIMENSIONS:
10 pitches (min.)
MM
(INCHES)
10 pitches (min.)
Direction of Feed
Item
Symbol
DFN-10
Carrier Width
A
1.45 ± 0.05
(0.057 ± 0.002)
Carrier Length
B
2.95 ± 0.05
(0.116 ± 0.002)
Carrier Depth
C
0.90 ± 0.05
(0.035 ± 0.002)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
50.0
MIN.
(1.969)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
Quantity per Reel
--
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
14.4
MAX.
(0.567)
3000
REV. 08/17/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
T
PL
IA
N
M
CO
**
Ro
HS
Features
Applications
■ Lead free as standard*
■ Computer notebooks
■ ESD protection 30 kV max.
■ Cellular phones
■ Surge protection >24 A
■ Personal Digital Assistants (PDAs)
■ Protects 1 line
■ Digital cameras
■ Uni/bidirectional configuration
CDSOD323-TxxSC - TVS Diode Series
General Information
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
UNIDIRECTIONAL
1
BIDIRECTIONAL
1
Bourns offers Transient Voltage Suppressor Diodes for surge and ESD protection
applications in SOD323 package size format. The Transient Voltage Suppressor series
offers a choice of voltage types ranging from 3 V to 36 V in a unidirectional or
bidirectional configuration.
Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard
pick and place equipment and their flat configuration minimizes roll away. The Bourns®
device meets IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge)
requirements.
2
2
Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Value
Unit
Unidirectional Peak Pulse Power (tp = 8/20 µs)
PPP
500
W
Bidirectional Peak Pulse Power (tp = 8/20 µs)
PPP
400
W
TL
-55 to +150
ºC
TSTG
-55 to +150
ºC
ESD
±8
±30
±15
±30
Operating Temperature
Storage Temperature
ESD Protection (per IEC 61000-4-2)
Contact - Min.
Contact - Max.
Air - Min.
Air - Max.
kV
CDSOD323Symbol
UniT03S
BiT03SC
UniT05S
BiT05SC
UniT08S
BiT08SC
UniT12S
BiT12SC
Unit
Min. Breakdown Voltage @ 1 mA
VBR
4.0
4.0
6.0
6.0
8.5
8.5
13.3
13.3
V
Working Peak Voltage
VM
3.3
3.3
5.0
5.0
8.0
8.0
12.0
12.0
V
Maximum Clamping Voltage @ IP = 1 A
VF
7.0
8.0
9.8
9.8
13.4
13.4
19.0
19.0
V
Typical Clamping Voltage
@ 8/20 µs @ IPP
VC
10.9 V
@ 43 A
10.9 V
@ 43 A
13.5 V
@ 42 A
14.5 V
@ 28 A
16.9 V
@ 34 A
18.5 V
@ 17 A
25.9 V
@ 21 A
29.5 V
@ 14 A
V
Maximum Leakage Current @ VWM
ID
125
125
10
10
10
10
1
1
µA
Typical Capacitance @ 0 V, 1 MHz
CP
500
200
350
175
250
150
150
50
pF
Parameter
Notes:
1. Part numbers with suffix “C” indicate bidirectional device, i.e. CDSOD323-T05SC.
2. For bidirectional devices only, the electrical specifications apply in both directions.
*No lead detected in standard tests of homogeneous materials.
**RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDSOD323-TxxSC - TVS Diode Series
Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
CDSOD323Symbol
UniT15S
BiT15SC
UniT18S
BiT18SC
UniT24S
BiT24SC
UniT36S
BiT36SC
Unit
Min. Breakdown Voltage @ 1 mA
VBR
16.7
16.7
20.0
20.0
26.7
26.7
40.0
40.0
V
Working Peak Voltage
VM
15.0
15.0
18.0
18.0
24.0
24.0
36.0
36.0
V
Maximum Clamping Voltage
@ IP = 1 A
VF
24.0
24.0
29.0
29.0
43.0
43.0
60.0
60.0
V
Typical Clamping Voltage
@ 8/20 µs @ IPP
VC
30.0 V
@ 17 A
33.0 V
@ 12 A
40.0 V
@9A
40.0 V
@9A
49.0 V
@ 12 A
46.2 V
@9A
75.0 V
@5A
75.0 V
@5A
V
Maximum Leakage Current @ VWM
ID
Typical Capacitance @ 0 V, 1 MHz
CP
Parameter
1
100
40
90
40
µA
88
40
75
35
pF
Notes:
1. Part numbers with suffix “C” indicate bidirectional device, i.e. CDSOD323-T05SC.
2. For bidirectional devices only, the electrical specifications apply in both directions.
Performance Graphs
Peak Pulse Power vs. Pulse Time
Pulse Waveform
120
500 W, 8/20 µs Waveform
1,000
100
400 W, 8/20 µs Waveform
IPP – Peak Pulse Current (% of IPP)
PPP – Peak Pulse Current (W)
10,000
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
80
et
60
40
td = t|IPP/2
20
0
10
0.1
1
10
100
1,000
10,000
0
5
10
Block Diagram
15
20
25
30
t – Time (µs)
td – Pulse Duration (µs)
How to Order
UNIDIRECTIONAL
1
BIDIRECTIONAL
1
CD SOD323 - T 05 SC
Common Code
Chip Diode
Package
• SOD323 = SOD-323 Package
Model
T = Transient Voltage Suppressor
Working Peak Reverse Voltage
05 = 5 VRWM (Volts)
2
2
Suffix
S = Standard Capacitance Unidirectional Diode
SC = Standard Capacitance Bidirectional Diode
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CDSOD323-TxxSC - TVS Diode Series
Product Dimensions
Recommended Footprint
This is a molded JEDEC SOD-323 package with lead free 100 %
Sn plating on the terminations. It weighs approximately 30 mg and
has a flammability rating of UL 94V-0.
C
A
A
E
B
B
C
D
Dimensions (Nominal)
F
D
H
A
0.80
(0.031)
B
0.80
(0.031)
Dimensions
A
1.60 - 1.90
(0.063 - 0.075)
C
1.40
(0.055)
B
1.15 - 1.45
(0.045 - 0.057)
D
0.80
(0.031)
C
2.39 - 2.70
(0.094 - 0.106)
D
0.92 - 1.10
(0.036 - 0.043)
E
0.25 - 0.40
(0.010 - 0.016)
F
0.10 - 0.20
(0.004 - 0.008)
H
0.10
MAX.
(0.004) .........
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
DIMENSIONS:
MM
(INCHES)
Typical Part Marking
Each device has device marking outlined below and the
unidirectional devices have an additional Polarity Band indicating
the cathode.
CDSOD323-T03S ........................................................................... A
CDSOD323-T03SC ........................................................................G
CDSOD323-T05S ........................................................................... B
CDSOD323-T05SC ........................................................................ H
CDSOD323-T08S ........................................................................... C
CDSOD323-T08SC .........................................................................J
CDSOD323-T12S ........................................................................... D
CDSOD323-T12SC ........................................................................ K
CDSOD323-T15S ........................................................................... E
CDSOD323-T15SC .........................................................................L
CDSOD323-T18S ...........................................................................O
CDSOD323-T18SC ........................................................................ N
CDSOD323-T24S ........................................................................... F
CDSOD323-T24SC ....................................................................... M
CDSOD323-T36S ........................................................................... R
CDSOD323-T36SC ........................................................................ T
CDSOD323-TxxSC - TVS Diode Series
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
C
Device
Leader
....... .......
....... .......
.......
....... ....... .......
End
W1
Start
DIMENSIONS:
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Item
Symbol
SOD-323
Carrier Width
A
1.55 ± 0.10
(0.061 ± 0.004)
Carrier Length
B
2.90 ± 0.10
(0.114 ± 0.004)
Carrier Depth
C
1.35 ± 0.10
(0.053 ± 0.004)
Sprocket Hole
d
1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
80.0
...
Min.
(3.150)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.10
(0.008 ± 0.004)
Tape Width
W
8.00 ± 0.20
(0.315 ± 0.008)
Reel Width
W1
13.5
.
Max.
(0.531)
Quantity per Reel
MM
(INCHES)
--
3,000
Devices are packed in accordance with EIA standard
RS-481-A.
REV. 09/11
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
*R
& oHS
AE C
C OM
AP P
PR LI
OV AN
ED T
Features
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualification for Passive Components
in Automotive Applications
■ 100 % electrically compatible with all
previous generations of 1812 SMT devices
■ Compatible with Pb and Pb-free solder
reflow profiles
■ RoHS compliant* and halogen free**
■ Surface mount packaging for automated
assembly
■ Agency recognition:
■ Standard 4532 mm (1812 mils) footprint
■ Patents pending
MF-MSMF Series - PTC Resettable Fuses
Electrical Characteristics
Ihold
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
V max.
Volts
I max.
Amps
60.0
60.0
30.0
60.0
30.0
15.0
13.2
24.0
6.0
16.0
24.0
6.0
6.0
24.0
8.0
8.0
16.0
6.0
40
40
80
40
10
100
100
40
100
100
20
100
100
20
100
40
100
100
Itrip
Amperes
at 23 °C
Hold
Trip
0.10
0.30
0.14
0.34
0.20
0.40
0.20
0.40
0.30
0.60
0.50
1.00
0.75
1.50
0.75
1.50
1.10
2.20
1.10
2.20
1.10
2.20
1.25
2.50
1.50
3.00
1.50
3.00
1.60
2.80
2.00
4.00
2.50
5.00
2.60
5.20
Resistance
Ohms
at 23 °C
RMin.
R1Max.
0.70
15.00
0.40
6.50
0.40
6.00
0.40
6.00
0.30
3.00
0.15
1.00
0.11
0.45
0.11
0.45
0.04
0.21
0.04
0.21
0.06
0.18
0.035
0.14
0.03
0.120
0.03
0.120
0.035
0.099
0.020
0.080
0.015
0.100
0.015
0.080
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
0.5
1.5
6.0
1.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.15
0.06
0.15
0.10
0.15
0.20
0.20
0.30
0.30
0.50
0.40
0.5
1.50
2.0
3.0
5.0
5.0
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1.0
0.8
0.8
1.2
0.8
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number .................................................. CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number”
enter 110338-0-000
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Applications
■ Overcurrent and overtemperature
■ Point-of-sale (POS) equipment
protection of automotive electronics
■ Hard disk drives
■ PC motherboards
■ PC peripherals
■ PCMCIA cards
■ USB port protection - USB 2.0, 3.0 & OTG
■ HDMI 1.4 Source protection
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see next page for outline drawings)
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
A
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
B
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.83
(0.190)
4.73
(0.186)
4.73
(0.186)
4.83
(0.190)
4.73
(0.186)
4.73
(0.186)
4.83
(0.190)
4.73
(0.186)
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
C
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
Packaging:
MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel.
MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel.
MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel.
Min.
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
0.45
(0.018)
0.45
(0.018)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.70
(0.028)
0.48
(0.019)
Max.
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
1.60
(0.063)
0.85
(0.033)
0.85
(0.033)
1.60
(0.063)
0.85
(0.033)
0.85
(0.033)
1.60
(0.063)
0.85
(0.033)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
DIMENSIONS:
Style
1
1
1
1
1
1
1
1
1
1
2
1
1
2
1
1
2
1
MM
(INCHES)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see previous page for dimensions)
Style 1
Top and Bottom View
A
Side View
Recommended Pad Layout
C
1.5 ± 0.05
(.059 ± .002)
Terminal material:
Electroless Ni under immersion Au
1.5 ± 0.05
(.059 ± .002)
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
3.2 ± 0.1
(0.126 ± .004)
B
Recommended Storage:
40 °C max./70 % RH max.
2.7 ± 0.1
(.106 ± .004)
D
Style 2
Top View
Bottom View
Side View
A
Recommended Pad Layout
C
8
C
2.95 ± 0.10
(.114 ± .004)
B
1.68 ± 0.05
(.066 ± .002)
D
3.1 ± 0.10
(.122 ± .004)
Typical Time to Trip at 23 ˚C
100
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specific customer applications may differ
from these values due to the influence of
other variables.
MF-MSMF010
MF-MSMF200
10
Time to Trip (Seconds)
MF-MSMF030
1
MF-MSMF260
0.1
MF-MSMF160
MF-MSMF150
MF-MSMF125
0.01
MF-MSMF110
MF-MSMF075
MF-MSMF014
MF-MSMF020
MF-MSMF075/24
0.001
MF-MSMF110/16
MF-MSMF050
0.1
1
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
MF-MSMF Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold (Amps)
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
-40 ˚C
0.16
0.23
0.29
0.29
0.44
0.77
1.15
1.15
1.59
1.59
2.00
1.80
2.17
2.10
2.30
3.08
3.90
4.00
-20 ˚C
0.14
0.19
0.26
0.26
0.39
0.68
1.01
1.01
1.43
1.43
1.70
1.63
1.95
1.90
2.20
2.71
3.42
3.52
Ambient Operating Temperature
23 ˚C
40 ˚C
50 ˚C
0.10
0.08
0.07
0.14
0.12
0.10
0.20
0.17
0.15
0.20
0.17
0.15
0.30
0.26
0.23
0.50
0.44
0.40
0.75
0.65
0.60
0.75
0.65
0.60
1.10
0.95
0.87
1.10
0.95
0.87
1.10
0.95
0.88
1.25
1.08
0.99
1.50
1.30
1.18
1.50
1.25
1.13
1.60
1.45
1.30
2.00
1.80
1.60
2.50
2.24
1.98
2.60
2.34
2.08
0 ˚C
0.12
0.17
0.23
0.23
0.35
0.59
0.88
0.88
1.26
1.26
1.40
1.43
1.72
1.70
1.90
2.35
2.96
3.06
60 ˚C
0.06
0.09
0.14
0.14
0.21
0.37
0.55
0.55
0.80
0.80
0.80
0.91
1.09
1.00
1.15
1.50
1.85
1.95
70 ˚C
0.05
0.08
0.12
0.12
0.18
0.33
0.49
0.49
0.71
0.71
0.73
0.81
0.97
0.88
1.03
1.40
1.29
1.39
85 ˚C
0.03
0.06
0.10
0.10
0.15
0.29
0.43
0.43
0.60
0.60
0.61
0.68
0.82
0.69
0.91
1.25
0.94
1.04
Solder Reflow Recommendations
Preheating
300
Soldering
Cooling
Notes:
Temperature (°C)
250
200
•
MF-MSMF models cannot be wave soldered. Please contact Bourns for
hand soldering recommendations.
•
If reflow temperatures exceed the recommended profile, devices may
not meet the performance requirements.
150
100
•
Compatible with Pb and Pb-free solder reflow profiles.
•
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse® Polymer PTC product soldering
recommendation guidelines.
50
0
160–220
10–20
120
Time (seconds)
How to Order
MF - MSMF 075/24 - 2
Typical Part Marking
Represents total content. Layout may vary.
Multifuse Product
Designator
Series
MSMF = 4532 mm (1812 mils)
Surface Mount Component
Hold Current, Ihold
010-260 (0.10 Amps - 2.60 Amps)
Higher Voltage Option
__ = Standard Voltage
/16 = 16 Volt Rated
/24 = 24 Volt Rated
/60 = 60 Volt Rated
X=
Multifuse® freeXpansion Design™
MF-MSMF Series
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
115Y
®
BI-WEEKLY DATE CODE:
WEEKS 49-50 = Y
YEAR CODE:
5 = 2005
PART IDENTIFICATION EXAMPLES:
MF-MSMF050 = 50
MF-MSMF075 = 75
MF-MSMF110 = 11
MF-MSMF150 = 15
8
C
PART IDENTIFICATION EXAMPLES:
MF-MSMF110/24X = 6
MF-MSMF150/24X = 8
MF-MSMF250/16X = C
BI-WEEKLY DATE CODE:
WEEKS 5-6 = C
MF-MSMF SERIES, REV. AD, 02/13
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual
device performance may vary over time.
MF-MSMF Series Tape and Reel Specifications
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
MF-MSMF010 MF-MSMF030
per EIA-481-1
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.58 ± 0.10
(0.141 ± 0.004)
4.93 ± 0.10
(0.194 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
1.30 ± 0.10
(0.051 ± 0.004)
390
(15.35)
160
(6.30)
MF-MSMF050 MF-MSMF260
per EIA 481-1
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.66 ± 0.15
(0.144 ± 0.006)
4.98 ± 0.10
(0.196 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
0.95 ± 0.10
(0.037 ± 0.004)
390
(15.35)
160
(6.30)
MF-MSMF-110/24X
MF-MSMF150/24X
MF-MSMF250/16X
per EIA 481-1
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.70 ± 0.10
(0.146 ± 0.004)
5.10 ± 0.10
(0.200 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
1.50 ± 0.10
(0.059 ± 0.004)
390
(15.35)
160
(6.30)
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
Reel Dimensions
A max.
N min.
W1
W2 max.
DIMENSIONS:
P0
T
D0
P2
E1
MM
(INCHES)
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
P1
A0
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
W1(MEASURED
AT HUB)

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